TW235376B - - Google Patents

Info

Publication number
TW235376B
TW235376B TW082108675A TW82108675A TW235376B TW 235376 B TW235376 B TW 235376B TW 082108675 A TW082108675 A TW 082108675A TW 82108675 A TW82108675 A TW 82108675A TW 235376 B TW235376 B TW 235376B
Authority
TW
Taiwan
Application number
TW082108675A
Original Assignee
Tokyo Electron Co Ltd
Tel Kyushu Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd, Tel Kyushu Kk filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW235376B publication Critical patent/TW235376B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW082108675A 1992-10-20 1993-10-19 TW235376B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30775092A JP3131750B2 (ja) 1992-10-20 1992-10-20 被処理体検出装置及び方法

Publications (1)

Publication Number Publication Date
TW235376B true TW235376B (zh) 1994-12-01

Family

ID=17972823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082108675A TW235376B (zh) 1992-10-20 1993-10-19

Country Status (4)

Country Link
US (1) US5406092A (zh)
JP (1) JP3131750B2 (zh)
KR (1) KR100260118B1 (zh)
TW (1) TW235376B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2758558B2 (ja) * 1993-12-10 1998-05-28 信越半導体株式会社 ウェーハハンドリング装置
JP3249309B2 (ja) * 1994-09-13 2002-01-21 東京エレクトロン株式会社 基板の搬送装置及び基板の搬送方法並びに塗布現像処理装置
JP3510463B2 (ja) * 1997-11-10 2004-03-29 東京エレクトロン株式会社 基板の整列装置及び整列方法
JPH11176912A (ja) 1997-12-08 1999-07-02 Mitsubishi Electric Corp 半導体基板処理装置及びその制御方法
US6202482B1 (en) 1998-03-23 2001-03-20 Lehighton Electronics, Inc. Method and apparatus for testing of sheet material
EP1066649A1 (en) * 1998-03-23 2001-01-10 Lehighton Electronics Inc. Method and apparatus for testing of sheet material
KR20010066612A (ko) * 1999-12-31 2001-07-11 황인길 반도체 웨이퍼 감지장치
KR100450668B1 (ko) * 2001-12-20 2004-10-01 삼성전자주식회사 반도체 클리닝 시스템 및 그 구동 방법
US6808589B2 (en) * 2002-06-14 2004-10-26 Taiwan Semiconductor Manufacturing Co. Ltd Wafer transfer robot having wafer blades equipped with sensors
US8207748B2 (en) * 2004-08-11 2012-06-26 Lehighton Electronics, Inc. Device and handling system for measurement of mobility and sheet charge density
KR100854978B1 (ko) 2005-04-01 2008-08-28 주식회사 에이디피엔지니어링 기판 적재 장치
JP2007059856A (ja) * 2005-08-25 2007-03-08 Anywire:Kk マッピングセンサシステム
WO2007059433A2 (en) 2005-11-14 2007-05-24 Lehighton Electronics Sheet conductance/resistance measurement system
JP2008187156A (ja) * 2007-01-31 2008-08-14 Hitachi Kokusai Electric Inc 基板検出装置
JP4937953B2 (ja) * 2008-03-27 2012-05-23 ラピスセミコンダクタ株式会社 ウェハ搬送装置
CN104813438B (zh) * 2012-11-28 2017-07-25 盛美半导体设备（上海）有限公司 半导体硅片的清洗方法和装置
WO2020038677A1 (en) 2018-08-23 2020-02-27 Asml Netherlands B.V. Stage apparatus and method for calibrating an object loading process
CN111069127A (zh) * 2019-12-20 2020-04-28 江苏兴汇智能科技有限公司 一种智能家居用红外探测器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers
JPH04186862A (ja) * 1990-11-21 1992-07-03 Tokyo Electron Sagami Ltd キャリア内基板の検出装置
JP2984958B2 (ja) * 1991-07-26 1999-11-29 東京エレクトロン株式会社 基板の枚葉検出装置
US5327921A (en) * 1992-03-05 1994-07-12 Tokyo Electron Limited Processing vessel for a wafer washing system
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation

Also Published As

Publication number Publication date
KR940010257A (ko) 1994-05-24
JPH06132269A (ja) 1994-05-13
JP3131750B2 (ja) 2001-02-05
US5406092A (en) 1995-04-11
KR100260118B1 (ko) 2000-07-01

Similar Documents

Publication Publication Date Title
DK0652790T3 (zh)
TW235344B (zh)
DK0603481T3 (zh)
DK0630289T3 (zh)
TW235376B (zh)
TW248626B (zh)
DK0644844T3 (zh)
BR9207065A (zh)
DK0632741T3 (zh)
DK0553681T3 (zh)
TW267194B (zh)
DK0657012T3 (zh)
DK0625187T3 (zh)
DK0581129T3 (zh)
DK0576346T3 (zh)
DK0564197T3 (zh)
DK0574276T3 (zh)
DK0596569T3 (zh)
FR2686169B1 (zh)
DK0597323T3 (zh)
DK0581726T3 (zh)
DK0576097T3 (zh)
BR9202713C1 (zh)
DK0590732T3 (zh)
DE9207553U1 (zh)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees