JPWO2024150635A1 - - Google Patents

Info

Publication number
JPWO2024150635A1
JPWO2024150635A1 JP2024570123A JP2024570123A JPWO2024150635A1 JP WO2024150635 A1 JPWO2024150635 A1 JP WO2024150635A1 JP 2024570123 A JP2024570123 A JP 2024570123A JP 2024570123 A JP2024570123 A JP 2024570123A JP WO2024150635 A1 JPWO2024150635 A1 JP WO2024150635A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024570123A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024150635A1 publication Critical patent/JPWO2024150635A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2024570123A 2023-01-10 2023-12-21 Pending JPWO2024150635A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023001728 2023-01-10
PCT/JP2023/045866 WO2024150635A1 (ja) 2023-01-10 2023-12-21 処理液、処理液収容体

Publications (1)

Publication Number Publication Date
JPWO2024150635A1 true JPWO2024150635A1 (cg-RX-API-DMAC7.html) 2024-07-18

Family

ID=91896859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024570123A Pending JPWO2024150635A1 (cg-RX-API-DMAC7.html) 2023-01-10 2023-12-21

Country Status (5)

Country Link
US (1) US20250321487A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024150635A1 (cg-RX-API-DMAC7.html)
KR (1) KR20250111202A (cg-RX-API-DMAC7.html)
TW (1) TW202441326A (cg-RX-API-DMAC7.html)
WO (1) WO2024150635A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202617959A (zh) * 2024-10-21 2026-05-01 日商Ｊｓｒ股份有限公司 半導體處理用組成物及處理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5698070B2 (ja) * 2011-05-11 2015-04-08 株式会社Adeka ポジ型感光性組成物及びその硬化物
US11009796B2 (en) * 2017-09-22 2021-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Method for forming semiconductor structure
JP7274920B2 (ja) * 2019-04-11 2023-05-17 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法
JP7649752B2 (ja) 2019-04-12 2025-03-21 インプリア・コーポレイション 有機金属フォトレジスト現像剤組成物及び処理方法
JP7535933B2 (ja) * 2020-12-17 2024-08-19 東京エレクトロン株式会社 現像方法及び基板処理システム
JP7179147B1 (ja) * 2021-12-14 2022-11-28 東京応化工業株式会社 金属レジスト除去用洗浄液、及び該洗浄液を用いた洗浄方法

Also Published As

Publication number Publication date
WO2024150635A1 (ja) 2024-07-18
US20250321487A1 (en) 2025-10-16
TW202441326A (zh) 2024-10-16
KR20250111202A (ko) 2025-07-22

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