DE112024002029T5 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE112024002029T5
DE112024002029T5 DE112024002029.1T DE112024002029T DE112024002029T5 DE 112024002029 T5 DE112024002029 T5 DE 112024002029T5 DE 112024002029 T DE112024002029 T DE 112024002029T DE 112024002029 T5 DE112024002029 T5 DE 112024002029T5
Authority
DE
Germany
Prior art keywords
heat dissipation
conductive part
semiconductor device
electrically conductive
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112024002029.1T
Other languages
German (de)
English (en)
Inventor
Motohito Hori
Mai SAITO
Akira Hirao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE112024002029T5 publication Critical patent/DE112024002029T5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112024002029.1T 2024-01-17 2024-11-26 Halbleitervorrichtung Pending DE112024002029T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2024-005109 2024-01-17
JP2024005109 2024-01-17
PCT/JP2024/041777 WO2025154399A1 (ja) 2024-01-17 2024-11-26 半導体装置

Publications (1)

Publication Number Publication Date
DE112024002029T5 true DE112024002029T5 (de) 2026-02-19

Family

ID=96471236

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112024002029.1T Pending DE112024002029T5 (de) 2024-01-17 2024-11-26 Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US20260123418A1 (https=)
JP (1) JPWO2025154399A1 (https=)
DE (1) DE112024002029T5 (https=)
WO (1) WO2025154399A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100488518B1 (ko) * 2002-11-14 2005-05-11 삼성전자주식회사 반도체 장치의 방열 시스템
JP2009218257A (ja) * 2008-03-07 2009-09-24 Panasonic Corp 回路モジュールとその製造方法
US20110292612A1 (en) * 2010-05-26 2011-12-01 Lsi Corporation Electronic device having electrically grounded heat sink and method of manufacturing the same
JP5382049B2 (ja) * 2010-06-30 2014-01-08 株式会社デンソー 半導体装置
JP6972622B2 (ja) * 2017-04-03 2021-11-24 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2023127609A (ja) * 2022-03-02 2023-09-14 三菱電機株式会社 半導体装置
JP7830298B2 (ja) * 2022-11-16 2026-03-16 Ａｓｔｅｍｏ株式会社 電気回路体および電力変換装置

Also Published As

Publication number Publication date
WO2025154399A1 (ja) 2025-07-24
JPWO2025154399A1 (https=) 2025-07-24
US20260123418A1 (en) 2026-04-30

Similar Documents

Publication Publication Date Title
DE102009033321B4 (de) Leistungshalbleitervorrichtung
DE102012206596B4 (de) Halbleitervorrichtung
DE10310809B4 (de) Leistungshalbleitereinrichtung
DE102012200329B4 (de) Halbleiteranordnung mit einem Heatspreader und Verfahren zur Herstellung einer Halbleiteranordnung
DE102019132837B4 (de) Doppelseitiges Kühlleistungsmodul und Verfahren zu dessen Herstellung
DE112019007709B4 (de) Halbleitervorrichtung
DE112018006370B4 (de) Halbleitereinrichtung
DE102020111652A1 (de) Halbleitergehäuse mit leitfähigem clip mit mehreren ebenen zur kühlung der oberseite
DE102018104509A1 (de) Halbleitervorrichtung
DE102020122125B4 (de) Halbleitermodul
DE112023001614T5 (de) Halbleitervorrichtung
DE10393769T5 (de) Halbleitervorrichtung mit Klemmen zum Verbinden mit externen Elementen
DE102023111192A1 (de) Anordnung einer halbleiter-vorrichtung mit kompressiblem klebstoff
DE112014000862T5 (de) Halbleitervorrichtung
DE102019135373B4 (de) Halbleitervorrichtung und Verfahren zum Herstellen derselben
DE102022101789A1 (de) Halbleitervorrichtung
DE112021000290T5 (de) Halbleitervorrichtung
DE102021128079A1 (de) Verbindungsclip mit drei levels
DE102021006157A1 (de) Mehrfachsubstratgehäusesysteme und verwandte verfahren
DE102019121229B4 (de) Elektronische Vorrichtungen mit elektrisch isolierten Lastelektroden und zugehörige Herstellungsverfahren
DE102021121875B4 (de) Halbleitereinrichtung und herstellungsverfahren einer halbleitereinrichtung
DE102007031490B4 (de) Verfahren zur Herstellung eines Halbleitermoduls
DE102020125371B4 (de) Package mit Pad, welches eine offene Aussparung hat
DE112024002029T5 (de) Halbleitervorrichtung
DE112020002851T5 (de) Integrierte Diodenlaserkühler

Legal Events

Date Code Title Description
R012 Request for examination validly filed