TW202441326A - 處理液、處理液收容體 - Google Patents

處理液、處理液收容體 Download PDF

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Publication number
TW202441326A
TW202441326A TW113100343A TW113100343A TW202441326A TW 202441326 A TW202441326 A TW 202441326A TW 113100343 A TW113100343 A TW 113100343A TW 113100343 A TW113100343 A TW 113100343A TW 202441326 A TW202441326 A TW 202441326A
Authority
TW
Taiwan
Prior art keywords
mass
content
treatment
treatment liquid
acid
Prior art date
Application number
TW113100343A
Other languages
English (en)
Chinese (zh)
Inventor
大津暁彦
上村哲也
西塔亮
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202441326A publication Critical patent/TW202441326A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW113100343A 2023-01-10 2024-01-04 處理液、處理液收容體 TW202441326A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023001728 2023-01-10
JP2023-001728 2023-01-10

Publications (1)

Publication Number Publication Date
TW202441326A true TW202441326A (zh) 2024-10-16

Family

ID=91896859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113100343A TW202441326A (zh) 2023-01-10 2024-01-04 處理液、處理液收容體

Country Status (5)

Country Link
US (1) US20250321487A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024150635A1 (cg-RX-API-DMAC7.html)
KR (1) KR20250111202A (cg-RX-API-DMAC7.html)
TW (1) TW202441326A (cg-RX-API-DMAC7.html)
WO (1) WO2024150635A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202617959A (zh) * 2024-10-21 2026-05-01 日商Ｊｓｒ股份有限公司 半導體處理用組成物及處理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5698070B2 (ja) * 2011-05-11 2015-04-08 株式会社Adeka ポジ型感光性組成物及びその硬化物
US11009796B2 (en) * 2017-09-22 2021-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Method for forming semiconductor structure
JP7274920B2 (ja) * 2019-04-11 2023-05-17 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法
JP7649752B2 (ja) 2019-04-12 2025-03-21 インプリア・コーポレイション 有機金属フォトレジスト現像剤組成物及び処理方法
JP7535933B2 (ja) * 2020-12-17 2024-08-19 東京エレクトロン株式会社 現像方法及び基板処理システム
JP7179147B1 (ja) * 2021-12-14 2022-11-28 東京応化工業株式会社 金属レジスト除去用洗浄液、及び該洗浄液を用いた洗浄方法

Also Published As

Publication number Publication date
WO2024150635A1 (ja) 2024-07-18
US20250321487A1 (en) 2025-10-16
KR20250111202A (ko) 2025-07-22
JPWO2024150635A1 (cg-RX-API-DMAC7.html) 2024-07-18

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