KR0172519B1 - 반도체 처리시스템의 가스공급헤드 및 로드 록 실 - Google Patents

반도체 처리시스템의 가스공급헤드 및 로드 록 실 Download PDF

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Publication number
KR0172519B1
KR0172519B1 KR1019950025281A KR19950025281A KR0172519B1 KR 0172519 B1 KR0172519 B1 KR 0172519B1 KR 1019950025281 A KR1019950025281 A KR 1019950025281A KR 19950025281 A KR19950025281 A KR 19950025281A KR 0172519 B1 KR0172519 B1 KR 0172519B1
Authority
KR
South Korea
Prior art keywords
gas
load lock
gas supply
layer
supply head
Prior art date
Application number
KR1019950025281A
Other languages
English (en)
Korean (ko)
Other versions
KR960009100A (ko
Inventor
슈지 모리야
Original Assignee
이노우에 아키라
동경엘렉트론주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에 아키라, 동경엘렉트론주식회사 filed Critical 이노우에 아키라
Publication of KR960009100A publication Critical patent/KR960009100A/ko
Application granted granted Critical
Publication of KR0172519B1 publication Critical patent/KR0172519B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Filtering Materials (AREA)
KR1019950025281A 1994-08-17 1995-08-17 반도체 처리시스템의 가스공급헤드 및 로드 록 실 KR0172519B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21529994A JP3147325B2 (ja) 1994-08-17 1994-08-17 半導体ウエハ処理装置
JP94-215299 1994-08-17

Publications (2)

Publication Number Publication Date
KR960009100A KR960009100A (ko) 1996-03-22
KR0172519B1 true KR0172519B1 (ko) 1999-03-30

Family

ID=16670027

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950025281A KR0172519B1 (ko) 1994-08-17 1995-08-17 반도체 처리시스템의 가스공급헤드 및 로드 록 실

Country Status (3)

Country Link
JP (1) JP3147325B2 (ja)
KR (1) KR0172519B1 (ja)
TW (1) TW293136B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3926890B2 (ja) * 1997-06-11 2007-06-06 東京エレクトロン株式会社 処理システム
KR100489638B1 (ko) * 1998-03-12 2005-08-31 삼성전자주식회사 반도체장치제조설비의건식식각설비
JP3367421B2 (ja) * 1998-04-16 2003-01-14 東京エレクトロン株式会社 被処理体の収納装置及び搬出入ステージ
US20040118343A1 (en) * 2002-12-18 2004-06-24 Tapp Frederick L. Vacuum chamber load lock purging method and apparatus
KR100621804B1 (ko) * 2004-09-22 2006-09-19 삼성전자주식회사 디퓨저 및 그를 구비한 반도체 제조설비
KR100686285B1 (ko) * 2005-07-22 2007-02-22 주식회사 래디언테크 플라즈마 처리 장치 및 배기 판
KR200449961Y1 (ko) * 2008-05-07 2010-08-25 삼성물산 주식회사 퍼지 캡
JP5356732B2 (ja) 2008-06-06 2013-12-04 株式会社日立ハイテクノロジーズ 真空処理装置
ES2393907T3 (es) 2010-05-17 2012-12-28 Jaxa Networks Vehículo que tiene ancho de vía variable
KR101625014B1 (ko) * 2014-03-28 2016-05-27 유니이노 주식회사 보행 타입 바이크
JP7169169B2 (ja) * 2018-11-15 2022-11-10 クアーズテック株式会社 ブレイクフィルタおよびその製造方法
KR102366122B1 (ko) * 2019-07-02 2022-02-21 쿠어스택 가부시키가이샤 디퓨저 및 디퓨저의 제조 방법

Also Published As

Publication number Publication date
JPH0864582A (ja) 1996-03-08
JP3147325B2 (ja) 2001-03-19
TW293136B (ja) 1996-12-11
KR960009100A (ko) 1996-03-22

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