JPWO2025088815A5 - - Google Patents
Info
- Publication number
- JPWO2025088815A5 JPWO2025088815A5 JP2025552748A JP2025552748A JPWO2025088815A5 JP WO2025088815 A5 JPWO2025088815 A5 JP WO2025088815A5 JP 2025552748 A JP2025552748 A JP 2025552748A JP 2025552748 A JP2025552748 A JP 2025552748A JP WO2025088815 A5 JPWO2025088815 A5 JP WO2025088815A5
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- resin composition
- resin film
- composition according
- patterned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/038995 WO2025088815A1 (ja) | 2023-10-27 | 2023-10-27 | 感光性樹脂組成物、パターン硬化物、パターン硬化物の製造方法、及び電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025088815A1 JPWO2025088815A1 (https=) | 2025-05-01 |
| JPWO2025088815A5 true JPWO2025088815A5 (https=) | 2025-12-04 |
Family
ID=95515198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025552748A Pending JPWO2025088815A1 (https=) | 2023-10-27 | 2023-10-27 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025088815A1 (https=) |
| KR (1) | KR20250167604A (https=) |
| CN (1) | CN120936947A (https=) |
| TW (1) | TW202518172A (https=) |
| WO (1) | WO2025088815A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5169446B2 (ja) | 2008-04-28 | 2013-03-27 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品 |
| JP7238316B2 (ja) * | 2018-10-03 | 2023-03-14 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
| JP7639354B2 (ja) * | 2021-01-19 | 2025-03-05 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
| WO2023189126A1 (ja) * | 2022-03-29 | 2023-10-05 | 富士フイルム株式会社 | 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス |
-
2023
- 2023-10-27 CN CN202380096447.0A patent/CN120936947A/zh active Pending
- 2023-10-27 WO PCT/JP2023/038995 patent/WO2025088815A1/ja active Pending
- 2023-10-27 KR KR1020257032089A patent/KR20250167604A/ko active Pending
- 2023-10-27 JP JP2025552748A patent/JPWO2025088815A1/ja active Pending
-
2024
- 2024-10-24 TW TW113140448A patent/TW202518172A/zh unknown