DE69625020T2 - Verfahren zum reinigen von nadelkartenprüfspitzen - Google Patents
Verfahren zum reinigen von nadelkartenprüfspitzenInfo
- Publication number
- DE69625020T2 DE69625020T2 DE69625020T DE69625020T DE69625020T2 DE 69625020 T2 DE69625020 T2 DE 69625020T2 DE 69625020 T DE69625020 T DE 69625020T DE 69625020 T DE69625020 T DE 69625020T DE 69625020 T2 DE69625020 T2 DE 69625020T2
- Authority
- DE
- Germany
- Prior art keywords
- cleaning needle
- needle card
- card tips
- tips
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95200989 | 1995-04-19 | ||
PCT/IB1996/000239 WO1996033419A2 (en) | 1995-04-19 | 1996-03-18 | Method of cleaning probe tips of probe cards and apparatus for implementing the method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69625020D1 DE69625020D1 (de) | 2003-01-09 |
DE69625020T2 true DE69625020T2 (de) | 2003-07-24 |
Family
ID=8220202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69625020T Expired - Fee Related DE69625020T2 (de) | 1995-04-19 | 1996-03-18 | Verfahren zum reinigen von nadelkartenprüfspitzen |
Country Status (7)
Country | Link |
---|---|
US (1) | US5814158A (de) |
EP (1) | EP0766829B1 (de) |
JP (1) | JPH10501928A (de) |
CN (1) | CN1111742C (de) |
DE (1) | DE69625020T2 (de) |
TW (1) | TW301017B (de) |
WO (1) | WO1996033419A2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69832010T2 (de) * | 1997-07-24 | 2006-07-13 | Mitsubishi Denki K.K. | Prüfspitze für Halbleiterschaltungen und Verfahren zu ihrer Herstellung |
US5990694A (en) * | 1997-11-06 | 1999-11-23 | Micron Technology, Inc. | Integrated circuit probing method |
JP3429995B2 (ja) * | 1997-11-10 | 2003-07-28 | 東京エレクトロン株式会社 | クリーニング方法 |
US6121058A (en) * | 1998-01-02 | 2000-09-19 | Intel Corporation | Method for removing accumulated solder from probe card probing features |
US6170494B1 (en) * | 1999-11-12 | 2001-01-09 | Advanced Micro Devices, Inc. | Method for automatically cleaning resist nozzle |
US7053646B2 (en) * | 2000-09-15 | 2006-05-30 | Orsillo James F | Apparatus and method for use in testing a semiconductor wafer |
US20040020514A1 (en) * | 2002-07-18 | 2004-02-05 | Orsillo James E. | Probe device cleaner and method |
US6908364B2 (en) * | 2001-08-02 | 2005-06-21 | Kulicke & Soffa Industries, Inc. | Method and apparatus for probe tip cleaning and shaping pad |
US7182672B2 (en) * | 2001-08-02 | 2007-02-27 | Sv Probe Pte. Ltd. | Method of probe tip shaping and cleaning |
US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
US7905471B2 (en) | 2004-11-22 | 2011-03-15 | Electro Scientific Industries, Inc. | Vacuum ring designs for electrical contacting improvement |
FR2924815B1 (fr) * | 2007-12-06 | 2010-02-12 | Ceprim Technologies | Dispositif et procede de nettoyage a ultrasons des pointes de contact des cartes de test de circuits integres ou des cartes de circuits imprimes |
CN101971037A (zh) * | 2008-03-14 | 2011-02-09 | 富士胶片株式会社 | 探针卡 |
US8371316B2 (en) | 2009-12-03 | 2013-02-12 | International Test Solutions, Inc. | Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware |
CN103316865B (zh) * | 2013-06-07 | 2015-05-20 | 深圳市矽电半导体设备有限公司 | 一种半导体测试探针清洗装置及方法 |
CN104384123B (zh) * | 2014-09-24 | 2016-08-17 | 上海华力微电子有限公司 | 一种探针卡清针装置 |
CN108321098A (zh) * | 2017-01-18 | 2018-07-24 | 中芯长电半导体(江阴)有限公司 | 一种用于晶圆测试的探针针尖的清洁液、清洁装置及方法 |
US9825000B1 (en) | 2017-04-24 | 2017-11-21 | International Test Solutions, Inc. | Semiconductor wire bonding machine cleaning device and method |
US11434095B2 (en) | 2018-02-23 | 2022-09-06 | International Test Solutions, Llc | Material and hardware to automatically clean flexible electronic web rolls |
US10792713B1 (en) | 2019-07-02 | 2020-10-06 | International Test Solutions, Inc. | Pick and place machine cleaning system and method |
US11756811B2 (en) | 2019-07-02 | 2023-09-12 | International Test Solutions, Llc | Pick and place machine cleaning system and method |
US11211242B2 (en) | 2019-11-14 | 2021-12-28 | International Test Solutions, Llc | System and method for cleaning contact elements and support hardware using functionalized surface microfeatures |
US11318550B2 (en) | 2019-11-14 | 2022-05-03 | International Test Solutions, Llc | System and method for cleaning wire bonding machines using functionalized surface microfeatures |
US11035898B1 (en) | 2020-05-11 | 2021-06-15 | International Test Solutions, Inc. | Device and method for thermal stabilization of probe elements using a heat conducting wafer |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4314855A (en) * | 1979-12-17 | 1982-02-09 | Bell Telephone Laboratories, Incorporated | Method of cleaning test probes |
US4319923A (en) * | 1979-12-26 | 1982-03-16 | Western Electric Co., Inc. | Recovery of gold and/or palladium from an iodide-iodine etching solution |
US4590422A (en) * | 1981-07-30 | 1986-05-20 | Pacific Western Systems, Inc. | Automatic wafer prober having a probe scrub routine |
US5275184A (en) * | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
JPH0760844B2 (ja) * | 1991-05-15 | 1995-06-28 | 株式会社駒ヶ根電化 | 使用済みプローブカードの再生方法 |
JPH04364746A (ja) * | 1991-06-12 | 1992-12-17 | Tokyo Electron Yamanashi Kk | プローブ装置 |
US5166605A (en) * | 1991-08-02 | 1992-11-24 | General Electric Company | Controlled impedance test fixture for planar electronic device |
-
1996
- 1996-03-18 WO PCT/IB1996/000239 patent/WO1996033419A2/en active IP Right Grant
- 1996-03-18 JP JP8531583A patent/JPH10501928A/ja not_active Ceased
- 1996-03-18 DE DE69625020T patent/DE69625020T2/de not_active Expired - Fee Related
- 1996-03-18 CN CN96190361A patent/CN1111742C/zh not_active Expired - Fee Related
- 1996-03-18 EP EP96904244A patent/EP0766829B1/de not_active Expired - Lifetime
- 1996-04-03 US US08/626,095 patent/US5814158A/en not_active Expired - Fee Related
- 1996-04-08 TW TW085104047A patent/TW301017B/zh active
Also Published As
Publication number | Publication date |
---|---|
DE69625020D1 (de) | 2003-01-09 |
CN1150843A (zh) | 1997-05-28 |
EP0766829A2 (de) | 1997-04-09 |
EP0766829B1 (de) | 2002-11-27 |
CN1111742C (zh) | 2003-06-18 |
JPH10501928A (ja) | 1998-02-17 |
WO1996033419A2 (en) | 1996-10-24 |
TW301017B (de) | 1997-03-21 |
US5814158A (en) | 1998-09-29 |
WO1996033419A3 (en) | 1996-11-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |