JPWO2025062534A1 - - Google Patents

Info

Publication number
JPWO2025062534A1
JPWO2025062534A1 JP2025547049A JP2025547049A JPWO2025062534A1 JP WO2025062534 A1 JPWO2025062534 A1 JP WO2025062534A1 JP 2025547049 A JP2025547049 A JP 2025547049A JP 2025547049 A JP2025547049 A JP 2025547049A JP WO2025062534 A1 JPWO2025062534 A1 JP WO2025062534A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025547049A
Other languages
Japanese (ja)
Other versions
JPWO2025062534A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025062534A1 publication Critical patent/JPWO2025062534A1/ja
Publication of JPWO2025062534A5 publication Critical patent/JPWO2025062534A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
JP2025547049A 2023-09-20 2023-09-20 Pending JPWO2025062534A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/034118 WO2025062534A1 (ja) 2023-09-20 2023-09-20 ウエハ載置台

Publications (2)

Publication Number Publication Date
JPWO2025062534A1 true JPWO2025062534A1 (https=) 2025-03-27
JPWO2025062534A5 JPWO2025062534A5 (https=) 2026-04-22

Family

ID=95072460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025547049A Pending JPWO2025062534A1 (https=) 2023-09-20 2023-09-20

Country Status (2)

Country Link
JP (1) JPWO2025062534A1 (https=)
WO (1) WO2025062534A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738751A (en) * 1994-09-01 1998-04-14 Applied Materials, Inc. Substrate support having improved heat transfer
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP7486018B2 (ja) * 2018-12-21 2024-05-17 Toto株式会社 静電チャック
JP7407529B2 (ja) * 2019-07-10 2024-01-04 東京エレクトロン株式会社 基板載置台、基板処理装置及び温度制御方法
WO2022215633A1 (ja) * 2021-04-09 2022-10-13 東京エレクトロン株式会社 静電チャックおよび基板処理装置

Also Published As

Publication number Publication date
WO2025062534A1 (ja) 2025-03-27

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Effective date: 20260121

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