JPWO2025022820A5 - - Google Patents

Info

Publication number
JPWO2025022820A5
JPWO2025022820A5 JP2025535605A JP2025535605A JPWO2025022820A5 JP WO2025022820 A5 JPWO2025022820 A5 JP WO2025022820A5 JP 2025535605 A JP2025535605 A JP 2025535605A JP 2025535605 A JP2025535605 A JP 2025535605A JP WO2025022820 A5 JPWO2025022820 A5 JP WO2025022820A5
Authority
JP
Japan
Prior art keywords
resin layer
resin
layer
conductor
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025535605A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025022820A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/020154 external-priority patent/WO2025022820A1/ja
Publication of JPWO2025022820A1 publication Critical patent/JPWO2025022820A1/ja
Publication of JPWO2025022820A5 publication Critical patent/JPWO2025022820A5/ja
Pending legal-status Critical Current

Links

JP2025535605A 2023-07-25 2024-06-03 Pending JPWO2025022820A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023120566 2023-07-25
PCT/JP2024/020154 WO2025022820A1 (ja) 2023-07-25 2024-06-03 樹脂積層基板及び樹脂積層基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025022820A1 JPWO2025022820A1 (https=) 2025-01-30
JPWO2025022820A5 true JPWO2025022820A5 (https=) 2026-02-12

Family

ID=94374820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025535605A Pending JPWO2025022820A1 (https=) 2023-07-25 2024-06-03

Country Status (4)

Country Link
US (1) US20260089834A1 (https=)
JP (1) JPWO2025022820A1 (https=)
CN (1) CN121420631A (https=)
WO (1) WO2025022820A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202439A (ja) * 1993-12-27 1995-08-04 Furukawa Electric Co Ltd:The 高周波用多層回路基板
JP2005050860A (ja) * 2003-07-29 2005-02-24 Nitto Denko Corp 多孔質配線板及びそれを用いた電子部品
CN116249617A (zh) * 2021-06-09 2023-06-09 株式会社村田制作所 液晶聚合物膜、带导体层的液晶聚合物膜和层叠基板
WO2022260085A1 (ja) * 2021-06-09 2022-12-15 株式会社村田製作所 多孔質樹脂シート、金属層付き多孔質樹脂シート、電子回路基板、多孔質樹脂シートの製造方法、金属層付き多孔質樹脂シートの製造方法、及び、電子回路基板の製造方法

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