KR100343044B1 - 기판처리장치및처리방법 - Google Patents

기판처리장치및처리방법 Download PDF

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Publication number
KR100343044B1
KR100343044B1 KR1019980032726A KR19980032726A KR100343044B1 KR 100343044 B1 KR100343044 B1 KR 100343044B1 KR 1019980032726 A KR1019980032726 A KR 1019980032726A KR 19980032726 A KR19980032726 A KR 19980032726A KR 100343044 B1 KR100343044 B1 KR 100343044B1
Authority
KR
South Korea
Prior art keywords
substrate
chemical treatment
liquid
etching
treatment liquid
Prior art date
Application number
KR1019980032726A
Other languages
English (en)
Korean (ko)
Other versions
KR19990023551A (ko
Inventor
사토시 스즈키
Original Assignee
다이닛뽕스크린 세이조오 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP23243597A external-priority patent/JP3535707B2/ja
Priority claimed from JP23243497A external-priority patent/JP3535706B2/ja
Application filed by 다이닛뽕스크린 세이조오 가부시키가이샤 filed Critical 다이닛뽕스크린 세이조오 가부시키가이샤
Publication of KR19990023551A publication Critical patent/KR19990023551A/ko
Application granted granted Critical
Publication of KR100343044B1 publication Critical patent/KR100343044B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1019980032726A 1997-08-28 1998-08-12 기판처리장치및처리방법 KR100343044B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP23243597A JP3535707B2 (ja) 1997-08-28 1997-08-28 基板処理装置
JP97-232434 1997-08-28
JP97-232435 1997-08-28
JP23243497A JP3535706B2 (ja) 1997-08-28 1997-08-28 基板処理装置

Publications (2)

Publication Number Publication Date
KR19990023551A KR19990023551A (ko) 1999-03-25
KR100343044B1 true KR100343044B1 (ko) 2002-10-25

Family

ID=26530461

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980032726A KR100343044B1 (ko) 1997-08-28 1998-08-12 기판처리장치및처리방법

Country Status (2)

Country Link
KR (1) KR100343044B1 (zh)
TW (1) TW396367B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101084918B1 (ko) * 2008-11-10 2011-11-17 삼성전기주식회사 2중 경사 컨베이어 장치를 갖는 에칭장치

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4421956B2 (ja) * 2003-07-18 2010-02-24 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
KR101033122B1 (ko) * 2004-06-29 2011-05-11 엘지디스플레이 주식회사 액정표시장치의 제조를 위한 기판세정장치
JP4472630B2 (ja) * 2005-12-28 2010-06-02 大日本スクリーン製造株式会社 基板処理装置
KR100978852B1 (ko) * 2008-06-12 2010-08-31 세메스 주식회사 기판 반송 장치 및 그 방법 그리고 그 장치를 갖는 기판제조 설비
CN102373473A (zh) * 2010-08-06 2012-03-14 东友Fine-Chem股份有限公司 一种用于坡面型刻蚀装置的刻蚀组合物及其使用方法
CN104282598A (zh) * 2014-09-23 2015-01-14 安徽省大富光电科技有限公司 蚀刻、显影、清洗以及褪膜设备、喷淋处理设备及方法
KR102433317B1 (ko) * 2017-10-11 2022-08-17 삼성디스플레이 주식회사 습식 식각 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103780A (ja) * 1990-08-21 1992-04-06 Nec Corp エッチング装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103780A (ja) * 1990-08-21 1992-04-06 Nec Corp エッチング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101084918B1 (ko) * 2008-11-10 2011-11-17 삼성전기주식회사 2중 경사 컨베이어 장치를 갖는 에칭장치

Also Published As

Publication number Publication date
KR19990023551A (ko) 1999-03-25
TW396367B (en) 2000-07-01

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