KR100974337B1

KR100974337B1 - Device for molding light emitting diode package

Info

Publication number: KR100974337B1
Application number: KR20080026797A
Authority: KR
Inventors: 오승현
Original assignee: 주식회사 루멘스
Priority date: 2008-03-24
Filing date: 2008-03-24
Publication date: 2010-08-05
Also published as: KR20090101580A

Abstract

The manufacturing cost can be reduced by preventing unnecessary waste of resin for forming the body, and mold molds for forming the body of the light emitting diode package are arranged in a row so that the resin can be injected smoothly. Provided is a light emitting diode package molding apparatus having a structure sequentially supplied to a mold.

Resin injection part, resin, molding, supply pipe, mold

Description

Light Emitting Diode Package Forming Equipment {DEVICE FOR MOLDING LIGHT EMITTING DIODE PACKAGE}

The present invention relates to a light emitting diode package. More particularly, the present invention relates to a light emitting diode package molding apparatus.

Generally, a light emitting diode package is manufactured by separately molding a lens through injection molding or transfer molding, and then attaching the lens to a lead frame of the light emitting diode. That is, an adhesive is applied to the lead frames of the light emitting diodes arranged in a plurality of rows, and the individually manufactured lenses are attached through the lens mount to form a light emitting diode package. However, this structure has a problem in that the manufacturing process is complicated and the manufacturing cost is increased by separately molding the lens.

In order to increase mass productivity, a molding method of enclosing the light emitting diodes with transparent resins has been developed and applied through transfer molding technology during lens molding. That is, a light emitting chip is mounted on a lead frame made of metal and connected with metal wires, a non-conductive package is formed through a mold process including a lens on the lead frame, and a trimming process of cutting and separating leads of each package is performed. The LED package is manufactured.

Here, the package molding method is performed through extrusion molding in which a non-conductive molding resin on a chip or powder is fluidized and press-molded into a cavity inserted into a cavity inserted on a body molding mold.

Package molding apparatus for this purpose is a plurality of main supply pipe is installed from the resin injection portion, the body forming frame is connected to each other through the connection pipe along the main supply pipe is configured to receive the resin.

In this way, the non-conductive molding resin is supplied from the resin injection portion to the main supply pipe and injected into each body forming frame through a connection pipe installed along the main supply pipe. After the resin is injected into each of the molds and the package is separated from the mold in a solid state, the body of the package is molded.

However, the conventional package molding apparatus has a long injection path of the resin, and after passing through the main supply pipe, is supplied to each body forming frame through the connecting pipe, so that a large amount of resin in addition to the resin required for forming the package body is substantially supplied with the supply pipe. There is a problem in that the resin remains in the connecting pipe and the like.

As such, the resin is unnecessarily wasted, which leads to an increase in manufacturing cost of the LED package.

In addition, the direction in which the resin flows out abruptly changes from the main supply pipe to the connecting pipe so that the smooth flow of the resin is not achieved, and a large injection pressure is required for the resin injection.

The present invention provides a molding apparatus of a light emitting diode package which can reduce manufacturing cost by preventing unnecessary waste of resin for forming a body.

In addition, the present invention provides a light emitting diode package molding apparatus capable of smoothly injecting a resin for forming a body.

To this end, the molding apparatus may have a structure in which molds for forming the body of the light emitting diode package are arranged in a row so that resin for forming the body is sequentially supplied to each mold.

To this end, the present molding apparatus includes a resin injection portion through which resin is injected, a supply pipe connected to at least one of the resin injection portions to supply resin, and a plurality of resins connected to the supply pipe and receiving resin to form a body in a lead frame. It includes two molds, the molds may be arranged in series and in communication with each other so that the resin is sequentially supplied in the arrangement order of the molds.

The resin supplied from the resin injection portion can be supplied directly from the mold to the mold afterwards, thus reducing the waste of the resin compared to the conventional structure in which each mold is separately supplied from the supply pipe. .

Here, the molding apparatus is provided with a plurality of rows in which each mold frame is sequentially arranged, each row may be connected to the resin injection portion through the supply pipe. In addition, one side of each row may be connected to the resin inlet through the supply pipe, and the remaining rows may be connected through the intermediate supply pipe between the rows and the rows.

In addition, the present molding apparatus may further include a connecting tube through which the resin is connected between each mold die is connected.

In addition, the present molding apparatus may have a structure in which the molds are in contact with each other, and the resin is supplied from one mold mold to the next mold mold.

The mold may have a structure of molding a lens on the light emitting diode.

In addition, the resin may be a solid or liquid thermosetting epoxy resin.

In addition, the resin may be a solid or liquid silicone resin.

As such, unnecessary waste of resin for forming the body of the light emitting diode package can be prevented.

In addition, even when the injection pressure of the resin is lowered, the resin can be injected smoothly, there is an advantage that the resin is minimized to the outside of the body by the strong injection pressure when forming the body and can omit the finishing process after molding.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

Unless defined otherwise, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Commonly defined terms used are additionally interpreted to have a meaning consistent with the related technical literature and the presently disclosed contents, and are not interpreted in an ideal or very formal sense unless defined.

Embodiments of the invention described with reference to a perspective view specifically illustrate an ideal embodiment of the invention. As a result, various variations of the illustration, for example variations in the manufacturing method and / or specification, are expected. Thus, the embodiment is not limited to any particular form of the depicted area, but includes modifications of the form, for example, by manufacture. For example, the regions shown or described as being flat may have characteristics that are generally coarse / rough and nonlinear. Also, the portion shown as having a sharp angle may be rounded. Thus, the regions shown in the figures are merely approximate, and their shapes are not intended to depict the exact shape of the regions, nor are they intended to limit the scope of the present invention.

It is also noted that the figures are schematic and not drawn to scale. The relative dimensions and ratios of the parts in the figures have been exaggerated or reduced in size for clarity and convenience in the figures and any dimensions are merely exemplary and not limiting. And the same structure, element or part that appears in more than one figure the same reference numerals are used in different embodiments to indicate corresponding or similar features.

1 is a cross-sectional view of a light emitting diode package.

According to the drawings, the light emitting diode package 10 includes a lead frame 11 including a pair of anode lead frames and cathode lead frames, and a die pad of the lead frame 11. A light emitting chip 12 attached to the medium via a die adhesive, an external reflector 13 formed of a resin on the upper side of the lead frame 11, and enclosing the light emitting chips 12, and each light emitting chip 12. And a conducting wire 14 connected between the lead frame 11 and the lens 15 filled in the reflector 13.

In the following description, a molding apparatus for molding a lens with resin in the reflector 13 as a molding apparatus for manufacturing a light emitting diode package having the above structure will be described as an example. Of course, the apparatus is not limited to the apparatus for molding the lens, it is also applicable to a molding apparatus for molding the body, such as a reflector of the package.

2 shows an embodiment of the present molding apparatus.

According to the above-described drawings, the molding apparatus includes a resin injection unit 20 for injecting resin into each mold 50 and a plurality of supply pipes 21 connected to the resin injection unit for supplying resin. A plurality of molds 50 connected to the respective supply pipes and arranged in a line with each other.

The mold frame 50 is a mold for mounting a lead frame therein and injecting resin supplied into the reflector of the lead frame to form a lens. In the present embodiment, the resin is a solid or liquid thermosetting epoxy resin for lens formation. In addition, the resin may be made of a solid or liquid silicone resin in addition to the epoxy resin.

The plurality of molds 50 connected to the respective supply pipes 21 are arranged in a row to form one row. In this embodiment, two columns are paired. Hereinafter, the column is defined as meaning a set of molds 50 arranged in a row. Moreover, the connection pipe 22 for distributing resin is provided between the metal mold | die 50 of each row, and it has a structure which communicated with each other.

In this way, the resin is sequentially supplied to each mold 50 through the connecting pipe 22 according to the arrangement order of the mold 50.

Here, the length of the supply pipe 21 and the connecting pipe 22 is not particularly limited, but only serves as a moving passage of the resin, the length of the supply pipe 21 and the connection pipe 22 should be short so that a smaller amount of resin remains on the pipe. .

Therefore, when the resin is injected from the resin injection unit 20, the resin is injected into the mold 50 of each row arranged in a row through each supply pipe 21. The resin injected into the supply pipe 21 is first supplied to the wire mold 50 connected to the supply pipe to form a lens. Then, the resin is continuously injected from the resin injection unit 20 by a predetermined pressure, so that the resin is injected into the mold after passing through the wire mold and through the connecting pipe 22. Then, the resin injected into the mold is filled in the reflector in the mold 50 to form a lens, and is then sequentially injected into each mold 50 arranged sequentially through the connecting pipe 22.

Hereinafter, the term "mold mold" refers to a mold mold positioned in front of the resin along the injection direction and refers to a mold mold positioned next to the mold mold.

In this way, the resin supplied by the injection pressure from the resin injection unit 20 is sequentially supplied to each mold mold 50 arranged in a row, and when the last mold mold 50 is reached, each mold mold 50 is in the reflector. The resin is filled to form a lens. When the resin is cured after a certain period of time, the LED package in which the lens is formed can be obtained from the mold 50.

As such, the molding apparatus does not receive resin from each of the molds 50 individually, but the resin is continuously injected from each mold 50 to the next mold 50 to minimize the length of the supply tube 21. It is possible to reduce the waste of resin remaining in the supply pipe.

On the other hand, Figure 3 is another embodiment of the present molding apparatus, the present molding apparatus is connected to the resin injection unit 30 and the resin injection unit for injecting the resin into each mold 50, the resin is supplied It includes a plurality of supply pipes 31 to which resin is supplied, and a plurality of molds 50 connected to each of the supply pipes and arranged in a line with each other. It also includes an intermediate supply pipe (33) for connecting between the rows made by a plurality of molds 50 arranged in sequence.

That is, in the molding apparatus of the present embodiment, only one column of two rows made by the mold frame 50 is connected through the resin injection unit 30 and the supply pipe 31, and the heat and the remaining rows are the intermediate supply pipe 33. It is connected through the structure.

The plurality of molds 50 forming each row are sequentially arranged in a row, and a connection pipe 32 for distributing resin is installed between the molds 50 in each row so as to communicate with each other.

Therefore, when resin is injected from the resin injection unit 30, the resin is injected into the mold mold 50 in one row through the supply pipe 31. Then, the resin is continuously injected by the predetermined pressure from the resin injecting portion, so that the resin is injected into the mold 50 after passing through the mold 50 and through the connecting pipe 32. Then, the resin injected into the mold 50 is filled in the reflector in the mold 50 to form a lens, and is then sequentially injected into each mold 50 arranged sequentially through the connecting pipe 32. .

In this way, the resin supplied by the injection pressure from the resin injection unit 30 is sequentially supplied to each mold mold 50 arranged in a row, and each mold mold 50 forming one row when the final mold mold 50 is reached. ) Is filled with resin to form a lens. As the resin continues to be supplied, the resin is supplied to the next row through the intermediate supply pipe 33 connecting one row to the next row. The resin supplied to the next row is sequentially injected into the mold 50 forming the next row and filled in the reflector.

Thus, the molding apparatus of this embodiment is provided with only one supply pipe 31 to be able to inject the resin into the mold 50 of each row.

4 shows another embodiment of the present molding apparatus.

According to the above drawings, the molding apparatus includes a resin injection unit 40 for injecting resin into each mold 50 and a plurality of supply pipes 41 connected to the resin injection unit for supplying resin. A plurality of molds 50 connected to the respective supply pipes and arranged in a line with each other, wherein the molds 50 are installed to abut each other, and the resin is directly next to the mold 50 at one side. The structure supplied to 50 is made.

According to the present embodiment, as shown in FIG. 4, two pairs of rows are connected to the resin injection unit 40 through the supply pipe 41, respectively, but only one column in addition to such a structure is the resin injection unit through the supply pipe. It is also possible to apply a structure in which an intermediate supply pipe is connected between the column and the other column is connected between the column and the column.

Since the mold die 50 in each row is installed in contact with each other, a separate member for resin flow is not installed between the mold die 50 and the mold die 50. Although not shown, the mold 50 has a passage for distributing resin on a contact surface with a neighboring mold 50.

When the resin is injected from the resin injection portion 40, the resin is injected into the mold 50 of each row through the supply pipe 41. Then, the resin is continuously injected from the resin injection unit by a predetermined pressure, so that the resin is directly contacted through the wire mold and connected to the mold. Then, the resin injected into the mold is filled in the reflector in the mold 50 to form a lens, and subsequently injected into each mold 50 which is arranged sequentially.

In this way, the resin supplied by the injection pressure from the resin injection part is sequentially supplied to each mold mold 50 arranged in a row, and when the mold mold 50 reaches the last mold mold 50, each mold mold 50 forming one row is a reflector. The resin is filled in to form a lens.

In this way, in the molding apparatus, each mold 50 is not individually supplied with resin from a supply pipe, but resin is continuously injected from each mold 50 to the next mold 50 so that the mold mold 50 is in a region other than the mold 50. It is possible to minimize the amount of resin remaining in the waste.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

1 is a cross-sectional view showing an example of a light emitting diode package manufactured by a molding apparatus according to an embodiment of the present invention.

2 is a schematic perspective view of a light emitting diode package molding apparatus according to a first embodiment of the present invention.

3 is a schematic perspective view of a light emitting diode package molding apparatus according to a second embodiment of the present invention.

4 is a schematic perspective view of a light emitting diode package molding apparatus according to a third embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

20,30,40: Resin injection part 21,31,41: Supply pipe

22,32 Connector 33 Intermediate Supply Pipe

50 mold

Claims

A resin injection portion through which resin is injected,

At least one supply pipe connected to each of the resin injection parts and supplied with resin,

A plurality of mold frames connected to the supply pipe and supplied with resin to form a body in a lead frame,

The plurality of molds are sequentially arranged in a mold connected to the supply pipe and communicate with each other, so that the resin is sequentially supplied according to the arrangement order of the molds,

At least one row of the molds arranged in sequence is provided, and a row of the molds is connected to the supply pipe.

The method of claim 1,

A plurality of light emitting diode package molding apparatus is provided with a plurality of rows and supply pipes of the mold mold, each row and the supply pipe of the mold mold.

The method of claim 1,

A plurality of rows of the mold frame is provided, one row of each row is connected to the resin injection portion through the supply pipe, the remaining row is connected to the light emitting diode package molding apparatus via an intermediate supply pipe installed between the rows.

4. The method according to any one of claims 1 to 3,

Light emitting diode package molding apparatus further comprises a connection pipe is installed between the mold each resin passing through.

4. The method according to any one of claims 1 to 3,

The mold assembly is in contact with each other, the light emitting diode package molding apparatus is supplied to the next mold die from the resin mold.

The method of claim 1,

The mold frame is a light emitting diode package molding apparatus for molding a lens on the light emitting diode.

The method of claim 1,

The resin is a light emitting diode package molding apparatus of a solid or liquid thermosetting epoxy resin.

The method of claim 1,

The resin is a light emitting diode package molding apparatus of a solid or liquid silicone resin.