JPWO2025013919A5 - - Google Patents

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Publication number
JPWO2025013919A5
JPWO2025013919A5 JP2024564603A JP2024564603A JPWO2025013919A5 JP WO2025013919 A5 JPWO2025013919 A5 JP WO2025013919A5 JP 2024564603 A JP2024564603 A JP 2024564603A JP 2024564603 A JP2024564603 A JP 2024564603A JP WO2025013919 A5 JPWO2025013919 A5 JP WO2025013919A5
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JP
Japan
Prior art keywords
manufacturing
layer
heat dissipation
substrate according
circuit layer
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Pending
Application number
JP2024564603A
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English (en)
Japanese (ja)
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JPWO2025013919A1 (https=
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Priority claimed from PCT/JP2024/025088 external-priority patent/WO2025013919A1/ja
Publication of JPWO2025013919A1 publication Critical patent/JPWO2025013919A1/ja
Publication of JPWO2025013919A5 publication Critical patent/JPWO2025013919A5/ja
Pending legal-status Critical Current

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JP2024564603A 2023-07-12 2024-07-11 Pending JPWO2025013919A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023114674 2023-07-12
PCT/JP2024/025088 WO2025013919A1 (ja) 2023-07-12 2024-07-11 基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025013919A1 JPWO2025013919A1 (https=) 2025-01-16
JPWO2025013919A5 true JPWO2025013919A5 (https=) 2025-06-17

Family

ID=94215900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024564603A Pending JPWO2025013919A1 (https=) 2023-07-12 2024-07-11

Country Status (2)

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JP (1) JPWO2025013919A1 (https=)
WO (1) WO2025013919A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002335056A (ja) * 2001-05-08 2002-11-22 Nitto Shinko Kk 金属ベース基板及びその製造方法
JP2013251368A (ja) * 2012-05-31 2013-12-12 Hitachi Chemical Co Ltd 半導体装置の製造方法及びそれに用いる熱硬化性樹脂組成物並びにそれにより得られる半導体装置
US20140069693A1 (en) * 2012-09-07 2014-03-13 E I Du Pont De Nemours And Company Multi-layer article comprising discrete conductive pathways contacting a curable composition comprising bis-benzoxazine
WO2018189797A1 (ja) * 2017-04-10 2018-10-18 日立化成株式会社 回路基板の製造方法、回路シート及び回路基板
JP2020088149A (ja) * 2018-11-26 2020-06-04 日本発條株式会社 金属ベース回路基板の製造方法
WO2023090013A1 (ja) * 2021-11-19 2023-05-25 住友ベークライト株式会社 ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法

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