JPWO2025013919A1 - - Google Patents
Info
- Publication number
- JPWO2025013919A1 JPWO2025013919A1 JP2024564603A JP2024564603A JPWO2025013919A1 JP WO2025013919 A1 JPWO2025013919 A1 JP WO2025013919A1 JP 2024564603 A JP2024564603 A JP 2024564603A JP 2024564603 A JP2024564603 A JP 2024564603A JP WO2025013919 A1 JPWO2025013919 A1 JP WO2025013919A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023114674 | 2023-07-12 | ||
| PCT/JP2024/025088 WO2025013919A1 (ja) | 2023-07-12 | 2024-07-11 | 基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025013919A1 true JPWO2025013919A1 (https=) | 2025-01-16 |
| JPWO2025013919A5 JPWO2025013919A5 (https=) | 2025-06-17 |
Family
ID=94215900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024564603A Pending JPWO2025013919A1 (https=) | 2023-07-12 | 2024-07-11 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025013919A1 (https=) |
| WO (1) | WO2025013919A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013251368A (ja) * | 2012-05-31 | 2013-12-12 | Hitachi Chemical Co Ltd | 半導体装置の製造方法及びそれに用いる熱硬化性樹脂組成物並びにそれにより得られる半導体装置 |
| WO2018189797A1 (ja) * | 2017-04-10 | 2018-10-18 | 日立化成株式会社 | 回路基板の製造方法、回路シート及び回路基板 |
| WO2020111045A1 (ja) * | 2018-11-26 | 2020-06-04 | 日本発條株式会社 | 金属ベース回路基板の製造方法 |
| WO2023090013A1 (ja) * | 2021-11-19 | 2023-05-25 | 住友ベークライト株式会社 | ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002335056A (ja) * | 2001-05-08 | 2002-11-22 | Nitto Shinko Kk | 金属ベース基板及びその製造方法 |
| US20140069693A1 (en) * | 2012-09-07 | 2014-03-13 | E I Du Pont De Nemours And Company | Multi-layer article comprising discrete conductive pathways contacting a curable composition comprising bis-benzoxazine |
-
2024
- 2024-07-11 JP JP2024564603A patent/JPWO2025013919A1/ja active Pending
- 2024-07-11 WO PCT/JP2024/025088 patent/WO2025013919A1/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013251368A (ja) * | 2012-05-31 | 2013-12-12 | Hitachi Chemical Co Ltd | 半導体装置の製造方法及びそれに用いる熱硬化性樹脂組成物並びにそれにより得られる半導体装置 |
| WO2018189797A1 (ja) * | 2017-04-10 | 2018-10-18 | 日立化成株式会社 | 回路基板の製造方法、回路シート及び回路基板 |
| WO2020111045A1 (ja) * | 2018-11-26 | 2020-06-04 | 日本発條株式会社 | 金属ベース回路基板の製造方法 |
| WO2023090013A1 (ja) * | 2021-11-19 | 2023-05-25 | 住友ベークライト株式会社 | ヒートシンク付回路基板およびその製造方法、ならびに半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025013919A1 (ja) | 2025-01-16 |
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