CN120936947A - 感光性树脂组合物、图案固化物、图案固化物的制造方法及电子部件 - Google Patents

感光性树脂组合物、图案固化物、图案固化物的制造方法及电子部件

Info

Publication number
CN120936947A
CN120936947A CN202380096447.0A CN202380096447A CN120936947A CN 120936947 A CN120936947 A CN 120936947A CN 202380096447 A CN202380096447 A CN 202380096447A CN 120936947 A CN120936947 A CN 120936947A
Authority
CN
China
Prior art keywords
group
photosensitive resin
resin composition
general formula
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380096447.0A
Other languages
English (en)
Chinese (zh)
Inventor
吉泽笃太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Actri Microsystems Co ltd
Original Assignee
Actri Microsystems Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Actri Microsystems Co ltd filed Critical Actri Microsystems Co ltd
Publication of CN120936947A publication Critical patent/CN120936947A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
CN202380096447.0A 2023-10-27 2023-10-27 感光性树脂组合物、图案固化物、图案固化物的制造方法及电子部件 Pending CN120936947A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/038995 WO2025088815A1 (ja) 2023-10-27 2023-10-27 感光性樹脂組成物、パターン硬化物、パターン硬化物の製造方法、及び電子部品

Publications (1)

Publication Number Publication Date
CN120936947A true CN120936947A (zh) 2025-11-11

Family

ID=95515198

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380096447.0A Pending CN120936947A (zh) 2023-10-27 2023-10-27 感光性树脂组合物、图案固化物、图案固化物的制造方法及电子部件

Country Status (5)

Country Link
JP (1) JPWO2025088815A1 (https=)
KR (1) KR20250167604A (https=)
CN (1) CN120936947A (https=)
TW (1) TW202518172A (https=)
WO (1) WO2025088815A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5169446B2 (ja) 2008-04-28 2013-03-27 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品
JP7238316B2 (ja) * 2018-10-03 2023-03-14 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP7639354B2 (ja) * 2021-01-19 2025-03-05 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
WO2023189126A1 (ja) * 2022-03-29 2023-10-05 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス

Also Published As

Publication number Publication date
WO2025088815A1 (ja) 2025-05-01
KR20250167604A (ko) 2025-12-01
TW202518172A (zh) 2025-05-01
JPWO2025088815A1 (https=) 2025-05-01

Similar Documents

Publication Publication Date Title
JP7616311B2 (ja) 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN113196170B (zh) 感光性树脂组合物、图案固化物的制造方法、固化物、层间绝缘膜、覆盖涂层、表面保护膜及电子部件
JP2018084626A (ja) 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN113168102B (zh) 感光性树脂组合物、图案固化物的制造方法、固化物、层间绝缘膜、覆盖涂层、表面保护膜及电子部件
JP2020056934A (ja) パターン硬化膜の製造方法、感光性樹脂組成物、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN113168092B (zh) 感光性树脂组合物、图案固化物的制造方法、固化物、层间绝缘膜、覆盖涂层、表面保护膜及电子部件
JP2018146964A (ja) 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN113168101B (zh) 感光性树脂组合物、图案固化膜的制造方法、固化膜、层间绝缘膜、覆盖涂层、表面保护膜及电子部件
US12386257B2 (en) Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component
JP7035632B2 (ja) 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN120936947A (zh) 感光性树脂组合物、图案固化物、图案固化物的制造方法及电子部件
CN121039567A (zh) 感光性树脂组合物、图案固化物、图案固化物的制造方法和电子部件
JP7009803B2 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN120858317A (zh) 感光性树脂组合物、图案固化物的制造方法、固化物及电子部件
WO2025182049A1 (ja) パターン硬化物の製造方法、現像剤の選択方法、溶剤の選択方法及び感光性樹脂組成物
WO2025088705A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、及び電子部品
WO2025134339A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
WO2025099883A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
JP7852394B2 (ja) 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
WO2025182050A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
WO2025182048A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、パターン硬化物、及び電子部品
WO2025243482A1 (ja) 樹脂組成物、硬化物、硬化物の製造方法、及び電子部品
TW202528439A (zh) 樹脂組成物、硬化物、硬化物的製造方法及電子零件
WO2025243483A1 (ja) 樹脂組成物、硬化物、硬化物の製造方法、及び電子部品
TW202530329A (zh) 樹脂組成物、硬化物、硬化物的製造方法及電子零件

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination