KR100260118B1 - 기판의 검출장치 및 방법 - Google Patents

기판의 검출장치 및 방법 Download PDF

Info

Publication number
KR100260118B1
KR100260118B1 KR1019930021776A KR930021776A KR100260118B1 KR 100260118 B1 KR100260118 B1 KR 100260118B1 KR 1019930021776 A KR1019930021776 A KR 1019930021776A KR 930021776 A KR930021776 A KR 930021776A KR 100260118 B1 KR100260118 B1 KR 100260118B1
Authority
KR
South Korea
Prior art keywords
light receiving
light emitting
light
optical sensors
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930021776A
Other languages
English (en)
Korean (ko)
Other versions
KR940010257A (ko
Inventor
쇼오리 모쿠오
Original Assignee
다카시마 히로시
도오교오 에레구토론 큐우슈우 가부시키가이샤
히가시 데쓰로
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다카시마 히로시, 도오교오 에레구토론 큐우슈우 가부시키가이샤, 히가시 데쓰로, 동경 엘렉트론 주식회사 filed Critical 다카시마 히로시
Publication of KR940010257A publication Critical patent/KR940010257A/ko
Application granted granted Critical
Publication of KR100260118B1 publication Critical patent/KR100260118B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
KR1019930021776A 1992-10-20 1993-10-20 기판의 검출장치 및 방법 Expired - Fee Related KR100260118B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30775092A JP3131750B2 (ja) 1992-10-20 1992-10-20 被処理体検出装置及び方法
JP92-307750 1992-10-20

Publications (2)

Publication Number Publication Date
KR940010257A KR940010257A (ko) 1994-05-24
KR100260118B1 true KR100260118B1 (ko) 2000-07-01

Family

ID=17972823

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930021776A Expired - Fee Related KR100260118B1 (ko) 1992-10-20 1993-10-20 기판의 검출장치 및 방법

Country Status (4)

Country Link
US (1) US5406092A (enExample)
JP (1) JP3131750B2 (enExample)
KR (1) KR100260118B1 (enExample)
TW (1) TW235376B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100854978B1 (ko) 2005-04-01 2008-08-28 주식회사 에이디피엔지니어링 기판 적재 장치

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2758558B2 (ja) * 1993-12-10 1998-05-28 信越半導体株式会社 ウェーハハンドリング装置
JP3249309B2 (ja) * 1994-09-13 2002-01-21 東京エレクトロン株式会社 基板の搬送装置及び基板の搬送方法並びに塗布現像処理装置
JP3510463B2 (ja) * 1997-11-10 2004-03-29 東京エレクトロン株式会社 基板の整列装置及び整列方法
JPH11176912A (ja) 1997-12-08 1999-07-02 Mitsubishi Electric Corp 半導体基板処理装置及びその制御方法
US6202482B1 (en) 1998-03-23 2001-03-20 Lehighton Electronics, Inc. Method and apparatus for testing of sheet material
WO1999049502A1 (en) * 1998-03-23 1999-09-30 Lehighton Electronics, Inc. Method and apparatus for testing of sheet material
KR20010066612A (ko) * 1999-12-31 2001-07-11 황인길 반도체 웨이퍼 감지장치
KR100450668B1 (ko) * 2001-12-20 2004-10-01 삼성전자주식회사 반도체 클리닝 시스템 및 그 구동 방법
US6808589B2 (en) * 2002-06-14 2004-10-26 Taiwan Semiconductor Manufacturing Co. Ltd Wafer transfer robot having wafer blades equipped with sensors
US8207748B2 (en) * 2004-08-11 2012-06-26 Lehighton Electronics, Inc. Device and handling system for measurement of mobility and sheet charge density
JP2007059856A (ja) * 2005-08-25 2007-03-08 Anywire:Kk マッピングセンサシステム
WO2007059433A2 (en) 2005-11-14 2007-05-24 Lehighton Electronics Sheet conductance/resistance measurement system
JP2008187156A (ja) * 2007-01-31 2008-08-14 Hitachi Kokusai Electric Inc 基板検出装置
JP4937953B2 (ja) * 2008-03-27 2012-05-23 ラピスセミコンダクタ株式会社 ウェハ搬送装置
CN104813438B (zh) * 2012-11-28 2017-07-25 盛美半导体设备（上海）有限公司 半导体硅片的清洗方法和装置
CN112585539A (zh) 2018-08-23 2021-03-30 Asml荷兰有限公司 用于校准物体装载过程的平台设备和方法
CN111069127A (zh) * 2019-12-20 2020-04-28 江苏兴汇智能科技有限公司 一种智能家居用红外探测器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0139785B1 (ko) * 1990-03-20 1998-07-15 카자마 젠쥬 웨이퍼 정렬 기능을 가진 웨이퍼 카운트 장치
JPH04186862A (ja) * 1990-11-21 1992-07-03 Tokyo Electron Sagami Ltd キャリア内基板の検出装置
JP2984958B2 (ja) * 1991-07-26 1999-11-29 東京エレクトロン株式会社 基板の枚葉検出装置
US5327921A (en) * 1992-03-05 1994-07-12 Tokyo Electron Limited Processing vessel for a wafer washing system
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100854978B1 (ko) 2005-04-01 2008-08-28 주식회사 에이디피엔지니어링 기판 적재 장치

Also Published As

Publication number Publication date
TW235376B (enExample) 1994-12-01
JP3131750B2 (ja) 2001-02-05
JPH06132269A (ja) 1994-05-13
KR940010257A (ko) 1994-05-24
US5406092A (en) 1995-04-11

Similar Documents

Publication Publication Date Title
KR100260118B1 (ko) 기판의 검출장치 및 방법
US5319216A (en) Substrate detector with light emitting and receiving elements arranged in staggered fashion and a polarization filter
JP2984958B2 (ja) 基板の枚葉検出装置
KR890004769B1 (ko) 주위 광선 및 전자 잡음 감소 회로
US6424710B1 (en) Method and device for detecting the presence of a patch cord connector in a telecommunications patch system using passive detection sensors
US4818859A (en) Low profile opto-device assembly with specific optoelectronic lead mount
KR0170402B1 (ko) 엣지검출에 의한 반도체장치나 lcd의 웨이퍼나 기판부재와 같은 기판검출시스템
US5354995A (en) Substrate detecting device for detecting the presence of a transparent and/or an opaque substrate by output of judgement means
US7927130B2 (en) Electronic apparatus and connector module used for this electronic apparatus
US4859993A (en) Wafer accounting and processing system
US3943021A (en) Optical data processing system
US7620330B2 (en) Optical receiver device and method
SE457151B (sv) Anordning foer optisk avkaenning av foeremaal
KR102694325B1 (ko) 엔드이펙터 감지센서를 갖는 풉 및 이를 이용한 데이터 통합 관리시스템
JP2992854B2 (ja) 基板の枚葉検出装置
JPH0273208A (ja) 光ファイバー実装方式
KR102765965B1 (ko) Oht로 이동 가능한 foup 내의 로봇감지 레이저 센서 시스템의 위치 판정 장치
US6926452B2 (en) Mounting information-collecting device, connector, and mounting information-collecting method
KR100272246B1 (ko) 반도체 핸들링 장비의 디바이스 안착 감지 장치
KR920004960B1 (ko) 카셋트 엘리베이터의 위치검출장치
KR200212457Y1 (ko) 반도체웨이퍼의 틸트감지장치
JPH09214153A (ja) 基板配列検出装置
JPH0756273Y2 (ja) ウエハ検出器
KR19980044541A (ko) 더블 디바이스 방지를 위한 센서를 갖는 피커
JPH06130310A (ja) 光線路切替装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20090326

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20100404

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20100404