KR101202169B1 - Method of fabricating light emitting diode package having multi-molding members - Google Patents

Method of fabricating light emitting diode package having multi-molding members Download PDF

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Publication number
KR101202169B1
KR101202169B1 KR1020060095652A KR20060095652A KR101202169B1 KR 101202169 B1 KR101202169 B1 KR 101202169B1 KR 1020060095652 A KR1020060095652 A KR 1020060095652A KR 20060095652 A KR20060095652 A KR 20060095652A KR 101202169 B1 KR101202169 B1 KR 101202169B1
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KR
South Korea
Prior art keywords
molding
light emitting
molding member
emitting diode
package body
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Application number
KR1020060095652A
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Korean (ko)
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KR20080029469A (en
Inventor
표병기
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서울반도체 주식회사
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Priority to KR1020060095652A priority Critical patent/KR101202169B1/en
Publication of KR20080029469A publication Critical patent/KR20080029469A/en
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Publication of KR101202169B1 publication Critical patent/KR101202169B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

Disclosed is a method of manufacturing a light emitting diode package having multiple molding members. The method includes preparing a package body on which a light emitting diode is mounted, and placing a mold cup on the package body to cover the light emitting diode. The first molding resin is injected into the mold cup so that an empty space remains inside the region surrounded by the package body and the mold cup. Thereafter, the package body and the mold cup are rotated integrally so that the mold cup goes down and the package body goes up. In this state, the first molding resin is cured to form a first molding member, and then, a second molding resin is injected into the space between the first molding member and the package main body to fill the space and cured to form a second molding member. A molding member is formed. Accordingly, a light emitting diode package having no defect in an interface between the first molding member and the second molding member is manufactured.

Light emitting diode, package, molding member, silicon, mold cup

Description

Method for manufacturing light emitting diode package having multiple molding members {METHOD OF FABRICATING LIGHT EMITTING DIODE PACKAGE HAVING MULTI-MOLDING MEMBERS}

1 to 4 are cross-sectional views illustrating a method of manufacturing a light emitting diode package according to an embodiment of the present invention.

The present invention relates to a method of manufacturing a light emitting diode package, and more particularly, to a method of manufacturing a light emitting diode package having multiple molding members.

In general, a light emitting diode package includes a package body on which the light emitting diode is mounted and a lens covering the light emitting diode to increase light emission efficiency within a certain direction angle.

The lens may be formed by molding a molding member formed to protect a light emitting diode into a lens shape. However, forming a single molding member into a lens shape to cover the light emitting diode is limited to simultaneously preventing deformation of the molding member by external force, preventing peeling of the molding member due to thermal cycle, and thus preventing breaking of the bonding wire. There is. That is, in order to prevent deformation of the molding member due to external force, the molding member is required to have a hardness value of a predetermined size or more. In this case, the molding member is peeled off from the package body due to the thermal cycle caused by the repeated operation of the light emitting diode. The bonding wire may be disconnected. Peeling of the molding member causes a decrease in luminous efficiency and a change in optical properties, and disconnection of the bond wires causes product defects.

Therefore, the light emitting diode is covered with a molding member having a relatively low hardness value, and the molded member having a large hardness value is covered with a lens shape, or a lens manufactured in advance by attaching the lens is formed on the molding member having a relatively low hardness value. The method is used.

The method of forming a molding member covering the light emitting diode and attaching the lens thereon has a problem in that the lens has a weak coupling force due to a weak coupling force between the lens and the molding member. To prevent this, it is possible to attach the lens using an adhesive, but it is not easy to select an adhesive for attaching the molding member and the lens, and there is a problem of reducing the luminous efficiency by interposing an adhesive having different properties between the molding member and the lens. There is. In addition, after molding the first molding member, the method of molding the second molding member in the shape of a lens, contaminants, etc. adhere to the first molding member may cause interfacial defects between the molding members, The molding process is complicated because the molding members must be formed using mold cups of a size.

Accordingly, there is a need for a method of manufacturing a light emitting diode package capable of preventing defects from occurring at an interface of the multi-molding member.

An object of the present invention is to provide a method of manufacturing a light emitting diode package that can prevent the occurrence of defects at the interface between the molding members.

Another object of the present invention is to provide a method of manufacturing a light emitting diode package having an outer surface of a lens shape and preventing peeling of the molding member and disconnection of the bonding wire.

In order to achieve the above technical problem, the present invention provides a light emitting diode package manufacturing method having a multi-molding member. This method includes preparing a package body on which a light emitting diode is mounted. A mold cup is coupled on the package body to cover the light emitting diode, and a first molding resin is injected into the mold cup so that an empty space remains inside the package body and an area surrounded by the mold cup. Thereafter, the package body and the mold cup are rotated integrally so that the mold cup goes down and the package body goes up. Subsequently, the first molding resin is cured to form a first molding member. Accordingly, a space is formed between the first molding member and the package body, and a second molding resin is injected into the space between the first molding member and the package body to fill the space. Thereafter, the second molding resin is cured to form a second molding member. As a result, an external first molding member is formed, and a second molding member which fills the space between the first molding member and the package is formed later, so that a defect occurs at an interface between the first molding member and the second molding member. Can be prevented. In addition, by selecting the shape of the mold cup, it is possible to easily form the first molding member in the required lens shape.

The first molding member preferably has a hardness value that is relatively larger than that of the second molding member. Accordingly, the deformation of the first molding member due to the external force can be prevented, and the second molding member can be prevented from being peeled from the package body.

Meanwhile, the first molding resin and the second molding resin may be epoxy or silicon, respectively. In particular, silicon is suitable as a molding member material because it can prevent deformation due to light emitted from the light emitting diode.

The first molding member may be formed to adhere to the package body. Accordingly, a space surrounded by the first molding member and the package body is formed. Meanwhile, the mold cup may be separated from the package body before injecting the second molding resin.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, widths, lengths, thicknesses, and the like of components may be exaggerated for convenience. Like numbers refer to like elements throughout.

Referring to FIG. 1, a package main body 13 on which a light emitting diode 15 is mounted is prepared. The package body may be formed by insert molding a lead frame 11 having lead electrodes, and may be formed of a thermosetting or thermoplastic resin. The lead frame 11 may be formed by drilling a metal plate such as copper (Cu) or aluminum (Al).

The package body 13 is formed to have a recess that exposes the lead electrodes. Guide grooves 13a and 13b leading to the recess may be formed on an upper surface of the package body 13. The guide groove 13a is for guiding the injected resin, and the guide groove 13b is for discharging air and resin.

On the other hand, the light emitting diode 15 is mounted in the recess region. The light emitting diode 15 may be mounted on the lead electrode as illustrated, but is not limited thereto, and may be mounted on the top surface of the package body 13 in the recess. The light emitting diode 15 is electrically connected to the lead electrodes through a bonding wire. When the light emitting diode 15 is a one-bond die having electrodes on its upper and lower surfaces, respectively, it is adhered to the lead electrode using a conductive adhesive, and the upper electrode of the light emitting diode 15 is bonded to the bonding wire. Can be connected to other lead electrodes. In contrast, when the light emitting diode 15 is a two-bond die having two electrodes on its top surface, two electrodes are connected to the lead electrodes, respectively, through bonding wires. The light emitting diode 15 may be mounted on a submount (not shown), and the submount may be connected to the lead electrodes through a bonding wire.

A mold cup 21 is coupled to the package body 10 to cover the light emitting diode. The mold cup 21 may have various shapes of inner surfaces corresponding to desired lens shapes. For example, to form a convex lens, the mold cup 21 has a concave inner surface as shown. In addition, in order to form scattering patterns on the lens surface, the mold cup 21 may have an uneven pattern corresponding to scattering patterns on its inner surface. The mold cup 21 may be formed of various materials. For example, the mold cup 21 may be formed by injection molding plastic.

On the other hand, the mold cup 21 is in close contact with the package body 10, thereby forming a space surrounded by the mold cup 21 and the package body 10. The mold cup 21 has an inlet 21a for injecting molding resin and an outlet 21b for discharging air, and the inlet and outlet are respectively connected to guide grooves 13a and 13b formed in the package body. .

The first molding resin 23 is injected through the injection hole 21a. The first molding resin is injected through the injection hole 21a and flows into the recess of the package body 13 through the guide groove 13a. In this case, the first molding resin 23 is injected so that a space remains between the mold cup 21 and the package body 13. The first molding resin may be epoxy or silicone having a relatively high hardness value after curing.

Referring to FIG. 2, the mold cup 21 and the package body 13 are integrally rotated such that the mold cup 21 faces downward and the package body 13 faces upward. Accordingly, the first molding resin injected into the recess of the package main body 13 flows toward the mold cup 21. At this time, the first molding resin is kept concave up on the inner surface of the mold cup 21 as shown by its viscosity and surface tension. In order to symmetrically position the first molding resin, the mold cup 21 and the package body 13 may be shaken or rotated in a disordered manner.

Thereafter, the first molding resin is cured to form a first molding member 23a. The first molding member 23a may be formed to be bonded to the package body 13.

Referring to FIG. 3, the mold cup 21 is separated from the package body 13. Accordingly, the first molding member 23a remains adhered to the package body 13 and is exposed to the outside. Meanwhile, a space is formed between the first molding member 23a and the package body 13, and the second molding resin 25 is injected into the space to fill the space. The second molding resin may be made of the same material as that of the first molding resin 23, for example, epoxy or silicon, except that the hardness of the second molding resin is lower than that of the first molding resin 23, or is cured. It is preferably a gel phase.

The second molding resin 25 may be injected through the first molding member 23 using an injection mechanism such as a syringe. At this time, a passage through which air can be discharged is made to discharge the air remaining in the space. Meanwhile, in order to prevent air from being trapped in the second molding resin 25 and an interface between the first molding member 23 and the second molding resin, air may be discharged using a vacuum pump.

The second molding resin 25 is preferably injected to completely fill the space formed between the first molding member 23a and the package body 13. Accordingly, the second molding resin 25 is in close contact with the first molding member 23a and fills a recess of the package body 13 to seal the light emitting diode 15 and the bonding wire.

Referring to FIG. 4, a second molding member 25a is formed by curing the second molding resin 25. The second molding member 25a is coupled to the first molding member and covers the light emitting diodes and the bonding wires. Since the second molding member 25a is gel-like or has a relatively low hardness value, the second molding member 25a may be prevented from peeling off due to a thermal cycle due to the repeated operation of the light emitting diode, and as a result, disconnection of the bonding wire may be prevented. .

Meanwhile, lead electrodes are separated from the lead frame 11, and the lead electrodes are variously bent to complete the LED package.

In the present embodiment, the package main body 13 having a recess has been described as an example, but the present invention is not limited thereto, and a package main body without a recess may be used. It may also be applied to a package body coupled with a heat sink.

In the present embodiment, the mold cup 21 is described as being separated from the package body 13 after forming the first molding member, but the mold cup 21 is separated from the package body after forming the second molding member. Can be. In this case, the first molding member may not be directly bonded to the package body.

Meanwhile, the first molding member and / or the second molding member may contain phosphors therein. Accordingly, light of various colors can be realized by the combination of the light emitting diode and the phosphor, and for example, a light emitting diode package emitting white light can be provided.

According to the embodiments of the present invention, since the first and second molding members are formed using one mold cup 21, the molding process can be prevented from being complicated, and the first molding members are formed in various lens shapes. can do. In addition, since the second molding member fills the space formed by the first molding member, contaminants adhere to the interface between the first and second molding members, thereby preventing the interface defect. In addition, since the second molding member having a relatively low hardness value is used, peeling of the molding member and disconnection of the bonding wire can be prevented.

Claims (5)

Prepare the package body equipped with a light emitting diode, Bonding a mold cup on the package body to cover the light emitting diode; Injecting the first molding resin into the mold cup so that a space remains inside the region surrounded by the package body and the mold cup, Integrally rotating the package body and the mold cup so that the mold cup goes down and the package body goes up, Curing the first molding resin to form a first molding member, Filling the space by injecting a second molding resin into the space between the first molding member and the package body; And curing the second molding resin to form a second molding member. The method according to claim 1, The first molding member has a greater hardness value than the second molding member manufacturing method of the LED package. The method according to claim 2, The first molding resin and the second molding resin is a light emitting diode package manufacturing method, characterized in that the silicon. The method according to claim 1, The first molding member is a light emitting diode package manufacturing method formed to be bonded to the package body. The method of claim 4, The mold cup is separated from the package body before injecting the second molding resin.
KR1020060095652A 2006-09-29 2006-09-29 Method of fabricating light emitting diode package having multi-molding members KR101202169B1 (en)

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KR101202169B1 true KR101202169B1 (en) 2012-11-15

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101102237B1 (en) * 2008-12-23 2012-01-03 (주) 아모엘이디 LED package, method of manufacturing LED package, back light unit and lighting device
KR101009917B1 (en) * 2009-06-03 2011-01-20 주식회사 참테크 LED manufacturing apparatus
KR101289073B1 (en) * 2011-12-30 2013-07-22 삼성전자주식회사 Mold for lighting emitting device package and method of manufacturing lens of light emitting device package
KR101867304B1 (en) * 2012-03-15 2018-06-15 삼성전자주식회사 Method of fabricating light emitting apparatus
KR101471099B1 (en) * 2013-08-26 2014-12-10 김형수 Menufature method for light emitting diode phosphor using alumina

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119837A (en) 2002-09-27 2004-04-15 Toshiba Corp Method of manufacturing optical semiconductor device
JP2004343059A (en) 2003-04-24 2004-12-02 Nichia Chem Ind Ltd Semiconductor device and its manufacturing method
JP2006013311A (en) 2004-06-29 2006-01-12 Nichia Chem Ind Ltd Light emitting device and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119837A (en) 2002-09-27 2004-04-15 Toshiba Corp Method of manufacturing optical semiconductor device
JP2004343059A (en) 2003-04-24 2004-12-02 Nichia Chem Ind Ltd Semiconductor device and its manufacturing method
JP2006013311A (en) 2004-06-29 2006-01-12 Nichia Chem Ind Ltd Light emitting device and manufacturing method thereof

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