JPWO2024203120A5 - - Google Patents

Info

Publication number
JPWO2024203120A5
JPWO2024203120A5 JP2025510173A JP2025510173A JPWO2024203120A5 JP WO2024203120 A5 JPWO2024203120 A5 JP WO2024203120A5 JP 2025510173 A JP2025510173 A JP 2025510173A JP 2025510173 A JP2025510173 A JP 2025510173A JP WO2024203120 A5 JPWO2024203120 A5 JP WO2024203120A5
Authority
JP
Japan
Prior art keywords
flr
region
curved portion
electrode
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510173A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024203120A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/008808 external-priority patent/WO2024203120A1/ja
Publication of JPWO2024203120A1 publication Critical patent/JPWO2024203120A1/ja
Publication of JPWO2024203120A5 publication Critical patent/JPWO2024203120A5/ja
Pending legal-status Critical Current

Links

JP2025510173A 2023-03-30 2024-03-07 Pending JPWO2024203120A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023056392 2023-03-30
PCT/JP2024/008808 WO2024203120A1 (ja) 2023-03-30 2024-03-07 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024203120A1 JPWO2024203120A1 (https=) 2024-10-03
JPWO2024203120A5 true JPWO2024203120A5 (https=) 2025-12-26

Family

ID=92905631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510173A Pending JPWO2024203120A1 (https=) 2023-03-30 2024-03-07

Country Status (4)

Country Link
US (1) US20260020294A1 (https=)
JP (1) JPWO2024203120A1 (https=)
CN (1) CN120937526A (https=)
WO (1) WO2024203120A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5188037B2 (ja) * 2006-06-20 2013-04-24 株式会社東芝 半導体装置
JP5205856B2 (ja) * 2007-01-11 2013-06-05 富士電機株式会社 電力用半導体素子
JP2009289904A (ja) * 2008-05-28 2009-12-10 Toshiba Corp 半導体装置
JP6091395B2 (ja) * 2013-10-07 2017-03-08 三菱電機株式会社 半導体装置およびその製造方法
EP3084833B1 (en) * 2013-12-16 2017-09-13 ABB Schweiz AG Edge termination for semiconductor devices and corresponding fabrication method
CN106409884B (zh) * 2016-11-07 2019-06-28 株洲中车时代电气股份有限公司 一种功率半导体器件终端结构

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