KR100240916B1 - 회로 기판 및 그 형성 방법 - Google Patents

회로 기판 및 그 형성 방법

Info

Publication number
KR100240916B1
KR100240916B1 KR1019960046028A KR19960046028A KR100240916B1 KR 100240916 B1 KR100240916 B1 KR 100240916B1 KR 1019960046028 A KR1019960046028 A KR 1019960046028A KR 19960046028 A KR19960046028 A KR 19960046028A KR 100240916 B1 KR100240916 B1 KR 100240916B1
Authority
KR
South Korea
Prior art keywords
region
circuit board
barrier member
metal
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960046028A
Other languages
English (en)
Korean (ko)
Other versions
KR970064329A (ko
Inventor
마크 다니엘 데윈
다니엘 피터 라브젠티스
조나단 데이비드 레이드
티모시 리 샤프
Original Assignee
포만 제프리 엘
인터내셔널 비지네스 머신즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 포만 제프리 엘, 인터내셔널 비지네스 머신즈 코포레이션 filed Critical 포만 제프리 엘
Publication of KR970064329A publication Critical patent/KR970064329A/ko
Application granted granted Critical
Publication of KR100240916B1 publication Critical patent/KR100240916B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1019960046028A 1996-02-20 1996-10-15 회로 기판 및 그 형성 방법 Expired - Fee Related KR100240916B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/603,629 1996-02-20
US08/603,629 US5731547A (en) 1996-02-20 1996-02-20 Circuitized substrate with material containment means and method of making same
US8/603,629 1996-02-20

Publications (2)

Publication Number Publication Date
KR970064329A KR970064329A (ko) 1997-09-12
KR100240916B1 true KR100240916B1 (ko) 2000-03-02

Family

ID=24416261

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960046028A Expired - Fee Related KR100240916B1 (ko) 1996-02-20 1996-10-15 회로 기판 및 그 형성 방법

Country Status (4)

Country Link
US (1) US5731547A (https=)
JP (1) JP3309057B2 (https=)
KR (1) KR100240916B1 (https=)
TW (1) TW319945B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6252307B1 (en) 2000-03-28 2001-06-26 International Business Machines Corporation Structure for preventing adhesive bleed onto surfaces
US7094068B2 (en) * 2003-08-11 2006-08-22 Silicon Integrated Systems Corp. Load board
JP2006202981A (ja) * 2005-01-20 2006-08-03 Aisin Aw Co Ltd 電子装置及びその製造方法
CN100356532C (zh) * 2005-03-26 2007-12-19 阎跃军 点胶液态树脂封装方法
CN1956180B (zh) * 2005-03-26 2010-08-04 阎跃军 采用点胶液态树脂封装的电子器件的基片结构
US7521728B2 (en) * 2006-01-20 2009-04-21 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US20090035455A1 (en) * 2007-07-31 2009-02-05 Endicott Interconnect Technologies, Inc. Adhesive bleed prevention method and product produced from same
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
FR2930399B1 (fr) * 2008-04-17 2010-05-14 Continental Automotive France Circuit imprime muni de reliefs de separation pour vernis de protection
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218701A (en) * 1978-07-24 1980-08-19 Citizen Watch Co., Ltd. Package for an integrated circuit having a container with support bars
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
US5087961A (en) * 1987-01-28 1992-02-11 Lsi Logic Corporation Semiconductor device package
US5253010A (en) * 1988-05-13 1993-10-12 Minolta Camera Kabushiki Kaisha Printed circuit board
US5001604A (en) * 1989-10-26 1991-03-19 Lusby W Randolph Embedded testing circuit and method for fabricating same
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
JPH0582970A (ja) * 1991-09-24 1993-04-02 Hitachi Ltd 混成回路基板
US5284548A (en) * 1993-03-03 1994-02-08 Microelectronics And Computer Technology Corporation Process for producing electrical circuits with precision surface features
US5336931A (en) * 1993-09-03 1994-08-09 Motorola, Inc. Anchoring method for flow formed integrated circuit covers
US5382759A (en) * 1993-09-28 1995-01-17 Trw Inc. Massive parallel interconnection attachment using flexible circuit

Also Published As

Publication number Publication date
JPH09232733A (ja) 1997-09-05
TW319945B (https=) 1997-11-11
KR970064329A (ko) 1997-09-12
JP3309057B2 (ja) 2002-07-29
US5731547A (en) 1998-03-24

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