JPWO2025154399A5 - - Google Patents

Info

Publication number
JPWO2025154399A5
JPWO2025154399A5 JP2025570559A JP2025570559A JPWO2025154399A5 JP WO2025154399 A5 JPWO2025154399 A5 JP WO2025154399A5 JP 2025570559 A JP2025570559 A JP 2025570559A JP 2025570559 A JP2025570559 A JP 2025570559A JP WO2025154399 A5 JPWO2025154399 A5 JP WO2025154399A5
Authority
JP
Japan
Prior art keywords
tin
solder
heat sink
alloy
cooling module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025570559A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025154399A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/041777 external-priority patent/WO2025154399A1/ja
Publication of JPWO2025154399A1 publication Critical patent/JPWO2025154399A1/ja
Publication of JPWO2025154399A5 publication Critical patent/JPWO2025154399A5/ja
Pending legal-status Critical Current

Links

JP2025570559A 2024-01-17 2024-11-26 Pending JPWO2025154399A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024005109 2024-01-17
PCT/JP2024/041777 WO2025154399A1 (ja) 2024-01-17 2024-11-26 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2025154399A1 JPWO2025154399A1 (https=) 2025-07-24
JPWO2025154399A5 true JPWO2025154399A5 (https=) 2026-04-15

Family

ID=96471236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025570559A Pending JPWO2025154399A1 (https=) 2024-01-17 2024-11-26

Country Status (4)

Country Link
US (1) US20260123418A1 (https=)
JP (1) JPWO2025154399A1 (https=)
DE (1) DE112024002029T5 (https=)
WO (1) WO2025154399A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100488518B1 (ko) * 2002-11-14 2005-05-11 삼성전자주식회사 반도체 장치의 방열 시스템
JP2009218257A (ja) * 2008-03-07 2009-09-24 Panasonic Corp 回路モジュールとその製造方法
US20110292612A1 (en) * 2010-05-26 2011-12-01 Lsi Corporation Electronic device having electrically grounded heat sink and method of manufacturing the same
JP5382049B2 (ja) * 2010-06-30 2014-01-08 株式会社デンソー 半導体装置
JP6972622B2 (ja) * 2017-04-03 2021-11-24 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2023127609A (ja) * 2022-03-02 2023-09-14 三菱電機株式会社 半導体装置
JP7830298B2 (ja) * 2022-11-16 2026-03-16 Ａｓｔｅｍｏ株式会社 電気回路体および電力変換装置

Similar Documents

Publication Publication Date Title
US6523608B1 (en) Thermal interface material on a mesh carrier
JP2548350B2 (ja) テープ自動結合に使用される熱放散相互接続テープ
JP5899768B2 (ja) 半導体パッケージ、配線基板ユニット、及び電子機器
JPH0231499B2 (https=)
US10575448B1 (en) Electromagnetic shielding of heat sinks with shape-memory alloy grounding
GB1569452A (en) Conduction-coled circuit package and method of fabrication
CN115249664B (zh) 用于芯片封装的弹性散热盖板、封装结构及封装方法
WO2011040313A1 (ja) 半導体モジュールおよびその製造方法
CN118749132A (zh) 用于将冷却方案施加到一个或多个集成电路组件的方法和用于集成电路冷却的组件
JP2001284525A (ja) 半導体チップおよび半導体装置
JP2004356625A (ja) 半導体装置及びその製造方法
JPH1154673A (ja) 半導体装置
JP3841007B2 (ja) 半導体装置
JP6477105B2 (ja) 半導体装置
JPWO2025154399A5 (https=)
US20220181231A1 (en) Heat dissipation plate and semiconductor device
CN212113696U (zh) 芯片封装结构及中央处理器
TWI743557B (zh) 功率元件封裝結構
JP4645276B2 (ja) 半導体装置
JP2020202329A (ja) 電子制御装置
CN215451393U (zh) 半导体封装结构
JP2006269572A (ja) 熱電変換モジュール、回路基板及び熱電変換モジュールの製造方法
US6291893B1 (en) Power semiconductor device for “flip-chip” connections
CN111384000A (zh) 芯片封装
JP2018060986A (ja) 半導体装置