JPWO2024177013A1 - - Google Patents

Info

Publication number
JPWO2024177013A1
JPWO2024177013A1 JP2024542211A JP2024542211A JPWO2024177013A1 JP WO2024177013 A1 JPWO2024177013 A1 JP WO2024177013A1 JP 2024542211 A JP2024542211 A JP 2024542211A JP 2024542211 A JP2024542211 A JP 2024542211A JP WO2024177013 A1 JPWO2024177013 A1 JP WO2024177013A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024542211A
Other languages
Japanese (ja)
Other versions
JPWO2024177013A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024177013A1 publication Critical patent/JPWO2024177013A1/ja
Publication of JPWO2024177013A5 publication Critical patent/JPWO2024177013A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2024542211A 2023-02-20 2024-02-19 Pending JPWO2024177013A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023024048 2023-02-20
PCT/JP2024/005799 WO2024177013A1 (ja) 2023-02-20 2024-02-19 半導体パッケージ、及びモジュール

Publications (2)

Publication Number Publication Date
JPWO2024177013A1 true JPWO2024177013A1 (enrdf_load_stackoverflow) 2024-08-29
JPWO2024177013A5 JPWO2024177013A5 (enrdf_load_stackoverflow) 2025-01-29

Family

ID=92501123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024542211A Pending JPWO2024177013A1 (enrdf_load_stackoverflow) 2023-02-20 2024-02-19

Country Status (2)

Country Link
JP (1) JPWO2024177013A1 (enrdf_load_stackoverflow)
WO (1) WO2024177013A1 (enrdf_load_stackoverflow)

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110763U (enrdf_load_stackoverflow) * 1978-01-25 1979-08-03
JPS5744564U (enrdf_load_stackoverflow) * 1980-08-27 1982-03-11
JPS5998565A (ja) * 1982-11-27 1984-06-06 Toshiba Corp 光結合素子
JPS62101265U (enrdf_load_stackoverflow) * 1985-12-17 1987-06-27
JPH01174956U (enrdf_load_stackoverflow) * 1988-05-30 1989-12-13
JPH04364793A (ja) * 1991-06-12 1992-12-17 Fujitsu Ten Ltd 電子部品の実装構造
JPH0633083U (ja) * 1992-10-05 1994-04-28 株式会社トーキン 電流検出器
JPH0846091A (ja) * 1994-07-27 1996-02-16 Hitachi Ltd ボールグリッドアレイ半導体装置
JPH08233865A (ja) * 1995-02-28 1996-09-13 Victor Co Of Japan Ltd 電流検知ユニット
JPH09307969A (ja) * 1996-05-16 1997-11-28 Matsushita Electric Ind Co Ltd 自動検針装置
JPH1084128A (ja) * 1996-09-06 1998-03-31 Yokogawa Electric Corp フォトカプラ
JP2000277870A (ja) * 1999-03-24 2000-10-06 Murata Mach Ltd 印刷回路基板
JP2002040058A (ja) * 2000-05-17 2002-02-06 Sanken Electric Co Ltd ホ−ル素子を備えた電流検出装置
JP2004077184A (ja) * 2002-08-12 2004-03-11 Furukawa Electric Co Ltd:The 電流検出センサ
JP2004228113A (ja) * 2003-01-20 2004-08-12 Rion Co Ltd プリント基板を用いた絶縁構造
JP2007171156A (ja) * 2005-11-22 2007-07-05 Asahi Kasei Corp 電流検出素子及びその製造方法
JP2011129584A (ja) * 2009-12-15 2011-06-30 Renesas Electronics Corp 半導体装置及び通信方法
WO2013008466A1 (ja) * 2011-07-13 2013-01-17 旭化成エレクトロニクス株式会社 電流センサ用基板及び電流センサ
DE102011079050A1 (de) * 2011-07-13 2013-01-17 Robert Bosch Gmbh Verfahren zum Bestücken einer Leiterplatte
WO2013172114A1 (ja) * 2012-05-18 2013-11-21 アルプス・グリーンデバイス株式会社 電流センサ
US20130333932A1 (en) * 2012-06-18 2013-12-19 Philip W. Johnson Printed circuit board and methods of manufacturing the same
JP2014192283A (ja) * 2013-03-27 2014-10-06 Nec Commun Syst Ltd 電子機器、実装基板、及び実装基板の製造方法
WO2015198609A1 (ja) * 2014-06-27 2015-12-30 旭化成エレクトロニクス株式会社 電流センサ
JP2018522423A (ja) * 2015-08-07 2018-08-09 ヴィシェイ デール エレクトロニクス エルエルシー 成形体、および高電圧用途を対象とする、成形体を有する電気装置
JP2019087636A (ja) * 2017-11-07 2019-06-06 富士電機株式会社 半導体パッケージ
JP2020092160A (ja) * 2018-12-05 2020-06-11 日本電産株式会社 モータ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226803A (ja) * 1992-02-10 1993-09-03 Matsushita Electric Works Ltd 実装回路基板
JPH10308490A (ja) * 1997-05-02 1998-11-17 Shindengen Electric Mfg Co Ltd 半導体デバイス
JP2002329815A (ja) * 2001-05-01 2002-11-15 Sony Corp 半導体装置と、その製造方法、及びその製造装置
CH698504B1 (de) * 2006-05-16 2009-08-31 Melexis Technologies Sa Vorrichtung zur Strommessung.
JP5906910B2 (ja) * 2012-04-09 2016-04-20 株式会社デンソー 電子装置
JP2014154732A (ja) * 2013-02-08 2014-08-25 Toshiba Corp 電子機器および半導体電子部品
JP2021082794A (ja) * 2019-11-22 2021-05-27 株式会社デンソー 電子部品および電子装置
JP7527916B2 (ja) * 2020-09-29 2024-08-05 ローム株式会社 半導体装置
US11519946B1 (en) * 2021-08-23 2022-12-06 Allegro Microsystems, Llc Packaged current sensor integrated circuit

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110763U (enrdf_load_stackoverflow) * 1978-01-25 1979-08-03
JPS5744564U (enrdf_load_stackoverflow) * 1980-08-27 1982-03-11
JPS5998565A (ja) * 1982-11-27 1984-06-06 Toshiba Corp 光結合素子
JPS62101265U (enrdf_load_stackoverflow) * 1985-12-17 1987-06-27
JPH01174956U (enrdf_load_stackoverflow) * 1988-05-30 1989-12-13
JPH04364793A (ja) * 1991-06-12 1992-12-17 Fujitsu Ten Ltd 電子部品の実装構造
JPH0633083U (ja) * 1992-10-05 1994-04-28 株式会社トーキン 電流検出器
JPH0846091A (ja) * 1994-07-27 1996-02-16 Hitachi Ltd ボールグリッドアレイ半導体装置
JPH08233865A (ja) * 1995-02-28 1996-09-13 Victor Co Of Japan Ltd 電流検知ユニット
JPH09307969A (ja) * 1996-05-16 1997-11-28 Matsushita Electric Ind Co Ltd 自動検針装置
JPH1084128A (ja) * 1996-09-06 1998-03-31 Yokogawa Electric Corp フォトカプラ
JP2000277870A (ja) * 1999-03-24 2000-10-06 Murata Mach Ltd 印刷回路基板
JP2002040058A (ja) * 2000-05-17 2002-02-06 Sanken Electric Co Ltd ホ−ル素子を備えた電流検出装置
JP2004077184A (ja) * 2002-08-12 2004-03-11 Furukawa Electric Co Ltd:The 電流検出センサ
JP2004228113A (ja) * 2003-01-20 2004-08-12 Rion Co Ltd プリント基板を用いた絶縁構造
JP2007171156A (ja) * 2005-11-22 2007-07-05 Asahi Kasei Corp 電流検出素子及びその製造方法
JP2011129584A (ja) * 2009-12-15 2011-06-30 Renesas Electronics Corp 半導体装置及び通信方法
WO2013008466A1 (ja) * 2011-07-13 2013-01-17 旭化成エレクトロニクス株式会社 電流センサ用基板及び電流センサ
DE102011079050A1 (de) * 2011-07-13 2013-01-17 Robert Bosch Gmbh Verfahren zum Bestücken einer Leiterplatte
WO2013172114A1 (ja) * 2012-05-18 2013-11-21 アルプス・グリーンデバイス株式会社 電流センサ
US20130333932A1 (en) * 2012-06-18 2013-12-19 Philip W. Johnson Printed circuit board and methods of manufacturing the same
JP2014192283A (ja) * 2013-03-27 2014-10-06 Nec Commun Syst Ltd 電子機器、実装基板、及び実装基板の製造方法
WO2015198609A1 (ja) * 2014-06-27 2015-12-30 旭化成エレクトロニクス株式会社 電流センサ
JP2018522423A (ja) * 2015-08-07 2018-08-09 ヴィシェイ デール エレクトロニクス エルエルシー 成形体、および高電圧用途を対象とする、成形体を有する電気装置
JP2019087636A (ja) * 2017-11-07 2019-06-06 富士電機株式会社 半導体パッケージ
JP2020092160A (ja) * 2018-12-05 2020-06-11 日本電産株式会社 モータ

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Publication number Publication date
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