KR100244826B1 - 반도체장치 및 그 제조방법 - Google Patents

반도체장치 및 그 제조방법 Download PDF

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Publication number
KR100244826B1
KR100244826B1 KR1019940027113A KR19940027113A KR100244826B1 KR 100244826 B1 KR100244826 B1 KR 100244826B1 KR 1019940027113 A KR1019940027113 A KR 1019940027113A KR 19940027113 A KR19940027113 A KR 19940027113A KR 100244826 B1 KR100244826 B1 KR 100244826B1
Authority
KR
South Korea
Prior art keywords
ceramic substrate
circuit pattern
pattern body
alloy layer
pellet
Prior art date
Application number
KR1019940027113A
Other languages
English (en)
Korean (ko)
Inventor
구스미메그미
Original Assignee
니시무로 타이죠
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니시무로 타이죠, 가부시끼가이샤 도시바 filed Critical 니시무로 타이죠
Application granted granted Critical
Publication of KR100244826B1 publication Critical patent/KR100244826B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019940027113A 1993-10-25 1994-10-24 반도체장치 및 그 제조방법 KR100244826B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93-266337 1993-10-25
JP26633793A JP2937713B2 (ja) 1993-10-25 1993-10-25 半導体装置

Publications (1)

Publication Number Publication Date
KR100244826B1 true KR100244826B1 (ko) 2000-02-15

Family

ID=17429539

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940027113A KR100244826B1 (ko) 1993-10-25 1994-10-24 반도체장치 및 그 제조방법

Country Status (2)

Country Link
JP (1) JP2937713B2 (ja)
KR (1) KR100244826B1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2842355B2 (ja) * 1996-02-01 1999-01-06 日本電気株式会社 パッケージ
US6236521B1 (en) 1998-02-09 2001-05-22 Canon Kabushiki Kaisha Objective lens and image pickup device using the same
US7940478B2 (en) 2008-04-11 2011-05-10 Nikon Corporation Imaging lens, optical apparatus and method for forming image using this imaging lens
JP6388836B2 (ja) * 2015-02-20 2018-09-12 愛三工業株式会社 液位検出装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3829598A (en) * 1972-09-25 1974-08-13 Hutson Ind Inc Copper heat sinks for electronic devices and method of making same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3829598A (en) * 1972-09-25 1974-08-13 Hutson Ind Inc Copper heat sinks for electronic devices and method of making same

Also Published As

Publication number Publication date
JP2937713B2 (ja) 1999-08-23
JPH07122692A (ja) 1995-05-12

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E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
J201 Request for trial against refusal decision
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Year of fee payment: 5

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