KR20080097912A - Light emitting diode module having lens and the manufacturing method thereof - Google Patents

Abstract

The lens integrated LED module and the manufacturing method thereof are provided to improve the productivity by molding a plurality of lenses in one process. The lens integrated LED method for manufacturing module includes the step of mounting the mounted lead frame assembly(100) on which a plurality of LED modules(120) mounted to the securing jig(200); the step of injecting liquid resin in a plurality of lens cavities(310) formed in the molded member; the step of binding the securing jig to the molded member; the step of forming the lens in the LED module it ossifies the liquid resin.

Description

Lens-integrated LED module and its manufacturing method {LIGHT EMITTING DIODE MODULE HAVING LENS AND THE MANUFACTURING METHOD THEREOF}

The present invention relates to a lens-integrated LED module and a method of manufacturing the lens integrally molded with a lens for deflecting the light emitted from the LED in the desired direction.

1A and 1B are process flowcharts illustrating a manufacturing process of an LED module according to the prior art.

Looking at the manufacturing process of the light emitting diode (LED) module according to the prior art, as shown in FIG. 1A, first, the lens 20 is aligned on the upper side of the LED module 10.

The LED module 10 forms a housing 14 on the lead frame 12 and mounts the light emitting chip 16 inside the housing 14. Then, after electrically connecting between the light emitting chip 16 and the housing 14 by using a wire, the protective material 18 for protecting the chip is filled in the housing 14 in which the light emitting chip 16 is mounted, and then, for a predetermined time. Cure for a while. The protective material 18 includes a wavelength converting agent for converting a light emission wavelength of light emitted from the light emitting chip 16.

As shown in FIG. 1B, a lens 20 is coupled to an upper surface of the housing 14 to deflect light emitted from the light emitting chip 16 in a desired direction.

The lens 20 is manufactured separately from the housing 14 by a method such as transfer molding or injection molding, and the manufactured lens is adhered to the surface of the housing 14 by applying a bonding liquid 30 to the surface thereof.

However, the method of manufacturing a light emitting diode (LED) according to the prior art as described above requires a separate manufacturing process of a lens and a bonding process of combining the lens and the housing, thus making the manufacturing process complicated and costly and reducing productivity. There is this.

In addition, there is a problem in that an expensive equipment for aligning the housing and the lens is required because the position of the housing and the lens must be accurately aligned in the bonding process of combining the lens and the housing.

In addition, when the bonding liquid is not correctly applied to the surface of the lens and the housing, there is a problem that the interface between the lens and the housing without the bonding liquid is present, thereby degrading the light extraction efficiency of the LED or uneven distribution of light.

It is an object of the present invention to provide a LED module manufacturing method which can shorten the manufacturing process and reduce the manufacturing cost since the process of separately manufacturing the lens and the equipment for aligning the lens and the housing are unnecessary.

Another object of the present invention is to provide a LED module that can eliminate the process of bonding the lens and the housing to improve the light extraction efficiency and uniform the distribution of light.

Still another object of the present invention is to provide a method for manufacturing an LED module, which can increase the productivity by forming a plurality of lenses in a single process on a plurality of LEDs and increasing the productivity.

Method for manufacturing a lens-integrated LED module according to the present invention comprises the steps of mounting a lead frame assembly equipped with a plurality of LED modules in a fixing jig, injecting a liquid resin into a plurality of lens cavities formed in the mold member, the mold member The step of coupling to the fixing jig, and curing the liquid resin to form a lens on the LED module.

Injecting the liquid resin into the lens cavity is characterized in that the quantity of the liquid resin is injected into the lens cavity by a plurality of resin injectors disposed on the upper side of the mold member.

The method of manufacturing a lens integrated LED module according to the present invention further includes removing bubbles contained in the liquid resin injected into the lens cavity, and the bubble removing step includes mounting a mold member and a lead frame assembly into which the liquid resin is injected. Put the fixed jig into the vacuum chamber to convert the pressure in the vacuum chamber to a vacuum state to remove the bubbles contained in the liquid resin, characterized in that for coupling the mold member and the fixed jig and converting to atmospheric pressure.

Lens-integrated LED module according to the present invention is a lead frame assembly equipped with a plurality of LED modules, a liquid resin is injected into each of the plurality of lens cavities formed in the mold member and bonded to the lead frame assembly and then cured the liquid resin LED It includes a lens formed on the surface of the module.

According to the above configuration, the lens-integrated LED module according to the present invention and a method of manufacturing the liquid resin by mounting a mold member formed with a lens cavity in which a liquid resin is injected to a fixing jig equipped with a lead frame assembly having a plurality of LED modules When curing the lens, the lens is formed on the surface of the LED module, the process of manufacturing the lens separately and the equipment for aligning the lens and the housing is unnecessary, there is an advantage that can shorten the manufacturing process and reduce the manufacturing cost.

In addition, since the liquid resin is cured on the surface of the LED to form a lens, the process of bonding the lens and the housing can be removed, thereby improving light extraction efficiency and uniformizing light distribution.

In addition, it is possible to form a plurality of lenses in a single process in a plurality of LED modules can increase the productivity and there is an advantage that can be mass-produced.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view of a lead frame assembly according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a lead frame assembly according to an embodiment of the present invention.

The LED manufacturing process according to an embodiment of the present invention will be described sequentially below.

First, as shown in FIGS. 2 and 3, the lead frame assembly 100 is prepared. The lead frame assembly 100 has a plurality of LED modules 120 mounted on the lead frame 110.

The LED module 120 integrally forms the plurality of housings 122 in the lead frame 110, mounts the light emitting chips 124 in the respective housings 122, and then connects the light emitting chips 124 by wire bonding. Electrically connected A protective material 126 for protecting the light emitting chip 124 is filled in the housing 122. The protective material 126 may be added a wavelength conversion agent for converting the light emission wavelength of the light emitted from the light emitting chip 124.

The protective material 126 is formed of a transparent resin material that can pass light, and is injected into the housing 122 and then cured by applying heat or irradiating light.

A reflective layer reflecting light generated from the light emitting chip 124 may be formed on an inner wall surface of the housing 122.

And, as shown in Figure 4, the lead frame assembly 100 is fixed to the fixing jig 200. The lead frame assembly 100 is fixed while maintaining parallel to the fixing jig 200.

The fixing jig 200 is provided with an accommodating part 210 in which the lead frame assembly 100 is accommodated. The accommodating part 210 is formed to a size on which the lead frame assembly 100 can be seated, and a plurality of housings 122 formed in the lead frame 100 are inserted into the bottom surface of the accommodating part 210. An insertion groove 220 is formed to accurately align the mounting position of the housing 122.

As shown in FIG. 5, a mold member 300 having a plurality of lens cavities 310 having the same shape as that of the lens is prepared. Here, the lens cavities 310 are formed in the same number as the number of the housing 122 and aligned so that they can be exactly matched with the position of the housing 122.

Then, the liquid resin 320 is injected into the lens cavity 310 of the mold member 300. When the liquid resin 320 is cured in a later process, the liquid resin 320 becomes a refractive lens that deflects the light emitted from the LED module 120 in a desired direction.

Herein, a method of injecting the liquid resin 320 into the lens cavity 310 will be described. A plurality of resin injectors 330 may be disposed on the mold member 300 to the lens cavity 310 through the resin injector 330. A fixed amount of liquid resin 320 is to be injected. Therefore, it is not necessary to form a separate groove or injection hole for filling the liquid resin in the mold member 300.

In addition to the above-described method, a method of injecting a liquid resin into the lens cavity may be sequentially performed by one resin injector.

As the liquid resin 320, a resin that is cured by heat or light is used. When using a photopolymer resin that is cured by irradiation with ultraviolet rays, a mold member made of a polymer or glass capable of transmitting ultraviolet rays is used. In addition, it is preferable to use a high-durability metal mold member capable of withstanding heat when a heat-cured resin that is cured when heat is used.

When the injection of the liquid resin 320 into the lens cavity 310 of the mold member 300 is completed, as shown in FIG. 6, the mold jig 200 having the lead frame assembly 100 mounted thereon is mounted. To a process). At this time, before the fixing jig 200 and the mold member 300 is coupled, a process of removing bubbles contained in the liquid resin 320 is first performed. That is, when the mold member 300 is mounted on the fixing jig 200, the surface of the liquid resin 320 and the surface of the LED module 120 come into contact with each other. In this case, the shape of the LED module 120 or the liquid resin Due to the surface tension of the bubbles are trapped inside the liquid resin (320). As described above, when the liquid resin 320 is cured in a state in which bubbles are trapped inside the liquid resin 320, defects are generated. Therefore, a process of removing bubbles from the liquid resin 320 must be performed.

In the process of removing bubbles from the liquid resin 320, the fixing jig 200 in which the mold member 300 and the LED module 120 are mounted is disposed in the vacuum chamber, and then the inside of the vacuum chamber is converted into a vacuum state so that the liquid resin ( After removing the bubbles from the 320, the mold member 300 and the fixing jig 200 equipped with the LED module 120 are coupled to each other. Then, the liquid resin 320 and the LED module 120 are in contact with each other in a state in which bubbles are removed. When the film is switched to atmospheric pressure again, a bubble-free lens is manufactured.

Guide portions 410 and 420 are formed between the mold member 300 and the fixing jig 200 to accurately align the fastening positions between the mold member 300 and the fixing jig 200.

The guide parts 410 and 420 are guide grooves 410 formed at the edge of the mold member 300, and guide pins 420 mounted to protrude from the surface of the fixing jig 200 and fitted into the guide grooves 410. It is composed. That is, when the guide pin 420 is inserted into the guide groove 410, the fastening position between the mold member 300 and the fixing jig 200 is accurately aligned.

Here, the guide pin 420 may be formed integrally with the fixing jig 200 and may be separately formed from the fixing jig 200 and mounted on the fixing jig 200.

In addition, in the case where the liquid resin 320 is thermally cured by heat, when heat is applied while the fixing jig 200 and the mold member 300 are combined, the liquid resin 320 is cured and the LED module 120 is cured. Lens 400 is formed on the surface.

In addition, when the liquid resin 320 uses a photopolymerized resin that is cured by light, when the fixing jig 200 and the mold member 300 are combined with ultraviolet light, the ultraviolet light passes through the mold member 300 to allow the liquid resin to flow. The lens 400 is formed on the surface of the LED module 120 by being transferred to the 320 to cure the liquid resin 320. Here, the ultraviolet irradiation device is installed on the lower side of the mold member 300 so that the ultraviolet light can be transmitted to the liquid resin 320 through the mold member 300.

When the manufacturing of the lens 400 is completed by such a process, as shown in FIG. 4, when the fixing jig 200 and the mold member 300 are separated, the LED module 120 having the plurality of lenses 400 mounted thereon. The lead frame assembly 100 provided with) is completed.

Although described above with reference to preferred embodiments of the present invention, those skilled in the art or those skilled in the art without departing from the spirit and scope of the invention described in the claims to be described later Various modifications and variations can be made in the present invention without departing from the scope thereof.

1A and 1B are process flowcharts illustrating a manufacturing process of an LED module according to the prior art.

2 is a plan view of a lead frame assembly according to an embodiment of the present invention.

3 is a cross-sectional view of a lead frame assembly according to an embodiment of the present invention.

Figure 4 is a cross-sectional view showing a state in which the lead frame assembly is mounted on the fixing jig according to an embodiment of the present invention.

5 is a cross-sectional view showing a process of injecting a liquid resin into the lens cavity of the mold member according to an embodiment of the present invention.

6 is a cross-sectional view showing a state in which a mold member and a fixing jig are coupled according to an embodiment of the present invention.

7 is a cross-sectional view of a lead frame assembly having a plurality of lens integrated LED modules according to an embodiment of the present invention.

Claims (15)

Mounting a lead frame assembly having a plurality of LED modules mounted on a fixing jig; Injecting a liquid resin into a plurality of lens cavities formed in the mold member; Coupling the mold member to a fixing jig; The method of manufacturing a lens integrated LED module comprising curing the liquid resin to form a lens on the LED module. The method of claim 1, The lead frame assembly is formed by integrally forming a plurality of housings in the lead frame, mounting the light emitting chip in the housing, wire bonding the light emitting chip, and injecting a protective material into the housing. Manufacturing method. The method of claim 2, The fixing jig is provided with an accommodating part for accommodating a lead frame assembly, and the bottom surface of the accommodating lens integrated LED module manufacturing method, characterized in that a plurality of insertion grooves are formed is inserted into the housing. The method of claim 1, Injecting the liquid resin into the lens cavity is a lens integrated LED module manufacturing method, characterized in that the quantity of the liquid resin is injected into the lens cavity by a plurality of resin injectors disposed on the upper side of the mold member. The method of claim 1, The fixing jig and the mold member is a lens integrated LED module manufacturing method, characterized in that the guide portion for precisely aligning the fastening position between the fixing jig and the mold member. The method of claim 5, wherein The guide unit is a lens-integrated LED module manufacturing method comprising a guide pin formed on at least two fixing jig, and at least two guide grooves formed in the mold member to be coupled to the guide pin. The method of claim 1, The method of claim 1, further comprising removing bubbles contained in the liquid resin injected into the lens cavity. The method of claim 7, wherein The step of removing the bubbles contained in the liquid resin is to insert the mold member and the lead frame assembly in which the liquid resin is injected into the vacuum chamber to convert the pressure in the vacuum chamber into a vacuum state to remove the bubbles contained in the liquid resin Method of manufacturing a lens-integrated LED module, characterized in that after removing the mold member and the fixing jig is coupled to the atmospheric pressure. The method of claim 1, Forming a lens on the LED module is a lens-integrated LED module manufacturing method, characterized in that by bonding the mold member and the fixing jig to contact the surface of the liquid resin and the surface of the LED module to each other and then heated to cure the liquid resin. The method of claim 9, The mold member is a lens-integrated LED module manufacturing method, characterized in that formed of a highly durable metal material that can withstand heat. The method of claim 1, Forming a lens on the LED module is a lens-integrated LED module manufacturing, characterized in that by bonding the mold member and the fixing jig to contact the surface of the liquid resin and the surface of the LED module with each other and then irradiate UV light to cure the liquid resin. Way. The method of claim 11, The mold member is a lens-integrated LED module manufacturing method, characterized in that formed of a polymer or glass material that can pass ultraviolet light. A lead frame assembly having a plurality of LED modules mounted thereon; And a lens formed on the surface of the LED module by injecting a liquid resin into a plurality of lens cavities formed in a mold member, bonding the liquid resin to the lead frame assembly, and curing the liquid resin. The method of claim 13, The lens integrated LED module, characterized in that the liquid resin is formed of a material that is cured by heat. The method of claim 13, Lens liquid-type LED module, characterized in that the liquid resin is formed of a material that is cured by ultraviolet light.

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