KR0142648B1 - 베어본딩용 동합금 리드프레임 - Google Patents
베어본딩용 동합금 리드프레임Info
- Publication number
- KR0142648B1 KR0142648B1 KR1019940019267A KR19940019267A KR0142648B1 KR 0142648 B1 KR0142648 B1 KR 0142648B1 KR 1019940019267 A KR1019940019267 A KR 1019940019267A KR 19940019267 A KR19940019267 A KR 19940019267A KR 0142648 B1 KR0142648 B1 KR 0142648B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper alloy
- lead frame
- oxide film
- peak strength
- copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-194478 | 1993-08-05 | ||
JP5194478A JP2766605B2 (ja) | 1993-08-05 | 1993-08-05 | ベアボンディング用銅合金リードフレーム |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950007072A KR950007072A (ko) | 1995-03-21 |
KR0142648B1 true KR0142648B1 (ko) | 1998-08-17 |
Family
ID=16325216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940019267A KR0142648B1 (ko) | 1993-08-05 | 1994-08-04 | 베어본딩용 동합금 리드프레임 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2766605B2 (ja) |
KR (1) | KR0142648B1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003013158A (ja) * | 2001-07-04 | 2003-01-15 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
JP2003013156A (ja) * | 2001-07-04 | 2003-01-15 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
JP2003041333A (ja) * | 2001-08-01 | 2003-02-13 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
JP2003055723A (ja) * | 2001-08-10 | 2003-02-26 | Nippon Mining & Metals Co Ltd | 積層板用銅合金箔 |
JP4798890B2 (ja) * | 2001-08-10 | 2011-10-19 | Jx日鉱日石金属株式会社 | 積層板用銅合金箔 |
JP4798894B2 (ja) * | 2001-08-20 | 2011-10-19 | Jx日鉱日石金属株式会社 | 積層板用銅合金箔 |
-
1993
- 1993-08-05 JP JP5194478A patent/JP2766605B2/ja not_active Expired - Lifetime
-
1994
- 1994-08-04 KR KR1019940019267A patent/KR0142648B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950007072A (ko) | 1995-03-21 |
JPH0748641A (ja) | 1995-02-21 |
JP2766605B2 (ja) | 1998-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3550233B2 (ja) | 高強度高導電性銅基合金の製造法 | |
US7946022B2 (en) | Copper alloy for electronic machinery and tools and method of producing the same | |
US4525434A (en) | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices and clad material containing said alloy | |
US6312762B1 (en) | Process for production of copper or copper base alloys | |
JP2007039804A5 (ja) | ||
KR0142648B1 (ko) | 베어본딩용 동합금 리드프레임 | |
KR102187539B1 (ko) | 반도체 장치용 본딩 와이어 | |
JP2000307051A (ja) | 銅及び銅基合金とその製造方法 | |
JP4427487B2 (ja) | 錫被覆電気コネクタ | |
EP3150731A1 (en) | Aluminum foil, electronic component wiring board, and aluminum foil manufacturing method | |
EP4012059A1 (en) | Copper alloy sheet, copper alloy sheet with plating film, and methods for producing these | |
JP3720941B2 (ja) | 酸化被膜密着性に優れるリードフレーム用銅合金材 | |
JP4382527B2 (ja) | 耐加熱変色性に優れた洋白条 | |
JPS6244691B2 (ja) | ||
KR100746285B1 (ko) | 매트릭스에 분산된 Cu-부화 결정립 및/또는 Cu-농축층을 가지는 스테인레스 스틸 시트 | |
JPH05311298A (ja) | コネクタ用銅基合金およびその製造法 | |
CN115652133B (zh) | 一种锌白铜带材及其制备方法 | |
JPS59140338A (ja) | リ−ドフレ−ム用銅合金 | |
JP2009076473A (ja) | 錫被覆電気コネクタ | |
JP2594249B2 (ja) | コネクタ用銅基合金およびその製造方法 | |
JPH0770667B2 (ja) | リードフレーム材料 | |
KR100498656B1 (ko) | 내식성동재및그제조방법 | |
JPH05190725A (ja) | 半導体装置用リードフレーム及び半導体装置 | |
JPS6345342A (ja) | 高力伝導性銅合金 | |
JPH02173228A (ja) | ダイレクトボンディング性の良好な銅合金 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130318 Year of fee payment: 16 |
|
FPAY | Annual fee payment |
Payment date: 20140320 Year of fee payment: 17 |
|
EXPY | Expiration of term |