JPWO2023286711A5 - - Google Patents

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Publication number
JPWO2023286711A5
JPWO2023286711A5 JP2023534776A JP2023534776A JPWO2023286711A5 JP WO2023286711 A5 JPWO2023286711 A5 JP WO2023286711A5 JP 2023534776 A JP2023534776 A JP 2023534776A JP 2023534776 A JP2023534776 A JP 2023534776A JP WO2023286711 A5 JPWO2023286711 A5 JP WO2023286711A5
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JP
Japan
Prior art keywords
copper
conductor film
separating
crosslinked layer
laminate according
Prior art date
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JP2023534776A
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English (en)
Japanese (ja)
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JP7597418B2 (ja
JPWO2023286711A1 (https=
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Priority claimed from PCT/JP2022/027099 external-priority patent/WO2023286711A1/ja
Publication of JPWO2023286711A1 publication Critical patent/JPWO2023286711A1/ja
Publication of JPWO2023286711A5 publication Critical patent/JPWO2023286711A5/ja
Application granted granted Critical
Publication of JP7597418B2 publication Critical patent/JP7597418B2/ja
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JP2023534776A 2021-07-13 2022-07-08 銅-銅積層体の分離方法及び銅-銅積層体 Active JP7597418B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021115527 2021-07-13
JP2021115527 2021-07-13
PCT/JP2022/027099 WO2023286711A1 (ja) 2021-07-13 2022-07-08 銅-銅積層体の分離方法及び銅-銅積層体

Publications (3)

Publication Number Publication Date
JPWO2023286711A1 JPWO2023286711A1 (https=) 2023-01-19
JPWO2023286711A5 true JPWO2023286711A5 (https=) 2023-12-06
JP7597418B2 JP7597418B2 (ja) 2024-12-10

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ID=84919416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023534776A Active JP7597418B2 (ja) 2021-07-13 2022-07-08 銅-銅積層体の分離方法及び銅-銅積層体

Country Status (4)

Country Link
EP (1) EP4371678A4 (https=)
JP (1) JP7597418B2 (https=)
KR (1) KR102918834B1 (https=)
WO (1) WO2023286711A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0885830A (ja) * 1994-09-16 1996-04-02 Kobe Steel Ltd 銅または銅合金表面のめっき剥離法
CN100447264C (zh) * 2007-04-13 2008-12-31 浙江理工大学 一种从镀金废料中回收黄金的方法
JP6251935B2 (ja) * 2013-09-05 2017-12-27 国立研究開発法人物質・材料研究機構 接合方法
JP2016134497A (ja) * 2015-01-19 2016-07-25 凸版印刷株式会社 配線基板積層体及びこれを用いた半導体装置の製造方法
JP7018223B2 (ja) 2018-05-18 2022-02-10 国立研究開発法人物質・材料研究機構 積層体の製造方法、積層体、及び、暖房便座装置

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