JPWO2024111255A5 - - Google Patents

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Publication number
JPWO2024111255A5
JPWO2024111255A5 JP2024559990A JP2024559990A JPWO2024111255A5 JP WO2024111255 A5 JPWO2024111255 A5 JP WO2024111255A5 JP 2024559990 A JP2024559990 A JP 2024559990A JP 2024559990 A JP2024559990 A JP 2024559990A JP WO2024111255 A5 JPWO2024111255 A5 JP WO2024111255A5
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JP
Japan
Prior art keywords
cavity
lower die
stroke amount
stripper
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024559990A
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English (en)
Japanese (ja)
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JPWO2024111255A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/036184 external-priority patent/WO2024111255A1/ja
Publication of JPWO2024111255A1 publication Critical patent/JPWO2024111255A1/ja
Publication of JPWO2024111255A5 publication Critical patent/JPWO2024111255A5/ja
Pending legal-status Critical Current

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JP2024559990A 2022-11-21 2023-10-04 Pending JPWO2024111255A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022185973 2022-11-21
PCT/JP2023/036184 WO2024111255A1 (ja) 2022-11-21 2023-10-04 圧縮樹脂封止成形装置

Publications (2)

Publication Number Publication Date
JPWO2024111255A1 JPWO2024111255A1 (https=) 2024-05-30
JPWO2024111255A5 true JPWO2024111255A5 (https=) 2025-06-05

Family

ID=91195424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024559990A Pending JPWO2024111255A1 (https=) 2022-11-21 2023-10-04

Country Status (3)

Country Link
JP (1) JPWO2024111255A1 (https=)
CN (1) CN120202102A (https=)
WO (1) WO2024111255A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011082157A1 (de) * 2011-09-06 2013-03-07 Osram Opto Semiconductors Gmbh Presswerkzeug und Verfahrenzum Herstellen eines Silikonelements
JP5758823B2 (ja) * 2012-03-08 2015-08-05 Ｔｏｗａ株式会社 電子部品の樹脂封止成形品の製造方法、圧縮成形用下金型及び樹脂封止装置
JP6491120B2 (ja) * 2016-02-13 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置、樹脂封止方法及び樹脂成形品の製造方法
JP6785690B2 (ja) * 2017-03-07 2020-11-18 Ｔｏｗａ株式会社 樹脂封止装置、樹脂成形方法および樹脂成形品の製造方法
JP6349447B2 (ja) * 2017-08-10 2018-06-27 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置

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