KR100220260B1 - 이중 접착제 - Google Patents
이중 접착제 Download PDFInfo
- Publication number
- KR100220260B1 KR100220260B1 KR1019920025624A KR920025624A KR100220260B1 KR 100220260 B1 KR100220260 B1 KR 100220260B1 KR 1019920025624 A KR1019920025624 A KR 1019920025624A KR 920025624 A KR920025624 A KR 920025624A KR 100220260 B1 KR100220260 B1 KR 100220260B1
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- meth
- water
- acrylate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/80—Compositions for aqueous adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3359238A JP2642554B2 (ja) | 1991-12-27 | 1991-12-27 | 接着剤組成物 |
| JP91-359238 | 1991-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930013048A KR930013048A (ko) | 1993-07-21 |
| KR100220260B1 true KR100220260B1 (ko) | 1999-09-15 |
Family
ID=18463469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920025624A Expired - Fee Related KR100220260B1 (ko) | 1991-12-27 | 1992-12-26 | 이중 접착제 |
Country Status (4)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110082548A (ko) * | 2008-10-08 | 2011-07-19 | 덴끼 가가꾸 고교 가부시키가이샤 | 접착제 조성물 및 접착 방법 |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3043835B2 (ja) | 1991-05-23 | 2000-05-22 | 電気化学工業株式会社 | 接着剤組成物 |
| JP2642554B2 (ja) * | 1991-12-27 | 1997-08-20 | 電気化学工業株式会社 | 接着剤組成物 |
| US5385958A (en) * | 1993-03-05 | 1995-01-31 | Dymax Corporation | Activator formulation and composition utilizing same |
| US6417244B1 (en) | 1993-04-13 | 2002-07-09 | Southwest Research Institute | Metal oxide compositions and methods |
| US6696585B1 (en) | 1993-04-13 | 2004-02-24 | Southwest Research Institute | Functionalized nanoparticles |
| US6258974B1 (en) | 1993-04-13 | 2001-07-10 | Southwest Research Institute | Metal oxide compositions composites thereof and method |
| WO1996030416A1 (fr) * | 1995-03-31 | 1996-10-03 | Sekisui Kagaku Kogyo Kabushiki Kaisha | Procede de preparation d'adhesifs acryliques du genre solvant, sensibles a la pression, et adhesif medical sensible a la pression |
| JPH0987590A (ja) * | 1995-09-22 | 1997-03-31 | Denki Kagaku Kogyo Kk | 接着剤組成物 |
| US5935535A (en) * | 1996-09-04 | 1999-08-10 | 3M Innovative Properties Company | Dispensing apparatus |
| US5865936A (en) * | 1997-03-28 | 1999-02-02 | National Starch And Chemical Investment Holding Corporation | Rapid curing structural acrylic adhesive |
| ID20459A (id) * | 1997-06-24 | 1998-12-24 | Denki Kagaku Kogyo Kk | Komposisi resin yang bisa mengawetkan, komposisi perekat, produk dan susunan yang diawetkan |
| AU1929100A (en) * | 1998-12-03 | 2000-06-19 | Dexter Corporation, The | Adhesive compositions with retarding additive |
| US6194481B1 (en) | 1999-05-19 | 2001-02-27 | Board Of Regents Of The University Of Texas System | Mechanically strong and transparent or translucent composites made using zirconium oxide nanoparticles |
| WO2000077109A2 (en) * | 1999-06-10 | 2000-12-21 | Lord Corporation | Adhesive formulations |
| US6512043B2 (en) * | 2000-05-10 | 2003-01-28 | Illinois Tool Works Inc. | Two-part structural adhesive having long working time |
| US6500513B2 (en) * | 2000-11-29 | 2002-12-31 | 3M Innovative Properties Company | Adhesive composition and optical disk using the composition |
| DE10062854A1 (de) * | 2000-12-16 | 2002-06-27 | Henkel Kgaa | Flexible und zäh-elastische Methacrylat-Klebstoffe |
| US7108801B2 (en) * | 2001-01-23 | 2006-09-19 | Southwest Reasearch Institute | Methods and blends for controlling rheology and transition temperature of liquid crystals |
| US7147800B2 (en) * | 2001-01-23 | 2006-12-12 | Southwest Research Institute | Selective ether cleavage synthesis of liquid crystals |
| US20040199004A1 (en) * | 2001-01-23 | 2004-10-07 | Southwest Research Institute | Novel mesogens |
| WO2002070543A2 (en) * | 2001-03-07 | 2002-09-12 | University Of Texas System | Ultra-low shrinkage composite resins based on blended nematic liquid crystal monomers |
| US7176044B2 (en) | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
| AT501706B1 (de) * | 2005-04-12 | 2007-01-15 | Evva Werke | Flachschlüssel sowie zugehöriges zylinderschloss |
| US8323448B2 (en) * | 2007-09-26 | 2012-12-04 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive composition and bonding method |
| TWI595037B (zh) * | 2009-04-30 | 2017-08-11 | 電化股份有限公司 | 硬化性樹脂組成物、接著劑組成物、硬化體或複合體 |
| CN101899920B (zh) * | 2009-06-01 | 2013-01-16 | 兰溪市卓越电子有限公司 | 一种防暴高密钥安全锁具 |
| JP5666235B2 (ja) * | 2010-10-08 | 2015-02-12 | アイカ工業株式会社 | 2成分形アクリル樹脂系接着剤組成物 |
| EP2979681B1 (en) * | 2013-03-28 | 2020-09-16 | Kuraray Noritake Dental Inc. | Curable composition |
| TW201816024A (zh) * | 2016-05-09 | 2018-05-01 | 漢高智慧財產控股公司 | 含有反應性倍半矽氧烷的黏著組合物 |
| KR20240064758A (ko) | 2018-09-17 | 2024-05-13 | 헨켈 아게 운트 코. 카게아아 | 2-파트 접착제 조성물 |
| WO2020133142A1 (en) | 2018-12-28 | 2020-07-02 | Henkel Ag & Co. Kgaa | Heat and humidity resistant adhesive composition |
| EP4130179B1 (en) | 2020-04-03 | 2025-09-24 | Nippon Soda Co., Ltd. | Two-component adhesive composition |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3720656A (en) * | 1971-05-10 | 1973-03-13 | Broadview Chem Corp | Anaerobic sealant compositions |
| US3890407A (en) * | 1972-07-20 | 1975-06-17 | Du Pont | Novel adhesive compositions |
| JPS532543A (en) * | 1976-06-29 | 1978-01-11 | Denki Kagaku Kogyo Kk | Rapid-setting acrylic resin adhesive |
| JPS53102989A (en) * | 1977-02-22 | 1978-09-07 | Denki Kagaku Kogyo Kk | Curable composition |
| US4223115A (en) * | 1978-04-24 | 1980-09-16 | Lord Corporation | Structural adhesive formulations |
| JPS6019789B2 (ja) * | 1979-07-23 | 1985-05-17 | 電気化学工業株式会社 | 二液型接着剤 |
| JPS5695967A (en) * | 1979-12-28 | 1981-08-03 | Denki Kagaku Kogyo Kk | Two-pack acrylic adhesive composition |
| US4414257A (en) * | 1981-07-09 | 1983-11-08 | Mitsubishi Denki Kabushiki Kaisha | Elevator panel |
| US4539382A (en) * | 1981-07-29 | 1985-09-03 | Kuraray Co., Ltd. | Adhesive composition |
| US4452944A (en) * | 1982-02-11 | 1984-06-05 | Lord Corporation | Structural adhesive formulations |
| JPS59207977A (ja) * | 1983-05-12 | 1984-11-26 | Okura Ind Co Ltd | 嫌気硬化性接着剤 |
| US5318998A (en) * | 1989-10-20 | 1994-06-07 | Denki Kagaku Kogyo Kabushiki Kaisha | Acryl-type two-part liquid adhesive composition |
| EP0492521B1 (en) * | 1990-12-28 | 1995-12-06 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive composition and metal-bonded composite |
| JP2642554B2 (ja) * | 1991-12-27 | 1997-08-20 | 電気化学工業株式会社 | 接着剤組成物 |
-
1991
- 1991-12-27 JP JP3359238A patent/JP2642554B2/ja not_active Expired - Fee Related
-
1992
- 1992-12-21 TW TW081110236A patent/TW226404B/zh active
- 1992-12-23 US US07/996,137 patent/US5328947A/en not_active Ceased
- 1992-12-26 KR KR1019920025624A patent/KR100220260B1/ko not_active Expired - Fee Related
-
1996
- 1996-02-29 US US08/609,006 patent/USRE36140E/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110082548A (ko) * | 2008-10-08 | 2011-07-19 | 덴끼 가가꾸 고교 가부시키가이샤 | 접착제 조성물 및 접착 방법 |
| KR101582334B1 (ko) | 2008-10-08 | 2016-01-04 | 덴카 주식회사 | 접착제 조성물 및 접착 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2642554B2 (ja) | 1997-08-20 |
| JPH05179204A (ja) | 1993-07-20 |
| KR930013048A (ko) | 1993-07-21 |
| TW226404B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1994-07-11 |
| US5328947A (en) | 1994-07-12 |
| USRE36140E (en) | 1999-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
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| E701 | Decision to grant or registration of patent right | ||
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