JPWO2025009216A5 - - Google Patents

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JPWO2025009216A5
JPWO2025009216A5 JP2024522669A JP2024522669A JPWO2025009216A5 JP WO2025009216 A5 JPWO2025009216 A5 JP WO2025009216A5 JP 2024522669 A JP2024522669 A JP 2024522669A JP 2024522669 A JP2024522669 A JP 2024522669A JP WO2025009216 A5 JPWO2025009216 A5 JP WO2025009216A5
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Japan
Prior art keywords
thermally conductive
component
conductive composition
mass
composition according
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JP2024522669A
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English (en)
Japanese (ja)
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JP7503224B1 (ja
JPWO2025009216A1 (https=
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Priority claimed from PCT/JP2024/007512 external-priority patent/WO2025009216A1/ja
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Publication of JPWO2025009216A1 publication Critical patent/JPWO2025009216A1/ja
Publication of JPWO2025009216A5 publication Critical patent/JPWO2025009216A5/ja
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JP2024522669A 2023-07-06 2024-02-29 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 Active JP7503224B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023111523 2023-07-06
JP2023111523 2023-07-06
PCT/JP2024/007512 WO2025009216A1 (ja) 2023-07-06 2024-02-29 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法

Publications (3)

Publication Number Publication Date
JP7503224B1 JP7503224B1 (ja) 2024-06-19
JPWO2025009216A1 JPWO2025009216A1 (https=) 2025-01-09
JPWO2025009216A5 true JPWO2025009216A5 (https=) 2025-06-10

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ID=91483533

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JP2024522669A Active JP7503224B1 (ja) 2023-07-06 2024-02-29 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法

Country Status (3)

Country Link
EP (1) EP4549519A4 (https=)
JP (1) JP7503224B1 (https=)
CN (1) CN119731274A (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7082563B2 (ja) * 2018-12-04 2022-06-08 信越化学工業株式会社 熱伝導性シリコーン組成物の硬化物
JP7303159B2 (ja) * 2020-06-18 2023-07-04 信越化学工業株式会社 シリコーン組成物、及び高熱伝導性を有する熱伝導性シリコーン硬化物
EP4321572A4 (en) * 2021-04-09 2025-04-23 Dow Toray Co., Ltd. Curable organopolysiloxane composition, thermally conductive element, and heat dissipation structure

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