KR100278607B1 - 웨이퍼카세트반송시스템및웨이퍼카세트반송방법 - Google Patents

웨이퍼카세트반송시스템및웨이퍼카세트반송방법 Download PDF

Info

Publication number
KR100278607B1
KR100278607B1 KR1019980008481A KR19980008481A KR100278607B1 KR 100278607 B1 KR100278607 B1 KR 100278607B1 KR 1019980008481 A KR1019980008481 A KR 1019980008481A KR 19980008481 A KR19980008481 A KR 19980008481A KR 100278607 B1 KR100278607 B1 KR 100278607B1
Authority
KR
South Korea
Prior art keywords
wafer cassette
transfer
wafer
process facility
conveying
Prior art date
Application number
KR1019980008481A
Other languages
English (en)
Korean (ko)
Other versions
KR19990074697A (ko
Inventor
김상용
Original Assignee
윤종용
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자주식회사 filed Critical 윤종용
Priority to KR1019980008481A priority Critical patent/KR100278607B1/ko
Priority to TW087117194A priority patent/TW393717B/zh
Priority to CN98122684A priority patent/CN1229051A/zh
Priority to JP11007866A priority patent/JPH11284053A/ja
Publication of KR19990074697A publication Critical patent/KR19990074697A/ko
Application granted granted Critical
Publication of KR100278607B1 publication Critical patent/KR100278607B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1019980008481A 1998-03-13 1998-03-13 웨이퍼카세트반송시스템및웨이퍼카세트반송방법 KR100278607B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019980008481A KR100278607B1 (ko) 1998-03-13 1998-03-13 웨이퍼카세트반송시스템및웨이퍼카세트반송방법
TW087117194A TW393717B (en) 1998-03-13 1998-10-17 Wafer cassette transfer system and method
CN98122684A CN1229051A (zh) 1998-03-13 1998-11-24 晶片盒移送系统及方法
JP11007866A JPH11284053A (ja) 1998-03-13 1999-01-14 ウェハカセット搬送システム及びウェハカセット搬送方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980008481A KR100278607B1 (ko) 1998-03-13 1998-03-13 웨이퍼카세트반송시스템및웨이퍼카세트반송방법

Publications (2)

Publication Number Publication Date
KR19990074697A KR19990074697A (ko) 1999-10-05
KR100278607B1 true KR100278607B1 (ko) 2001-02-01

Family

ID=19534740

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980008481A KR100278607B1 (ko) 1998-03-13 1998-03-13 웨이퍼카세트반송시스템및웨이퍼카세트반송방법

Country Status (4)

Country Link
JP (1) JPH11284053A (zh)
KR (1) KR100278607B1 (zh)
CN (1) CN1229051A (zh)
TW (1) TW393717B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101579505B1 (ko) * 2014-06-17 2015-12-23 피에스케이 주식회사 기판 처리 장치 및 기판 이송 방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100664783B1 (ko) * 1999-12-31 2007-01-04 동부일렉트로닉스 주식회사 반도체 미세 패턴 측정 시스템의 웨이퍼 분류 방법
JP2001230297A (ja) * 2000-02-16 2001-08-24 Sharp Corp 液晶表示装置の搬送方法および搬送システム
KR100500230B1 (ko) * 2000-07-26 2005-07-11 삼성전자주식회사 무인운반 시스템 및 그 제어방법
KR100790817B1 (ko) * 2006-12-06 2008-01-03 삼성전자주식회사 반도체 제조관리 시스템
CN105070011B (zh) * 2015-07-31 2018-07-24 广东嘉腾机器人自动化有限公司 一种agv与机械手的通信系统及其通信方法
CN108987318B (zh) * 2017-05-31 2020-10-16 上海微电子装备(集团)股份有限公司 搬运装置及其搬运方法
CN107963416B (zh) 2017-11-22 2020-04-17 苏州元谋智能机器人系统有限公司 一种机器人及使用该机器人进行物料运送的系统和方法
CN111415879A (zh) * 2019-01-08 2020-07-14 东捷科技股份有限公司 半导体工艺的自动化运作方法
CN109927010B (zh) * 2019-03-20 2020-09-29 江西理工大学南昌校区 一种基于agv的工业机器人
CN111099292B (zh) * 2019-12-18 2021-06-11 南京视莱尔汽车电子有限公司 一种汽车零件生产车间用的搬运机器人及使用方法
CN116968071B (zh) * 2023-09-07 2024-03-08 上海广川科技有限公司 一种用于晶圆传输的防滑装置及机械手指

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260461A (ja) * 1996-03-26 1997-10-03 Canon Inc 半導体製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260461A (ja) * 1996-03-26 1997-10-03 Canon Inc 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101579505B1 (ko) * 2014-06-17 2015-12-23 피에스케이 주식회사 기판 처리 장치 및 기판 이송 방법

Also Published As

Publication number Publication date
JPH11284053A (ja) 1999-10-15
KR19990074697A (ko) 1999-10-05
CN1229051A (zh) 1999-09-22
TW393717B (en) 2000-06-11

Similar Documents

Publication Publication Date Title
KR100278607B1 (ko) 웨이퍼카세트반송시스템및웨이퍼카세트반송방법
US6175777B1 (en) Method for transferring wafer cassettes after checking whether process equipment is in a suitable mode
KR102064485B1 (ko) 자동 반송 시스템의 작업시간 단축을 위한 데이터 통신 방법
CN103703424A (zh) 处理设备(processing facility)
KR20030074139A (ko) 반송시스템
JP2792072B2 (ja) 生産情報転送装置
US7409257B2 (en) System and method for moving substrates in and out of a manufacturing process
KR100286982B1 (ko) 웨이퍼캐리어관련정보인식이가능한자동반송시스템및반송방법
KR100318437B1 (ko) 자동 반송로봇의 병렬제어 시스템 및 방법
KR100245650B1 (ko) 반도체 제조라인의 계측시스템
KR19980026590A (ko) 반도체 제조공장의 물류 시스템
JPH10133706A (ja) ロボット搬送方法
KR101411655B1 (ko) 자동 반송대차 시스템 및 이를 이용한 카세트 반송 방법
JPH09270372A (ja) 半導体製造工程の自動化システム及びその制御方法
JPH11239954A (ja) Nc工作機械加工システム
JP2003099126A (ja) 搬送システムおよび搬送方法
JP4505972B2 (ja) 搬送システム及び搬送方法
KR100321742B1 (ko) 웨이퍼 카세트의 자동 반송 시스템 및 방법
JPS5950533A (ja) 半導体製造管理システム
JPS63202514A (ja) 被処理物の処理装置への割り込み方式
JP3444921B2 (ja) 半導体製造装置
JP2000293232A (ja) 自動搬送システム
JP2000289811A (ja) 自動搬送システム
KR100232845B1 (ko) 운반용 이동로봇의 비정상 출력 방법
JPH07206117A (ja) 搬送制御方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20071001

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee