US20160082631A1 - Mold for Manufacturing LED Mounting Substrate - Google Patents
Mold for Manufacturing LED Mounting Substrate Download PDFInfo
- Publication number
- US20160082631A1 US20160082631A1 US14/956,490 US201514956490A US2016082631A1 US 20160082631 A1 US20160082631 A1 US 20160082631A1 US 201514956490 A US201514956490 A US 201514956490A US 2016082631 A1 US2016082631 A1 US 2016082631A1
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- Prior art keywords
- inlet channel
- molding die
- material inlet
- cross
- mold
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- 239000000758 substrate Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 205
- 238000000465 moulding Methods 0.000 claims abstract description 71
- 238000003825 pressing Methods 0.000 claims abstract description 40
- 230000007423 decrease Effects 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 description 42
- 239000012778 molding material Substances 0.000 description 42
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000002360 explosive Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012768 molten material Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- Embodiments of the present disclosure relate to a lighting apparatus. More particularly, embodiments of the present disclosure relate to a mold for manufacturing an LED mounting substrate.
- LED light emitting diodes
- An LED package includes a lead frame, a reflective cup and an LED chip.
- the LED chip is disposed on the lead frame
- the reflective cup is disposed on the lead frame and surrounds the LED chip.
- the reflective cup is generally formed by thermoplastic material or thermosetting material.
- the thermosetting material forms the reflective cup by the transfer molding process. In the transfer molding process, a channel is formed on the mold, and the thermosetting material is pressed into the tank in the mold through the channel by the pressure, thereby forming the reflective cup.
- the formed reflective cup exhibits higher structure strength. Because the shape of the reflective cup is complex, it is difficult for the thermosetting material to make the uniform flow and adjoin simultaneously, and the formed reflective cup may be of inadequate structure strength and easily crackable.
- the mold includes a first molding die and a second molding die.
- the second molding die covers the first molding die.
- the second molding die includes a material holding tank, a pressing part and a material inlet channel.
- the pressing part is protruded on the material holding tank.
- the pressing part expands along a direction from the first molding die to the second molding die.
- the material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die.
- the pressing part expands upwardly, the material required for the upper portion of the material holding tank is less than the material required for the lower portion of the material holding tank. Further, because the material inlet channel shrinks upwardly, it makes the material uniformly flow in the material holding tank, so as to form the base having good structure strength.
- FIG. 1 is a perspective view of an LED mounting substrate in accordance with one embodiment of the present disclosure
- FIG. 2 is an explosive view of a mold for manufacturing the LED mounting substrate in FIG. 1 ;
- FIG. 3 is a perspective view of the second molding die in FIG. 2 ;
- FIG. 4 is a side view of the assembled mold in FIG. 2 ;
- FIG. 5 is a cross-sectional view of the material inlet channel taken along B-B′ line in FIG. 3 ;
- FIG. 6 is a side view of the LED mounting substrate in FIG. 1 ;
- FIG. 7 is a side view of the assembled mold in accordance with another embodiment of the present disclosure.
- FIG. 8 is a horizontally cross-sectional view of the material inlet channel in FIG. 7 ;
- FIG. 9 is a side view of the LED mounting substrate manufactured by the mold in FIG. 7 ;
- FIG. 10 is a side view of the assembled mold in accordance with another embodiment of the present disclosure.
- FIG. 11 is a horizontally cross-sectional view of the material inlet channel in FIG. 10 ;
- FIG. 12 is a side view of the LED mounting substrate manufactured by the mold in FIG. 11 ;
- FIG. 13 is a side view of the assembled mold in accordance with another embodiment of the present disclosure.
- FIG. 14 is a side view of the LED mounting substrate manufactured by the mold in FIG. 13 ;
- FIG. 15 is a perspective view of the lighting apparatus in accordance with one embodiment of the present disclosure.
- FIG. 1 is a perspective view of an LED mounting substrate 10 in accordance with one embodiment of the present disclosure.
- the LED mounting substrate 10 includes a lead frame 100 , a base 200 and a residue of injection molding material 400 .
- the base 200 is disposed on the lead frame 100 .
- the base 200 has a cavity 300 .
- a bottom of the cavity 300 has an opening 302 for exposing a portion of the lead frame 100 .
- a cross-sectional area of the cavity 300 increases along a direction from the lead frame 100 to a top surface 210 of the base 200 .
- the residue of injection molding material 400 is disposed on one of outer walls 220 of the base 200 surrounding the cavity 300 .
- a cross-sectional area of the residue of injection molding material 400 decreases along a direction from the lead frame 100 to the top surface 210 of the base 200 .
- FIG. 2 is an explosive view of a mold for manufacturing the LED mounting substrate 10 in FIG. 1 .
- the mold includes a first molding die 500 and a second molding die 600 .
- the second molding die 600 covers the first molding die 500 .
- the lead frame 100 is placed on the first molding die 500 .
- FIG. 3 is a perspective view of the second molding die 600 in FIG. 2 .
- the second molding die 600 includes a material holding tank 700 , a pressing part 800 and a material inlet channel 900 .
- the pressing part 800 is protruded on the material holding tank 700 .
- the volume of pressing part 800 expands along a direction from the first molding die 500 (See FIG. 2 ) to the second molding die 600 (See FIG. 3 ).
- the width of the pressing part 800 increases along the direction toward the top surface of the second molding die 600 .
- the second molding die 600 has a plurality of outer walls 610 .
- the material inlet channel 900 is connected between one of the outer walls 610 and the material holding tank 700 .
- the material inlet channel 900 shrinks along a direction from the first molding die 500 (See FIG. 2 ) to the second molding die 600 (See FIG. 3 ).
- the second molding die 600 can cover the first molding die 500 , so as to allow the pressing part 800 to press a portion of the lead frame 100 . Then, the material can be injected into the material holding tank 700 through the material inlet channel 900 . After the material is cured, the first molding die 500 and the second molding die 600 can be removed, and then, the LED mounting substrate 10 as shown in FIG. 1 can be formed.
- the base 200 is formed by the material injected into the material holding tank 700 , and therefore, the shape and size of the base 200 are identical to which of the material holding tank 700 .
- the pressing part 800 blocks the material from flowing therethrough, so as to form the cavity 300 without any material on the base 200 .
- the shape and size of the cavity 300 on the base 200 are identical to which of the pressing part 800 .
- the residue of injection molding material 400 can be formed by the cured remained material.
- the shape and size of the cross section of the residue of injection molding material 400 are identical to which of the material inlet channel 900 .
- the material required for the base 200 or the material holding tank 700 decreases upwardly.
- the cross-sectional area of the material inlet channel 900 decreases upwardly, the material inlet channel 900 allows less material to flow toward the upper portion of the material holding tank 700 , and allows more material to flow toward the lower portion of the material holding tank 700 .
- the material inlet channel 900 allows the material to uniformly flow to various positions of the material holding tank 700 , thereby forming the base 200 having good structure strength.
- the outer wall 610 of the second molding die 600 includes two opposite long walls 614 and two opposite short walls 612 .
- the short walls 612 are adjoined to the long walls 614 .
- the material inlet channel 900 is positioned on one of the short walls 612 . Therefore, the base 200 formed by the second molding die 600 is in the shape as shown in FIG. 1 , in which the outer wall 220 of the base 200 includes two opposite long walls 224 and two opposite short walls 222 .
- the short walls 222 are adjoined to the long walls 224 .
- the residue of injection molding material 400 is disposed on one of the short walls 222 .
- FIG. 4 is a side view of the assembled mold in FIG. 2 .
- the cross section of the pressing part 800 and the cross section of the material inlet channel 900 are both symmetrical about a central line 620 of the outer wall 610 where the material inlet channel 900 is located.
- the material inlet channel 900 is located at the short wall 612 .
- the material inlet channel 900 is symmetrical about the central line 620 of the outer wall 610 where the material inlet channel 900 is located, the material can be uniformly injected into the portion of the material holding tank 700 on the left side of the pressing part 800 and the portion of the material holding tank 700 on the right side of the pressing part 800 , so as to improve the structure strength of the base 200 shown in FIG. 1 .
- FIG. 5 is a cross-sectional view of the material inlet channel 900 taken along B-B′ line in FIG. 3 .
- the material inlet channel 900 includes an outer opening 902 , an inner opening 906 and a passage 904 .
- the outer opening 902 is positioned at the surface of the second molding die 600 for allowing a material from a material supply (not shown) to get into the second molding die 600 .
- the outer opening 902 is positioned on the outer wall 610 of the second molding die 600 .
- the inner opening 906 is positioned inside the second molding die 600 and connected to the material holding tank 700 (See FIG. 3 ), so as to allow the material enter the second molding die 600 to get into the material holding tank 700 .
- the passage 904 connects the inner opening 906 and the outer opening 902 .
- the cross-sectional area of the inner opening 906 is greater than the cross-sectional area of the outer opening 902 , and the passage 904 expands along a direction from the outer opening 902 to the inner opening 906 .
- the passage 904 expands toward the material holding tank 700 , so as to facilitate the material to inject into the portions of the material holding tank 700 on opposite sides of the pressing part 800 .
- the passage 904 is symmetrical about the central line 620 of the short wall 612 (See FIG. 4 ), so as to facilitate the material to inject into the material holding tank 700 symmetrical about the pressing part 800 .
- the cross section of the material inlet channel 900 has a width W 1
- the outer wall 610 of the second molding die 600 has a width W 2 .
- the width W 1 is the greatest distance between opposite sides of the cross section of the material inlet channel 900 .
- the width W 2 is the greatest distance between opposite inner surfaces of the short walls 612 .
- the width W 1 of the cross section of the material inlet channel 900 is less than or equal to half of the width W 2 of the short wall 612 of the second molding die 600 . In other words, the maximum of the width W 1 of the cross section of the material inlet channel 900 is half of the width W 2 of the short wall 612 .
- the material inlet channel 900 and the bottom surface of the pressing part 800 are at the same level.
- the cross section of the material inlet channel 900 has a height H 1
- the pressing part 800 has a thickness T 1 .
- the height H 1 of the cross section of the material inlet channel 900 is less than or equal to half of the thickness T 1 of the pressing part 800 .
- the height H 1 of the cross section of the material inlet channel 900 is at most half of the thickness T 1 of the pressing part 800 .
- FIG. 6 is a side view of the LED mounting substrate 10 in FIG. 1 .
- the material inlet channel 900 (See FIG. 4 ) is symmetrical, the cross section of the residue of injection molding material 400 is symmetrical about the central line 230 of the outer wall 220 that the residue of injection molding material 400 is disposed on.
- the pressing part 800 (See FIG. 4 ) is symmetrical, the cross section of the cavity 300 is symmetrical about the central line 230 of the outer wall 220 that the residue of injection molding material 400 is disposed on as well.
- the portion of the residue of injection molding material 400 on the left side of the central line 230 and the portion of the residue of injection molding material 400 on the right side of the central line 230 have the same size and symmetrical shape.
- the portion of the cavity 300 on the left side of the central line 230 and the portion of the cavity 300 on the right side of the central line 230 have the same size and symmetrical shape.
- the cross section of the residue of injection molding material 400 has a width W 3
- the outer wall 220 of the base 200 has a width W 4 .
- the width W 3 is less than or equal to a half of the width W 4 .
- the width of the cross section of the residue of injection molding material 400 is at most half of the width W 4 of the outer wall 220 .
- the bottom surface 402 of the residue of injection molding material 400 and the top surface 110 of the lead frame 110 are at the same level.
- the residue of injection molding material 400 can be in direct contact with the portion of the lead frame 110 that is positioned outside the base 200 .
- the cross section of the residue of injection molding material 400 has a height H 2
- the cavity 300 has a thickness T 2 .
- the height H 2 of the cross section of the residue of injection molding material 400 is less than or equal to half of the thickness T 2 of the cavity 300 . In other words, the height H 2 of the cross section of the residue of injection molding material 400 is at most half of the thickness T 2 of the cavity 300 .
- FIG. 7 is a side view of the assembled mold in accordance with another embodiment of the present disclosure.
- the cross section of the material inlet channel 910 is positioned outside the central line 620 of the outer wall 610 that the material inlet channel 910 is connected to.
- the central line 620 of the outer wall 610 that the material inlet channel 910 is connected to does not cross the material inlet channel 910 .
- the cross section of the material inlet channel 910 is asymmetrical.
- the height of the cross section of the material inlet channel 910 decreases along a direction away from the central line 620 of the outer wall 610 that the material inlet channel 910 is connected to.
- the height of the cross section of the material inlet channel 910 increases along a direction toward the central line 620 of the outer wall 610 that the material inlet channel 910 is connected to.
- the material inlet channel 910 deviates from the central line 620 , such as the material inlet channel 910 being positioned on the left side of the central line 620 , the material can be uniformly injected into the material holding tank 700 by the varied height of the cross section of the material inlet channel 910 .
- the pressing part 800 is symmetrical about the central line 620 of the outer wall 610 that the material inlet channel 910 is connected to.
- the material inlet channel 910 in asymmetrical shape can also be replaced by the symmetrical material inlet channel 900 shown in FIG. 4 .
- the symmetrical material inlet channel 900 can be positioned outside the central line 620 as well.
- FIG. 8 is a horizontally cross-sectional view of the material inlet channel 910 in FIG. 7 .
- the outer opening 912 is positioned outside the second molding die 600 for allowing a material from a material supply (not shown) to get into the second molding die 600 .
- the inner opening 916 is positioned inside the second molding die 600 and connected to the material holding tank 700 (See FIG. 7 ), so as to allow the material getting into the second molding die 600 to get into the material holding tank 700 .
- the passage 914 connects the inner opening 916 and the outer opening 912 .
- the cross-sectional area of the inner opening 916 is greater than the cross-sectional area of the outer opening 912 , and the passage 914 expands along a direction from the outer opening 912 to the inner opening 916 .
- the passage 914 expands toward the material holding tank 700 , so as to facilitate the material to get into the material holding tank 700 on opposite sides of the pressing part 800 .
- the passage 914 is asymmetrical about the central line 620 of the outer wall 610 (See FIG. 7 ), so as to facilitate the material to get into the material holding tank 700 even though the material inlet channel 910 is positioned outside the central line 620 of the outer wall 610 .
- the passage 914 includes a first passage wall 914 a and a second passage wall 914 b.
- the first passage wall 914 a is farer from the central line 620 of the outer wall 610 that the material inlet channel 910 is connected to, and the second passage wall 914 b is closer to the central line 620 of the outer wall 610 that the material inlet channel 910 is connected to.
- the first passage wall 914 a is perpendicularly connected between the inner opening 916 and the outer opening 912 .
- the second passage wall 914 b is obliquely positioned between the inner opening 916 and the outer opening 912 , and the oblique direction of the second passage wall 914 b facilitate the material to flow toward the farer portion of the material holding tank 700 , such as the portion of the material holding tank 700 on the right side of the pressing part 800 in FIG. 7 , so that the material can uniformly flow.
- FIG. 9 is a side view of the LED mounting substrate 10 manufactured by the mold in FIG. 7 .
- the cross section of the residue of injection molding material 410 is positioned outside the central line 230 of the outer wall 220 that the residue of injection molding material 410 is disposed on.
- the central line 230 of the outer wall 220 that the residue of injection molding material 410 is disposed on does not cross the residue of injection molding material 410 .
- the cross section of the residue of injection molding material 410 is asymmetrical.
- the height of the cross section of the residue of injection molding material 410 decreases along a direction away from the central line 230 of the outer wall 220 that the residue of injection molding material 410 is disposed on.
- the inner edge 412 of the residue of injection molding material 410 is higher than the outer edge 414 of the residue of injection molding material 410 .
- the cross section of the cavity 300 is symmetrical to the central line 230 of the outer wall 220 that the residue of injection molding material 410 is disposed on.
- the residue of injection molding material 410 in asymmetrical shape can be replaced by the symmetrical residue of injection molding material 400 as well.
- the symmetrical residue of injection molding material 400 can be positioned outside the central line 230 of the outer wall 220 .
- FIG. 10 is a side view of the assembled mold in accordance with another embodiment of the present disclosure.
- the pressing part 810 is asymmetrical about the central line 620 of the outer wall 610 that the material inlet channel 920 is connected to.
- the central line 620 crosses a cross section of the material inlet channel 920
- the cross section of the material inlet channel 920 is asymmetrical.
- the material holding tank 700 includes a first material holding groove 702 and a second material holding groove 704 .
- the pressing part 810 separates the first material holding groove 702 and the second material holding groove 704 .
- the volume of the first material holding groove 702 is not equal to the volume of the second material holding groove 704 . More particularly, the volume of the first material holding groove 702 is greater than the volume of the second material holding groove 704 .
- a height D 1 of an edge of a cross section of the material inlet channel 920 that is closer to the first material holding groove 702 is greater than a height D 2 of another edge of the cross section of the material inlet channel 920 that is closer to the second material holding groove 704 , so as to facilitate to inject more material into the first material holding groove 702 and to inject less material into the second material holding groove 704 , such that the material can be uniformly distributed to the first material holding groove 702 and the second material holding groove 704 asymmetrical to each other.
- FIG. 11 is a horizontally cross-sectional view of the material inlet channel 920 in FIG. 10 .
- the outer opening 922 is positioned outside the second molding die 600 for allowing a material from a material supply (not shown) to get into the second molding die 600 .
- the inner opening 926 is positioned inside the second molding die 600 and connected to the material holding tank 700 (See FIG. 10 ), so as to allow the material getting into the second molding die 600 to get into the material holding tank 700 .
- the passage 924 connects the inner opening 926 and the outer opening 922 .
- the cross-sectional area of the inner opening 926 is greater than the cross-sectional area of the outer opening 922 , and the passage 924 expands along a direction from the outer opening 922 to the inner opening 926 . In other words, the passage 924 expands toward the material holding tank 700 , so as to facilitate the material to get into the first material holding groove 702 and the second material holding groove 704 (See FIG. 10 ) on opposite sides of the pressing
- FIG. 12 is a side view of the LED mounting substrate 10 manufactured by the mold in FIG. 11 .
- the cross section of the cavity 310 is asymmetrical about the central line 230 of the outer wall 220 that the residue of injection molding material 420 is disposed on.
- the central line 230 of the outer wall 220 crosses the residue of injection molding material 420 , and the cross section of the residue of injection molding material 420 is asymmetrical.
- a cross section of the cavity 310 is divided as a first area 312 and a second area 314 by the central line 230 of the outer wall 220 that the residue of injection molding material 420 is disposed on, and a cross section of the residue of injection molding material 420 is divided as a third area 422 and a fourth area 424 by the central line 230 of the outer wall 220 that the residue of injection molding material 420 is disposed on.
- the first area 312 and the third area 422 are positioned on one side of the central line 230
- the second area 314 and the fourth area 424 are positioned on another side of the central line 230 .
- the first area 312 is greater than the second area 314 .
- the fourth area 424 is greater than the third area 422 .
- the bottom edge 426 of the residue of injection molding material 420 is symmetrical about the central line 230 of the outer wall 220 that the residue of injection molding material 420 is disposed on.
- the length of the section of the bottom edge 426 on the left side of the central line 230 is equal to the length of the section of the bottom edge 426 on the right side of the central line 230 .
- FIG. 13 is a side view of the assembled mold in accordance with another embodiment of the present disclosure.
- the main difference between this embodiment and the foregoing embodiment is that the material inlet channel 930 is positioned on the long wall 614 of the second molding die 600 .
- FIG. 14 is a side view of the LED mounting substrate 10 manufactured by the mold in FIG. 13 . Because the material inlet channel 930 is positioned on the long wall 614 of the second molding die 600 , as shown in FIG. 13 , the residue of injection molding material 430 formed by the material remained in the material inlet channel 930 is disposed on the long wall 224 of the base 200 as well.
- FIG. 15 is a perspective view of the lighting apparatus in accordance with one embodiment of the present disclosure.
- the lighting apparatus includes an LED mounting substrate 10 and an LED chip 20 .
- the LED mounting substrate 10 is the same as described in the foregoing embodiments.
- the base 200 is disposed on the lead frame 100 .
- the base 200 has a cavity 300 .
- a bottom of the cavity 300 has an opening 302 for exposing a portion of the lead frame 100 .
- the cross-sectional area of the cavity 300 increases along a direction from the lead frame 100 to the top surface 210 of the base 200 .
- the residue of injection molding material 400 is disposed on one of outer walls 220 of the base 200 .
- the cross-sectional area of the residue of injection molding material 400 decreases along a direction from the lead frame 100 to the top surface 210 of the base 200 .
- the LED chip 20 is accommodated in the cavity 300 of the LED mounting substrate 10 and is disposed on the portion of the lead frame 100 exposed in the cavity 300 .
- the LED chip 20 can be connected to the lead frame 100 via two connection wires 21 , so as to allow the electrical connection between the LED chip 20 and the lead frame 100 .
- the lead frame 100 includes a first frame 102 and a second frame 104 .
- the LED chip 20 is disposed on the first frame 102 .
- the first frame 102 and the second frame 104 are separated by the insulated seat 240 , so that the first frame 102 and the second frame 104 can be insulated from each other.
- the insulated seat 240 and the base 200 are both formed by the thermosetting material through the transfer molding process.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
Abstract
A mold for manufacturing an LED mounting substrate includes a first molding die and a second molding die, The second molding die covers the first molding die. The second molding die includes a material holding tank, a pressing part and a material inlet channel. The pressing part is protruded on the material holding tank. The pressing part expands along a direction from the first molding die to the second molding die. The material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die.
Description
- The present application is a divisional application of U.S. application Ser. No. 14/156,583 filed on Jan. 16, 2014, which is based on, and claims priority from, Taiwanese Patent Application Serial Number 102101775, filed Jan. 17, 2013, the disclosure of which is hereby incorporated by reference herein in its entirely.
- 1. Technical Field
- Embodiments of the present disclosure relate to a lighting apparatus. More particularly, embodiments of the present disclosure relate to a mold for manufacturing an LED mounting substrate.
- 2. Description of Related Art
- Because a light emitting diodes (LED) has advantages such as low power-consumption and high illumination efficiency, it has become a popular lighting device and been widely applied in illumination and backlight module.
- An LED package includes a lead frame, a reflective cup and an LED chip. The LED chip is disposed on the lead frame, The reflective cup is disposed on the lead frame and surrounds the LED chip. The reflective cup is generally formed by thermoplastic material or thermosetting material. The thermosetting material forms the reflective cup by the transfer molding process. In the transfer molding process, a channel is formed on the mold, and the thermosetting material is pressed into the tank in the mold through the channel by the pressure, thereby forming the reflective cup.
- Typically, only if the thermosetting material uniformly flows in the mold and two molten materials adjoin together simultaneously, the formed reflective cup exhibits higher structure strength. Because the shape of the reflective cup is complex, it is difficult for the thermosetting material to make the uniform flow and adjoin simultaneously, and the formed reflective cup may be of inadequate structure strength and easily crackable.
- One aspect of the present disclosure provides a mold for manufacturing an LED mounting substrate having good structure strength. In accordance with one embodiment of the present disclosure, the mold includes a first molding die and a second molding die. The second molding die covers the first molding die. The second molding die includes a material holding tank, a pressing part and a material inlet channel. The pressing part is protruded on the material holding tank. The pressing part expands along a direction from the first molding die to the second molding die. The material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die.
- In the foregoing embodiment, because the pressing part expands upwardly, the material required for the upper portion of the material holding tank is less than the material required for the lower portion of the material holding tank. Further, because the material inlet channel shrinks upwardly, it makes the material uniformly flow in the material holding tank, so as to form the base having good structure strength.
- It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the disclosure as claimed.
- The disclosure can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
-
FIG. 1 is a perspective view of an LED mounting substrate in accordance with one embodiment of the present disclosure; -
FIG. 2 is an explosive view of a mold for manufacturing the LED mounting substrate inFIG. 1 ; -
FIG. 3 is a perspective view of the second molding die inFIG. 2 ; -
FIG. 4 is a side view of the assembled mold inFIG. 2 ; -
FIG. 5 is a cross-sectional view of the material inlet channel taken along B-B′ line inFIG. 3 ; -
FIG. 6 is a side view of the LED mounting substrate inFIG. 1 ; -
FIG. 7 is a side view of the assembled mold in accordance with another embodiment of the present disclosure; -
FIG. 8 is a horizontally cross-sectional view of the material inlet channel inFIG. 7 ; -
FIG. 9 is a side view of the LED mounting substrate manufactured by the mold inFIG. 7 ; -
FIG. 10 is a side view of the assembled mold in accordance with another embodiment of the present disclosure; -
FIG. 11 is a horizontally cross-sectional view of the material inlet channel inFIG. 10 ; -
FIG. 12 is a side view of the LED mounting substrate manufactured by the mold inFIG. 11 ; -
FIG. 13 is a side view of the assembled mold in accordance with another embodiment of the present disclosure; -
FIG. 14 is a side view of the LED mounting substrate manufactured by the mold inFIG. 13 ; and -
FIG. 15 is a perspective view of the lighting apparatus in accordance with one embodiment of the present disclosure. - Reference will now be made in detail to the present embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
-
FIG. 1 is a perspective view of anLED mounting substrate 10 in accordance with one embodiment of the present disclosure. As shown in this figure, theLED mounting substrate 10 includes alead frame 100, abase 200 and a residue ofinjection molding material 400. Thebase 200 is disposed on thelead frame 100. Thebase 200 has acavity 300. A bottom of thecavity 300 has anopening 302 for exposing a portion of thelead frame 100. A cross-sectional area of thecavity 300 increases along a direction from thelead frame 100 to atop surface 210 of thebase 200. The residue ofinjection molding material 400 is disposed on one ofouter walls 220 of thebase 200 surrounding thecavity 300. A cross-sectional area of the residue ofinjection molding material 400 decreases along a direction from thelead frame 100 to thetop surface 210 of thebase 200. -
FIG. 2 is an explosive view of a mold for manufacturing theLED mounting substrate 10 inFIG. 1 . As shown inFIG. 2 , the mold includes a first molding die 500 and asecond molding die 600. The second molding die 600 covers the first molding die 500. Thelead frame 100 is placed on the first molding die 500.FIG. 3 is a perspective view of the second molding die 600 inFIG. 2 . The second molding die 600 includes amaterial holding tank 700, apressing part 800 and amaterial inlet channel 900. Thepressing part 800 is protruded on thematerial holding tank 700. The volume ofpressing part 800 expands along a direction from the first molding die 500 (SeeFIG. 2 ) to the second molding die 600 (SeeFIG. 3 ). In particular, the width of thepressing part 800 increases along the direction toward the top surface of the second molding die 600. The second molding die 600 has a plurality ofouter walls 610. Thematerial inlet channel 900 is connected between one of theouter walls 610 and thematerial holding tank 700. Thematerial inlet channel 900 shrinks along a direction from the first molding die 500 (SeeFIG. 2 ) to the second molding die 600 (SeeFIG. 3 ). - Referring to
FIGS. 1 to 3 , during the process for manufacturing theLED mounting substrate 10, the second molding die 600 can cover the first molding die 500, so as to allow thepressing part 800 to press a portion of thelead frame 100. Then, the material can be injected into thematerial holding tank 700 through thematerial inlet channel 900. After the material is cured, the first molding die 500 and the second molding die 600 can be removed, and then, theLED mounting substrate 10 as shown inFIG. 1 can be formed. - The
base 200 is formed by the material injected into thematerial holding tank 700, and therefore, the shape and size of the base 200 are identical to which of thematerial holding tank 700. Thepressing part 800 blocks the material from flowing therethrough, so as to form thecavity 300 without any material on thebase 200. Hence, the shape and size of thecavity 300 on thebase 200 are identical to which of thepressing part 800. Moreover, when the material is injected into thematerial holding tank 700 through thematerial inlet channel 900, some material remains on thematerial inlet channel 900, and therefore, the residue ofinjection molding material 400 can be formed by the cured remained material. As such, the shape and size of the cross section of the residue ofinjection molding material 400 are identical to which of thematerial inlet channel 900. - Because the
pressing part 800 shown inFIG. 2 or 3 expands upwardly, the material required for the base 200 or thematerial holding tank 700 decreases upwardly. Further, because the cross-sectional area of thematerial inlet channel 900 decreases upwardly, thematerial inlet channel 900 allows less material to flow toward the upper portion of thematerial holding tank 700, and allows more material to flow toward the lower portion of thematerial holding tank 700. As such, thematerial inlet channel 900 allows the material to uniformly flow to various positions of thematerial holding tank 700, thereby forming the base 200 having good structure strength. - The
outer wall 610 of the second molding die 600 includes two oppositelong walls 614 and two oppositeshort walls 612. Theshort walls 612 are adjoined to thelong walls 614. In this embodiment, thematerial inlet channel 900 is positioned on one of theshort walls 612. Therefore, the base 200 formed by the second molding die 600 is in the shape as shown inFIG. 1 , in which theouter wall 220 of thebase 200 includes two oppositelong walls 224 and two oppositeshort walls 222. Theshort walls 222 are adjoined to thelong walls 224. In this embodiment, the residue ofinjection molding material 400 is disposed on one of theshort walls 222. -
FIG. 4 is a side view of the assembled mold inFIG. 2 . As shown inFIG. 4 , the cross section of thepressing part 800 and the cross section of thematerial inlet channel 900 are both symmetrical about acentral line 620 of theouter wall 610 where thematerial inlet channel 900 is located. In this embodiment, thematerial inlet channel 900 is located at theshort wall 612. Because the cross section of thematerial inlet channel 900 is symmetrical about thecentral line 620 of theouter wall 610 where thematerial inlet channel 900 is located, the material can be uniformly injected into the portion of thematerial holding tank 700 on the left side of thepressing part 800 and the portion of thematerial holding tank 700 on the right side of thepressing part 800, so as to improve the structure strength of the base 200 shown inFIG. 1 . -
FIG. 5 is a cross-sectional view of thematerial inlet channel 900 taken along B-B′ line inFIG. 3 . As shown inFIG. 5 , thematerial inlet channel 900 includes anouter opening 902, aninner opening 906 and apassage 904. Theouter opening 902 is positioned at the surface of the second molding die 600 for allowing a material from a material supply (not shown) to get into the second molding die 600. Theouter opening 902 is positioned on theouter wall 610 of the second molding die 600. Theinner opening 906 is positioned inside the second molding die 600 and connected to the material holding tank 700 (SeeFIG. 3 ), so as to allow the material enter the second molding die 600 to get into thematerial holding tank 700. Thepassage 904 connects theinner opening 906 and theouter opening 902. The cross-sectional area of theinner opening 906 is greater than the cross-sectional area of theouter opening 902, and thepassage 904 expands along a direction from theouter opening 902 to theinner opening 906. In other words, thepassage 904 expands toward thematerial holding tank 700, so as to facilitate the material to inject into the portions of thematerial holding tank 700 on opposite sides of thepressing part 800. Thepassage 904 is symmetrical about thecentral line 620 of the short wall 612 (SeeFIG. 4 ), so as to facilitate the material to inject into thematerial holding tank 700 symmetrical about thepressing part 800. - Reference is now made to
FIG. 4 . In this embodiment, the cross section of thematerial inlet channel 900 has a width W1, and theouter wall 610 of the second molding die 600 has a width W2. The width W1 is the greatest distance between opposite sides of the cross section of thematerial inlet channel 900. The width W2 is the greatest distance between opposite inner surfaces of theshort walls 612. The width W1 of the cross section of thematerial inlet channel 900 is less than or equal to half of the width W2 of theshort wall 612 of the second molding die 600. In other words, the maximum of the width W1 of the cross section of thematerial inlet channel 900 is half of the width W2 of theshort wall 612. - In this embodiment, the
material inlet channel 900 and the bottom surface of thepressing part 800 are at the same level. Moreover, the cross section of thematerial inlet channel 900 has a height H1, and thepressing part 800 has a thickness T1. The height H1 of the cross section of thematerial inlet channel 900 is less than or equal to half of the thickness T1 of thepressing part 800. In other words, the height H1 of the cross section of thematerial inlet channel 900 is at most half of the thickness T1 of thepressing part 800. -
FIG. 6 is a side view of theLED mounting substrate 10 inFIG. 1 . Because the material inlet channel 900 (SeeFIG. 4 ) is symmetrical, the cross section of the residue ofinjection molding material 400 is symmetrical about thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 400 is disposed on. Further, because the pressing part 800 (SeeFIG. 4 ) is symmetrical, the cross section of thecavity 300 is symmetrical about thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 400 is disposed on as well. In particular, the portion of the residue ofinjection molding material 400 on the left side of thecentral line 230 and the portion of the residue ofinjection molding material 400 on the right side of thecentral line 230 have the same size and symmetrical shape. Similarly, the portion of thecavity 300 on the left side of thecentral line 230 and the portion of thecavity 300 on the right side of thecentral line 230 have the same size and symmetrical shape. - In this embodiment, the cross section of the residue of
injection molding material 400 has a width W3, and theouter wall 220 of thebase 200 has a width W4. The width W3 is less than or equal to a half of the width W4. In other words, the width of the cross section of the residue ofinjection molding material 400 is at most half of the width W4 of theouter wall 220. - In this embodiment, the
bottom surface 402 of the residue ofinjection molding material 400 and the top surface 110 of the lead frame 110 are at the same level. In particular, the residue ofinjection molding material 400 can be in direct contact with the portion of the lead frame 110 that is positioned outside thebase 200. Moreover, the cross section of the residue ofinjection molding material 400 has a height H2, and thecavity 300 has a thickness T2. The height H2 of the cross section of the residue ofinjection molding material 400 is less than or equal to half of the thickness T2 of thecavity 300. In other words, the height H2 of the cross section of the residue ofinjection molding material 400 is at most half of the thickness T2 of thecavity 300. -
FIG. 7 is a side view of the assembled mold in accordance with another embodiment of the present disclosure. In this embodiment, the cross section of thematerial inlet channel 910 is positioned outside thecentral line 620 of theouter wall 610 that thematerial inlet channel 910 is connected to. In other words, thecentral line 620 of theouter wall 610 that thematerial inlet channel 910 is connected to does not cross thematerial inlet channel 910. Further, the cross section of thematerial inlet channel 910 is asymmetrical. In particular, the height of the cross section of thematerial inlet channel 910 decreases along a direction away from thecentral line 620 of theouter wall 610 that thematerial inlet channel 910 is connected to. In other words, the height of the cross section of thematerial inlet channel 910 increases along a direction toward thecentral line 620 of theouter wall 610 that thematerial inlet channel 910 is connected to. As such, even though thematerial inlet channel 910 deviates from thecentral line 620, such as thematerial inlet channel 910 being positioned on the left side of thecentral line 620, the material can be uniformly injected into thematerial holding tank 700 by the varied height of the cross section of thematerial inlet channel 910. In this embodiment, thepressing part 800 is symmetrical about thecentral line 620 of theouter wall 610 that thematerial inlet channel 910 is connected to. In order to produce the mold, in other embodiments, thematerial inlet channel 910 in asymmetrical shape can also be replaced by the symmetricalmaterial inlet channel 900 shown inFIG. 4 . In other words, the symmetricalmaterial inlet channel 900 can be positioned outside thecentral line 620 as well. -
FIG. 8 is a horizontally cross-sectional view of thematerial inlet channel 910 inFIG. 7 . As shown inFIG. 8 , theouter opening 912 is positioned outside the second molding die 600 for allowing a material from a material supply (not shown) to get into the second molding die 600. Theinner opening 916 is positioned inside the second molding die 600 and connected to the material holding tank 700 (SeeFIG. 7 ), so as to allow the material getting into the second molding die 600 to get into thematerial holding tank 700. Thepassage 914 connects theinner opening 916 and theouter opening 912. The cross-sectional area of theinner opening 916 is greater than the cross-sectional area of theouter opening 912, and thepassage 914 expands along a direction from theouter opening 912 to theinner opening 916. In other words, thepassage 914 expands toward thematerial holding tank 700, so as to facilitate the material to get into thematerial holding tank 700 on opposite sides of thepressing part 800. - In this embodiment, the
passage 914 is asymmetrical about thecentral line 620 of the outer wall 610 (SeeFIG. 7 ), so as to facilitate the material to get into thematerial holding tank 700 even though thematerial inlet channel 910 is positioned outside thecentral line 620 of theouter wall 610. In particular, thepassage 914 includes afirst passage wall 914 a and asecond passage wall 914 b. Thefirst passage wall 914 a is farer from thecentral line 620 of theouter wall 610 that thematerial inlet channel 910 is connected to, and thesecond passage wall 914 b is closer to thecentral line 620 of theouter wall 610 that thematerial inlet channel 910 is connected to. Thefirst passage wall 914 a is perpendicularly connected between theinner opening 916 and theouter opening 912. Thesecond passage wall 914 b is obliquely positioned between theinner opening 916 and theouter opening 912, and the oblique direction of thesecond passage wall 914 b facilitate the material to flow toward the farer portion of thematerial holding tank 700, such as the portion of thematerial holding tank 700 on the right side of thepressing part 800 inFIG. 7 , so that the material can uniformly flow. -
FIG. 9 is a side view of theLED mounting substrate 10 manufactured by the mold inFIG. 7 . In this embodiment, the cross section of the residue ofinjection molding material 410 is positioned outside thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 410 is disposed on. In other words, thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 410 is disposed on does not cross the residue ofinjection molding material 410. Further, the cross section of the residue ofinjection molding material 410 is asymmetrical. In particular, the height of the cross section of the residue ofinjection molding material 410 decreases along a direction away from thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 410 is disposed on. In other words, theinner edge 412 of the residue ofinjection molding material 410 is higher than theouter edge 414 of the residue ofinjection molding material 410. In this embodiment, the cross section of thecavity 300 is symmetrical to thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 410 is disposed on. In order to manufacture the mold, in other embodiment, the residue ofinjection molding material 410 in asymmetrical shape can be replaced by the symmetrical residue ofinjection molding material 400 as well. In other words, the symmetrical residue ofinjection molding material 400 can be positioned outside thecentral line 230 of theouter wall 220. -
FIG. 10 is a side view of the assembled mold in accordance with another embodiment of the present disclosure. In this embodiment, the pressing part 810 is asymmetrical about thecentral line 620 of theouter wall 610 that thematerial inlet channel 920 is connected to. Thecentral line 620 crosses a cross section of thematerial inlet channel 920, and the cross section of thematerial inlet channel 920 is asymmetrical. In particular, in a vertically cross-sectional view, thematerial holding tank 700 includes a firstmaterial holding groove 702 and a secondmaterial holding groove 704. The pressing part 810 separates the firstmaterial holding groove 702 and the secondmaterial holding groove 704. Because the pressing part 810 is asymmetrical, the volume of the firstmaterial holding groove 702 is not equal to the volume of the secondmaterial holding groove 704. More particularly, the volume of the firstmaterial holding groove 702 is greater than the volume of the secondmaterial holding groove 704. A height D1 of an edge of a cross section of thematerial inlet channel 920 that is closer to the firstmaterial holding groove 702 is greater than a height D2 of another edge of the cross section of thematerial inlet channel 920 that is closer to the secondmaterial holding groove 704, so as to facilitate to inject more material into the firstmaterial holding groove 702 and to inject less material into the secondmaterial holding groove 704, such that the material can be uniformly distributed to the firstmaterial holding groove 702 and the secondmaterial holding groove 704 asymmetrical to each other. -
FIG. 11 is a horizontally cross-sectional view of thematerial inlet channel 920 inFIG. 10 . The outer opening 922 is positioned outside the second molding die 600 for allowing a material from a material supply (not shown) to get into the second molding die 600. Theinner opening 926 is positioned inside the second molding die 600 and connected to the material holding tank 700 (SeeFIG. 10 ), so as to allow the material getting into the second molding die 600 to get into thematerial holding tank 700. Thepassage 924 connects theinner opening 926 and the outer opening 922. The cross-sectional area of theinner opening 926 is greater than the cross-sectional area of the outer opening 922, and thepassage 924 expands along a direction from the outer opening 922 to theinner opening 926. In other words, thepassage 924 expands toward thematerial holding tank 700, so as to facilitate the material to get into the firstmaterial holding groove 702 and the second material holding groove 704 (SeeFIG. 10 ) on opposite sides of the pressing part 810. -
FIG. 12 is a side view of theLED mounting substrate 10 manufactured by the mold inFIG. 11 . In this embodiment, the cross section of thecavity 310 is asymmetrical about thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 420 is disposed on. Thecentral line 230 of theouter wall 220 crosses the residue ofinjection molding material 420, and the cross section of the residue ofinjection molding material 420 is asymmetrical. In particular, a cross section of thecavity 310 is divided as afirst area 312 and asecond area 314 by thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 420 is disposed on, and a cross section of the residue ofinjection molding material 420 is divided as athird area 422 and afourth area 424 by thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 420 is disposed on. Thefirst area 312 and thethird area 422 are positioned on one side of thecentral line 230, and thesecond area 314 and thefourth area 424 are positioned on another side of thecentral line 230. Thefirst area 312 is greater than thesecond area 314. Thefourth area 424 is greater than thethird area 422. Because thefourth area 424 is greater than thethird area 422, more material are allowed to form the portion of thebase 200 beside thesecond area 314, and less material are allowed to form the portion of thebase 200 beside thefirst area 312. Moreover, in this embodiment, thebottom edge 426 of the residue ofinjection molding material 420 is symmetrical about thecentral line 230 of theouter wall 220 that the residue ofinjection molding material 420 is disposed on. In particular, the length of the section of thebottom edge 426 on the left side of thecentral line 230 is equal to the length of the section of thebottom edge 426 on the right side of thecentral line 230. -
FIG. 13 is a side view of the assembled mold in accordance with another embodiment of the present disclosure. The main difference between this embodiment and the foregoing embodiment is that the material inlet channel 930 is positioned on thelong wall 614 of the second molding die 600.FIG. 14 is a side view of theLED mounting substrate 10 manufactured by the mold inFIG. 13 . Because the material inlet channel 930 is positioned on thelong wall 614 of the second molding die 600, as shown inFIG. 13 , the residue ofinjection molding material 430 formed by the material remained in the material inlet channel 930 is disposed on thelong wall 224 of the base 200 as well. -
FIG. 15 is a perspective view of the lighting apparatus in accordance with one embodiment of the present disclosure. As shown in this figure, the lighting apparatus includes anLED mounting substrate 10 and anLED chip 20. TheLED mounting substrate 10 is the same as described in the foregoing embodiments. In particular, in theLED mounting substrate 10, thebase 200 is disposed on thelead frame 100. Thebase 200 has acavity 300. A bottom of thecavity 300 has anopening 302 for exposing a portion of thelead frame 100. The cross-sectional area of thecavity 300 increases along a direction from thelead frame 100 to thetop surface 210 of thebase 200. The residue ofinjection molding material 400 is disposed on one ofouter walls 220 of thebase 200. The cross-sectional area of the residue ofinjection molding material 400 decreases along a direction from thelead frame 100 to thetop surface 210 of thebase 200. TheLED chip 20 is accommodated in thecavity 300 of theLED mounting substrate 10 and is disposed on the portion of thelead frame 100 exposed in thecavity 300. - Further, the
LED chip 20 can be connected to thelead frame 100 via twoconnection wires 21, so as to allow the electrical connection between theLED chip 20 and thelead frame 100. Thelead frame 100 includes afirst frame 102 and asecond frame 104. TheLED chip 20 is disposed on thefirst frame 102. Thefirst frame 102 and thesecond frame 104 are separated by theinsulated seat 240, so that thefirst frame 102 and thesecond frame 104 can be insulated from each other. Theinsulated seat 240 and the base 200 are both formed by the thermosetting material through the transfer molding process. - Although the present disclosure has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the present disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims.
Claims (12)
1. A mold for manufacturing an LED mounting substrate, comprising:
a first molding die; and
a second molding die covering the first molding die, wherein the second molding die comprises:
a material holding tank;
a pressing part protruded on the material holding tank, the pressing part expanding along a direction from the first molding die to the second molding die; and
a material inlet channel connected between one of outer walls of the second molding die and the material holding tank, the material inlet channel shrinking along a direction from the first molding die to the second molding die.
2. The mold of claim 1 , wherein a cross section of the pressing part and a cross section of the material inlet channel are both symmetrical about a central line of the outer wall where the material inlet channel is located.
3. The mold of claim 1 , wherein the pressing part is symmetrical about a central line of the outer wall where the material inlet channel is located, and a cross section of the material inlet channel is positioned outside the central line and is asymmetrical.
4. The mold of claim 3 , wherein a height of the cross section of the material inlet channel decreases along a direction away from the central line of the outer wall where the material inlet channel is located.
5. The mold of claim 1 , wherein the pressing part is asymmetrical about a central line of the outer wall where the material inlet channel is located, and the central line of the outer wall where the material inlet channel is located crosses a cross section of the material inlet channel, and the cross section of the material inlet channel is asymmetrical.
6. The mold of claim 5 , wherein the material holding tank comprises:
a first material holding groove; and
a second material holding groove, the pressing part separating the first material holding groove and the second material holding groove, and a volume of the first material holding groove is greater than a volume of the second material holding groove;
wherein a height of an edge of a cross section of the material inlet channel that is closer to the first material holding groove is greater than a height of another edge of the cross section of the material inlet channel that is closer to the second material holding groove.
7. The mold of claim 5 , wherein a bottom edge of the material inlet channel is symmetrical about the central line of the outer wall where the material inlet channel is located.
8. The mold of claim 1 , wherein the material inlet channel comprises:
an outer opening positioned outside the second molding die for allowing a material from a material supply to entering the second molding die;
an inner opening positioned inside the second molding die and connected to the material holding tank, so as to allow the material entering the second molding die to get into the material holding tank; and
a passage connecting the inner opening and the outer opening;
wherein a cross-sectional area of the inner opening is greater than a cross-sectional area of the outer opening, and the passage expands along a direction from the outer opening to the inner opening.
9. The mold of claim 8 , wherein the passage is symmetrical or asymmetrical about a central line of the outer wall where the material inlet channel is located.
10. The mold of claim 1 , wherein a width of a cross section of the material inlet channel is less than or equal to a half of a width of the outer wall.
11. The mold of claim 1 , wherein a bottom surface of the material inlet channel and a bottom surface of the pressing part are positioned at the same level, and a height of the material inlet channel is less than or equal to a half of a thickness of the pressing part.
12. The mold of claim 1 , wherein the outer walls of the second molding die comprises:
two opposite long walls; and
two opposite short walls adjoined to the long walls;
wherein the material inlet channel is positioned on one of the opposite short walls or one of the opposite long walls.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/956,490 US20160082631A1 (en) | 2013-01-17 | 2015-12-02 | Mold for Manufacturing LED Mounting Substrate |
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TW102101775 | 2013-01-17 | ||
TW102101775A TWI556476B (en) | 2013-01-17 | 2013-01-17 | Illumination apparatus, led mounting substrate and mold thereof |
US14/156,583 US9238317B2 (en) | 2013-01-17 | 2014-01-16 | Lighting apparatus, LED mounting substrate and mold for manufacturing the same |
US14/956,490 US20160082631A1 (en) | 2013-01-17 | 2015-12-02 | Mold for Manufacturing LED Mounting Substrate |
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US14/156,583 Division US9238317B2 (en) | 2013-01-17 | 2014-01-16 | Lighting apparatus, LED mounting substrate and mold for manufacturing the same |
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US20160082631A1 true US20160082631A1 (en) | 2016-03-24 |
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US14/156,583 Active 2034-04-06 US9238317B2 (en) | 2013-01-17 | 2014-01-16 | Lighting apparatus, LED mounting substrate and mold for manufacturing the same |
US14/956,490 Abandoned US20160082631A1 (en) | 2013-01-17 | 2015-12-02 | Mold for Manufacturing LED Mounting Substrate |
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US14/156,583 Active 2034-04-06 US9238317B2 (en) | 2013-01-17 | 2014-01-16 | Lighting apparatus, LED mounting substrate and mold for manufacturing the same |
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US (2) | US9238317B2 (en) |
CN (1) | CN103943751A (en) |
TW (1) | TWI556476B (en) |
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CN104851813A (en) * | 2015-05-19 | 2015-08-19 | 苏州晶方半导体科技股份有限公司 | Fingerprint identification chip packaging structure and packaging method |
EP3360157B1 (en) | 2015-10-07 | 2020-09-02 | Heptagon Micro Optics Pte. Ltd. | Molded circuit substrates |
CN109253108A (en) * | 2018-11-14 | 2019-01-22 | 刘子鸣 | A kind of the immersible pump double shrouded wheel and its production method of injection molding |
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US5902541A (en) * | 1994-11-25 | 1999-05-11 | Asahi Kasei Kogyo Kabushiki Kaisha | Injection molding method for producing shaped, hollow resin articles, and mold for use therein |
CN1135637C (en) * | 1998-02-26 | 2004-01-21 | 翔因企业有限公司 | Method for producing unshaped light-emitting diode and its forming mold |
CN101507004B (en) * | 2006-12-28 | 2011-04-20 | 日亚化学工业株式会社 | Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die |
JP5380774B2 (en) * | 2006-12-28 | 2014-01-08 | 日亜化学工業株式会社 | Surface mount type side surface light emitting device and manufacturing method thereof |
KR100855065B1 (en) * | 2007-04-24 | 2008-08-29 | 삼성전기주식회사 | Light emitting diode package |
EP2199339B1 (en) * | 2007-09-25 | 2014-11-05 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device |
TWI422070B (en) * | 2010-03-12 | 2014-01-01 | Advanced Optoelectronic Tech | Compound semiconductor package and method for manufacturing thereof |
-
2013
- 2013-01-17 TW TW102101775A patent/TWI556476B/en active
- 2013-02-06 CN CN201310046704.8A patent/CN103943751A/en active Pending
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2014
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2015
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Publication number | Publication date |
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TWI556476B (en) | 2016-11-01 |
US9238317B2 (en) | 2016-01-19 |
TW201431137A (en) | 2014-08-01 |
US20140197446A1 (en) | 2014-07-17 |
CN103943751A (en) | 2014-07-23 |
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