JP7503224B1 - 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 - Google Patents

熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 Download PDF

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JP7503224B1
JP7503224B1 JP2024522669A JP2024522669A JP7503224B1 JP 7503224 B1 JP7503224 B1 JP 7503224B1 JP 2024522669 A JP2024522669 A JP 2024522669A JP 2024522669 A JP2024522669 A JP 2024522669A JP 7503224 B1 JP7503224 B1 JP 7503224B1
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thermally conductive
component
mass
conductive composition
sheet
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貴嗣 加藤
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Fuji Polymer Industries Co Ltd
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/28Nitrogen-containing compounds
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    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2300/00Characterised by the use of unspecified polymers
    • C08J2300/24Thermosetting resins
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    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
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    • C08K3/22Oxides; Hydroxides of metals
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K7/00Use of ingredients characterised by shape
    • C08K7/16Solid spheres
    • C08K7/18Solid spheres inorganic

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  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2024522669A 2023-07-06 2024-02-29 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法 Active JP7503224B1 (ja)

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JP2023111523 2023-07-06
JP2023111523 2023-07-06
PCT/JP2024/007512 WO2025009216A1 (ja) 2023-07-06 2024-02-29 熱伝導性組成物及びこれを用いた熱伝導性シートとその製造方法

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JP7503224B1 true JP7503224B1 (ja) 2024-06-19
JPWO2025009216A1 JPWO2025009216A1 (https=) 2025-01-09
JPWO2025009216A5 JPWO2025009216A5 (https=) 2025-06-10

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020090584A (ja) * 2018-12-04 2020-06-11 信越化学工業株式会社 熱伝導性シリコーン組成物の硬化物
WO2021256391A1 (ja) * 2020-06-18 2021-12-23 信越化学工業株式会社 シリコーン組成物、及び高熱伝導性を有する熱伝導性シリコーン硬化物
WO2022215510A1 (ja) * 2021-04-09 2022-10-13 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020090584A (ja) * 2018-12-04 2020-06-11 信越化学工業株式会社 熱伝導性シリコーン組成物の硬化物
WO2021256391A1 (ja) * 2020-06-18 2021-12-23 信越化学工業株式会社 シリコーン組成物、及び高熱伝導性を有する熱伝導性シリコーン硬化物
WO2022215510A1 (ja) * 2021-04-09 2022-10-13 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体

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EP4549519A1 (en) 2025-05-07
CN119731274A (zh) 2025-03-28
JPWO2025009216A1 (https=) 2025-01-09

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