JPWO2025191974A5 - - Google Patents

Info

Publication number
JPWO2025191974A5
JPWO2025191974A5 JP2026506678A JP2026506678A JPWO2025191974A5 JP WO2025191974 A5 JPWO2025191974 A5 JP WO2025191974A5 JP 2026506678 A JP2026506678 A JP 2026506678A JP 2026506678 A JP2026506678 A JP 2026506678A JP WO2025191974 A5 JPWO2025191974 A5 JP WO2025191974A5
Authority
JP
Japan
Prior art keywords
connecting portions
insulating layer
terminal
opening
flat portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2026506678A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025191974A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/045840 external-priority patent/WO2025191974A1/ja
Publication of JPWO2025191974A1 publication Critical patent/JPWO2025191974A1/ja
Publication of JPWO2025191974A5 publication Critical patent/JPWO2025191974A5/ja
Pending legal-status Critical Current

Links

JP2026506678A 2024-03-11 2024-12-25 Pending JPWO2025191974A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024037394 2024-03-11
PCT/JP2024/045840 WO2025191974A1 (ja) 2024-03-11 2024-12-25 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2025191974A1 JPWO2025191974A1 (https=) 2025-09-18
JPWO2025191974A5 true JPWO2025191974A5 (https=) 2026-04-14

Family

ID=97063106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2026506678A Pending JPWO2025191974A1 (https=) 2024-03-11 2024-12-25

Country Status (4)

Country Link
JP (1) JPWO2025191974A1 (https=)
CN (1) CN121420647A (https=)
DE (1) DE112024002066T5 (https=)
WO (1) WO2025191974A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005065414A (ja) 2003-08-13 2005-03-10 Fuji Electric Fa Components & Systems Co Ltd インバータ装置
JP4430497B2 (ja) 2004-09-17 2010-03-10 ニチコン株式会社 半導体モジュール
JP2007324311A (ja) * 2006-05-31 2007-12-13 Shizuki Electric Co Inc ケース入りコンデンサ
JP5123162B2 (ja) 2008-12-26 2013-01-16 日本インター株式会社 電力用半導体装置及びその製造方法
US11570921B2 (en) * 2015-06-11 2023-01-31 Tesla, Inc. Semiconductor device with stacked terminals
JP6969501B2 (ja) 2018-05-28 2021-11-24 株式会社デンソー 半導体装置
JP6959904B2 (ja) * 2018-11-20 2021-11-05 ルビコン電子株式会社 コンデンサモジュール
JP7344099B2 (ja) * 2019-11-25 2023-09-13 株式会社指月電機製作所 樹脂封止電気部品
EP4102559B1 (en) * 2021-06-10 2026-04-22 Hitachi Energy Ltd Power semiconductor module
JP7793967B2 (ja) 2021-12-14 2026-01-06 富士電機株式会社 半導体装置

Similar Documents

Publication Publication Date Title
US7910952B2 (en) Power semiconductor arrangement
JPS62108552A (ja) 電力用半導体モジユ−ル
JP2019140236A (ja) 半導体装置
JPS62113452A (ja) パワ−半導体装置
CN218215290U (zh) 二极管光伏模块和太阳能电池接线盒装置
JPWO2025191974A5 (https=)
US20250069967A1 (en) Semiconductor device
JP2001196526A (ja) マルチベアチップ実装体、マルチチップパッケージ、半導体装置、ならびに電子機器
TWM660797U (zh) 積體電路晶片封裝裝置及其引線框架
CN100511677C (zh) 接触装置
WO2019171795A1 (ja) 半導体モジュール
US20050115062A1 (en) Chip assembling structure and socket
JP3159950B2 (ja) 半導体パッケージ実装用ソケット
JP2001189413A (ja) マルチチップ、マルチチップパッケージ、半導体装置および電子機器
CN219958990U (zh) 晶片导通片组件及集成电路结构
US20260107767A1 (en) Semiconductor device
JP3543237B2 (ja) Ｉｃソケット
JP3883648B2 (ja) 樹脂封止電気部品
JPH0631723Y2 (ja) 半導体装置
TWM604491U (zh) 晶片導通片組件及積體電路結構
KR100673682B1 (ko) 리드구조가 개선된 ｐｔｃ 소자 및 그 ｐｃｂ 실장구조
JP2025173861A (ja) 半導体装置
JPWO2024257265A5 (https=)
TWM606412U (zh) 晶片導通片組件及積體電路結構
TW202414482A (zh) 固態繼電器