JPWO2024057876A5 - - Google Patents

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Publication number
JPWO2024057876A5
JPWO2024057876A5 JP2024546818A JP2024546818A JPWO2024057876A5 JP WO2024057876 A5 JPWO2024057876 A5 JP WO2024057876A5 JP 2024546818 A JP2024546818 A JP 2024546818A JP 2024546818 A JP2024546818 A JP 2024546818A JP WO2024057876 A5 JPWO2024057876 A5 JP WO2024057876A5
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JP
Japan
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semiconductor device
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JP2024546818A
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English (en)
Japanese (ja)
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JPWO2024057876A1 (https=
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Priority claimed from PCT/JP2023/030657 external-priority patent/WO2024057876A1/ja
Publication of JPWO2024057876A1 publication Critical patent/JPWO2024057876A1/ja
Publication of JPWO2024057876A5 publication Critical patent/JPWO2024057876A5/ja
Pending legal-status Critical Current

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JP2024546818A 2022-09-16 2023-08-25 Pending JPWO2024057876A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022147744 2022-09-16
PCT/JP2023/030657 WO2024057876A1 (ja) 2022-09-16 2023-08-25 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024057876A1 JPWO2024057876A1 (https=) 2024-03-21
JPWO2024057876A5 true JPWO2024057876A5 (https=) 2025-05-27

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ID=90274976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024546818A Pending JPWO2024057876A1 (https=) 2022-09-16 2023-08-25

Country Status (3)

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US (1) US20250210578A1 (https=)
JP (1) JPWO2024057876A1 (https=)
WO (1) WO2024057876A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9589869B2 (en) * 2015-03-11 2017-03-07 Gan Systems Inc. Packaging solutions for devices and systems comprising lateral GaN power transistors
JP6827776B2 (ja) * 2016-11-15 2021-02-10 ローム株式会社 半導体デバイス
US11990455B2 (en) * 2019-06-24 2024-05-21 Rohm Co., Ltd. Semiconductor device
US12087677B2 (en) * 2021-01-22 2024-09-10 Semiconductor Components Industries, Llc Molded packaging for wide band gap semiconductor devices

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