JPWO2025062534A5 - - Google Patents

Info

Publication number
JPWO2025062534A5
JPWO2025062534A5 JP2025547049A JP2025547049A JPWO2025062534A5 JP WO2025062534 A5 JPWO2025062534 A5 JP WO2025062534A5 JP 2025547049 A JP2025547049 A JP 2025547049A JP 2025547049 A JP2025547049 A JP 2025547049A JP WO2025062534 A5 JPWO2025062534 A5 JP WO2025062534A5
Authority
JP
Japan
Prior art keywords
heat transfer
transfer fluid
recess
wafer mounting
platform according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025547049A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025062534A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/034118 external-priority patent/WO2025062534A1/ja
Publication of JPWO2025062534A1 publication Critical patent/JPWO2025062534A1/ja
Publication of JPWO2025062534A5 publication Critical patent/JPWO2025062534A5/ja
Pending legal-status Critical Current

Links

JP2025547049A 2023-09-20 2023-09-20 Pending JPWO2025062534A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/034118 WO2025062534A1 (ja) 2023-09-20 2023-09-20 ウエハ載置台

Publications (2)

Publication Number Publication Date
JPWO2025062534A1 JPWO2025062534A1 (https=) 2025-03-27
JPWO2025062534A5 true JPWO2025062534A5 (https=) 2026-04-22

Family

ID=95072460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025547049A Pending JPWO2025062534A1 (https=) 2023-09-20 2023-09-20

Country Status (2)

Country Link
JP (1) JPWO2025062534A1 (https=)
WO (1) WO2025062534A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738751A (en) * 1994-09-01 1998-04-14 Applied Materials, Inc. Substrate support having improved heat transfer
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP7486018B2 (ja) * 2018-12-21 2024-05-17 Toto株式会社 静電チャック
JP7407529B2 (ja) * 2019-07-10 2024-01-04 東京エレクトロン株式会社 基板載置台、基板処理装置及び温度制御方法
WO2022215633A1 (ja) * 2021-04-09 2022-10-13 東京エレクトロン株式会社 静電チャックおよび基板処理装置

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