KR100244826B1 - 반도체장치 및 그 제조방법 - Google Patents
반도체장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR100244826B1 KR100244826B1 KR1019940027113A KR19940027113A KR100244826B1 KR 100244826 B1 KR100244826 B1 KR 100244826B1 KR 1019940027113 A KR1019940027113 A KR 1019940027113A KR 19940027113 A KR19940027113 A KR 19940027113A KR 100244826 B1 KR100244826 B1 KR 100244826B1
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic substrate
- circuit pattern
- pattern body
- alloy layer
- pellet
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26633793A JP2937713B2 (ja) | 1993-10-25 | 1993-10-25 | 半導体装置 |
JP93-266337 | 1993-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100244826B1 true KR100244826B1 (ko) | 2000-02-15 |
Family
ID=17429539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940027113A KR100244826B1 (ko) | 1993-10-25 | 1994-10-24 | 반도체장치 및 그 제조방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2937713B2 (ja) |
KR (1) | KR100244826B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2842355B2 (ja) * | 1996-02-01 | 1999-01-06 | 日本電気株式会社 | パッケージ |
US6236521B1 (en) | 1998-02-09 | 2001-05-22 | Canon Kabushiki Kaisha | Objective lens and image pickup device using the same |
US7940478B2 (en) | 2008-04-11 | 2011-05-10 | Nikon Corporation | Imaging lens, optical apparatus and method for forming image using this imaging lens |
JP6388836B2 (ja) * | 2015-02-20 | 2018-09-12 | 愛三工業株式会社 | 液位検出装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3829598A (en) * | 1972-09-25 | 1974-08-13 | Hutson Ind Inc | Copper heat sinks for electronic devices and method of making same |
-
1993
- 1993-10-25 JP JP26633793A patent/JP2937713B2/ja not_active Expired - Fee Related
-
1994
- 1994-10-24 KR KR1019940027113A patent/KR100244826B1/ko not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3829598A (en) * | 1972-09-25 | 1974-08-13 | Hutson Ind Inc | Copper heat sinks for electronic devices and method of making same |
Also Published As
Publication number | Publication date |
---|---|
JP2937713B2 (ja) | 1999-08-23 |
JPH07122692A (ja) | 1995-05-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
E902 | Notification of reason for refusal | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20031030 Year of fee payment: 5 |
|
LAPS | Lapse due to unpaid annual fee |