KR100232553B1 - 메모리카드 - Google Patents

메모리카드 Download PDF

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Publication number
KR100232553B1
KR100232553B1 KR1019960072354A KR19967002354A KR100232553B1 KR 100232553 B1 KR100232553 B1 KR 100232553B1 KR 1019960072354 A KR1019960072354 A KR 1019960072354A KR 19967002354 A KR19967002354 A KR 19967002354A KR 100232553 B1 KR100232553 B1 KR 100232553B1
Authority
KR
South Korea
Prior art keywords
power supply
wiring
memory card
interface connector
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019960072354A
Other languages
English (en)
Korean (ko)
Inventor
아끼노리 세끼야마
Original Assignee
아끼구사 나오유끼
후지쓰 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아끼구사 나오유끼, 후지쓰 가부시키가이샤 filed Critical 아끼구사 나오유끼
Application granted granted Critical
Publication of KR100232553B1 publication Critical patent/KR100232553B1/ko
Assigned to 후지쯔 세미컨덕터 가부시키가이샤 reassignment 후지쯔 세미컨덕터 가부시키가이샤 권리의 전부이전등록 Assignors: 후지쯔 가부시끼가이샤
Assigned to 가부시키가이샤 소시오넥스트 reassignment 가부시키가이샤 소시오넥스트 권리의 전부이전등록 Assignors: 후지쯔 세미컨덕터 가부시키가이샤
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
KR1019960072354A 1995-12-28 1996-12-26 메모리카드 Expired - Lifetime KR100232553B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7342757A JPH09180430A (ja) 1995-12-28 1995-12-28 メモリカード
JP95-342757 1995-12-28

Publications (1)

Publication Number Publication Date
KR100232553B1 true KR100232553B1 (ko) 1999-12-01

Family

ID=18356265

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019960072354A Expired - Lifetime KR100232553B1 (ko) 1995-12-28 1996-12-26 메모리카드
KR1019960072354A Granted KR970051126A (ko) 1995-12-28 1996-12-26 메모리카드

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019960072354A Granted KR970051126A (ko) 1995-12-28 1996-12-26 메모리카드

Country Status (4)

Country Link
US (1) US5745426A (cg-RX-API-DMAC7.html)
JP (1) JPH09180430A (cg-RX-API-DMAC7.html)
KR (2) KR100232553B1 (cg-RX-API-DMAC7.html)
TW (1) TW316968B (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3718008B2 (ja) 1996-02-26 2005-11-16 株式会社日立製作所 メモリモジュールおよびその製造方法
US6028781A (en) * 1996-12-19 2000-02-22 Texas Instruments Incorporated Selectable integrated circuit assembly and method of operation
DE19724053A1 (de) * 1997-06-07 1998-12-10 Biotronik Mess & Therapieg Elektronische Speichervorrichtung, insbesondere zur Anwendung bei implantierbaren medizinischen Geräten
US6108228A (en) * 1997-12-02 2000-08-22 Micron Technology, Inc. Quad in-line memory module
US6062480A (en) * 1998-07-20 2000-05-16 Vlsi Technologies, Inc. Hot docking system and methods for detecting and managing hot docking of bus cards
US6172895B1 (en) * 1999-12-14 2001-01-09 High Connector Density, Inc. High capacity memory module with built-in-high-speed bus terminations
JP2001210921A (ja) * 2000-01-28 2001-08-03 Mitsumi Electric Co Ltd プリント基板
US6449166B1 (en) * 2000-08-24 2002-09-10 High Connection Density, Inc. High capacity memory module with higher density and improved manufacturability
US6940153B2 (en) * 2003-02-05 2005-09-06 Hewlett-Packard Development Company, L.P. Magnetic shielding for magnetic random access memory card
CN100405880C (zh) * 2004-12-24 2008-07-23 鸿富锦精密工业（深圳）有限公司 引脚连接结构及其脚位定义的修改方法
KR101177555B1 (ko) * 2006-02-01 2012-08-27 삼성전자주식회사 메모리 카드, 메모리 카드의 데이터 구동 방법, 그리고메모리 카드 시스템
DE102006018874A1 (de) * 2006-04-24 2007-10-25 Infineon Technologies Ag Schaltungsanordnung zur Koppelung einer Spannungsversorgung an ein Halbleiterbauelement, Verfahren zur Herstellung der Schaltungsanordnung sowie Datenverarbeitungsgerät umfassend die Schaltungsanordnung
KR20100041515A (ko) * 2008-10-14 2010-04-22 삼성전자주식회사 제거 가능한 보조 검사단자를 갖는 솔리드 스테이트 드라이브의 검사방법
US8856417B2 (en) 2012-10-09 2014-10-07 International Business Machines Corporation Memory module connector with auxiliary power cable
US8753138B2 (en) 2012-10-09 2014-06-17 International Business Machines Corporation Memory module connector with auxiliary power
US12614047B2 (en) * 2023-10-25 2026-04-28 SanDisk Technologies, Inc. Removable memory card with efficient card lock mechanism, XY ratios, anti-reverse insertion feature, pullout feature, and pads layout

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3082323B2 (ja) * 1991-07-30 2000-08-28 ソニー株式会社 メモリモジュール
JPH05233901A (ja) * 1992-02-18 1993-09-10 Mitsubishi Electric Corp Ｉｃカード、ｉｃカード搭載用メモリｉｃ及びｉｃカードのメモリ容量の確認方法
US5469399A (en) * 1993-03-16 1995-11-21 Kabushiki Kaisha Toshiba Semiconductor memory, memory card, and method of driving power supply for EEPROM
US5272664A (en) * 1993-04-21 1993-12-21 Silicon Graphics, Inc. High memory capacity DRAM SIMM

Also Published As

Publication number Publication date
JPH09180430A (ja) 1997-07-11
KR970051126A (ko) 1997-07-29
US5745426A (en) 1998-04-28
TW316968B (cg-RX-API-DMAC7.html) 1997-10-01

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