JPWO2025154399A1 - - Google Patents
Info
- Publication number
- JPWO2025154399A1 JPWO2025154399A1 JP2025570559A JP2025570559A JPWO2025154399A1 JP WO2025154399 A1 JPWO2025154399 A1 JP WO2025154399A1 JP 2025570559 A JP2025570559 A JP 2025570559A JP 2025570559 A JP2025570559 A JP 2025570559A JP WO2025154399 A1 JPWO2025154399 A1 JP WO2025154399A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/258—Metallic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/10—Configurations of laterally-adjacent chips
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024005109 | 2024-01-17 | ||
| PCT/JP2024/041777 WO2025154399A1 (ja) | 2024-01-17 | 2024-11-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025154399A1 true JPWO2025154399A1 (https=) | 2025-07-24 |
| JPWO2025154399A5 JPWO2025154399A5 (https=) | 2026-04-15 |
Family
ID=96471236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025570559A Pending JPWO2025154399A1 (https=) | 2024-01-17 | 2024-11-26 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20260123418A1 (https=) |
| JP (1) | JPWO2025154399A1 (https=) |
| DE (1) | DE112024002029T5 (https=) |
| WO (1) | WO2025154399A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100488518B1 (ko) * | 2002-11-14 | 2005-05-11 | 삼성전자주식회사 | 반도체 장치의 방열 시스템 |
| JP2009218257A (ja) * | 2008-03-07 | 2009-09-24 | Panasonic Corp | 回路モジュールとその製造方法 |
| US20110292612A1 (en) * | 2010-05-26 | 2011-12-01 | Lsi Corporation | Electronic device having electrically grounded heat sink and method of manufacturing the same |
| JP5382049B2 (ja) * | 2010-06-30 | 2014-01-08 | 株式会社デンソー | 半導体装置 |
| JP6972622B2 (ja) * | 2017-04-03 | 2021-11-24 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2023127609A (ja) * | 2022-03-02 | 2023-09-14 | 三菱電機株式会社 | 半導体装置 |
| JP7830298B2 (ja) * | 2022-11-16 | 2026-03-16 | Ａｓｔｅｍｏ株式会社 | 電気回路体および電力変換装置 |
-
2024
- 2024-11-26 DE DE112024002029.1T patent/DE112024002029T5/de active Pending
- 2024-11-26 WO PCT/JP2024/041777 patent/WO2025154399A1/ja active Pending
- 2024-11-26 JP JP2025570559A patent/JPWO2025154399A1/ja active Pending
-
2025
- 2025-12-26 US US19/433,627 patent/US20260123418A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025154399A1 (ja) | 2025-07-24 |
| DE112024002029T5 (de) | 2026-02-19 |
| US20260123418A1 (en) | 2026-04-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260113 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260113 |