KR20250111202A - 처리액, 처리액 수용체 - Google Patents

처리액, 처리액 수용체

Info

Publication number
KR20250111202A
KR20250111202A KR1020257020866A KR20257020866A KR20250111202A KR 20250111202 A KR20250111202 A KR 20250111202A KR 1020257020866 A KR1020257020866 A KR 1020257020866A KR 20257020866 A KR20257020866 A KR 20257020866A KR 20250111202 A KR20250111202 A KR 20250111202A
Authority
KR
South Korea
Prior art keywords
treatment solution
mass
content
treatment
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257020866A
Other languages
English (en)
Korean (ko)
Inventor
아키히코 오츠
테츠야 카미무라
료 사이토
Original Assignee
후지필름 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지필름 가부시키가이샤 filed Critical 후지필름 가부시키가이샤
Publication of KR20250111202A publication Critical patent/KR20250111202A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020257020866A 2023-01-10 2023-12-21 처리액, 처리액 수용체 Pending KR20250111202A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023001728 2023-01-10
JPJP-P-2023-001728 2023-01-10
PCT/JP2023/045866 WO2024150635A1 (ja) 2023-01-10 2023-12-21 処理液、処理液収容体

Publications (1)

Publication Number Publication Date
KR20250111202A true KR20250111202A (ko) 2025-07-22

Family

ID=91896859

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257020866A Pending KR20250111202A (ko) 2023-01-10 2023-12-21 처리액, 처리액 수용체

Country Status (5)

Country Link
US (1) US20250321487A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024150635A1 (cg-RX-API-DMAC7.html)
KR (1) KR20250111202A (cg-RX-API-DMAC7.html)
TW (1) TW202441326A (cg-RX-API-DMAC7.html)
WO (1) WO2024150635A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202617959A (zh) * 2024-10-21 2026-05-01 日商Ｊｓｒ股份有限公司 半導體處理用組成物及處理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022526031A (ja) 2019-04-12 2022-05-20 インプリア・コーポレイション 有機金属フォトレジスト現像剤組成物及び処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5698070B2 (ja) * 2011-05-11 2015-04-08 株式会社Adeka ポジ型感光性組成物及びその硬化物
US11009796B2 (en) * 2017-09-22 2021-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Method for forming semiconductor structure
JP7274920B2 (ja) * 2019-04-11 2023-05-17 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法
JP7535933B2 (ja) * 2020-12-17 2024-08-19 東京エレクトロン株式会社 現像方法及び基板処理システム
JP7179147B1 (ja) * 2021-12-14 2022-11-28 東京応化工業株式会社 金属レジスト除去用洗浄液、及び該洗浄液を用いた洗浄方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022526031A (ja) 2019-04-12 2022-05-20 インプリア・コーポレイション 有機金属フォトレジスト現像剤組成物及び処理方法

Also Published As

Publication number Publication date
WO2024150635A1 (ja) 2024-07-18
US20250321487A1 (en) 2025-10-16
TW202441326A (zh) 2024-10-16
JPWO2024150635A1 (cg-RX-API-DMAC7.html) 2024-07-18

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