JP7597418B2 - 銅－銅積層体の分離方法及び銅－銅積層体 - Google Patents

銅－銅積層体の分離方法及び銅－銅積層体 Download PDF

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JP7597418B2
JP7597418B2 JP2023534776A JP2023534776A JP7597418B2 JP 7597418 B2 JP7597418 B2 JP 7597418B2 JP 2023534776 A JP2023534776 A JP 2023534776A JP 2023534776 A JP2023534776 A JP 2023534776A JP 7597418 B2 JP7597418 B2 JP 7597418B2
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Prior art keywords
copper
conductor film
laminate
separating
copper conductor
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Japanese (ja)
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JPWO2023286711A5 (https=
JPWO2023286711A1 (https=
Inventor
暁津 重藤
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National Institute for Materials Science
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National Institute for Materials Science
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B09B3/70—Chemical treatment, e.g. pH adjustment or oxidation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0002—Preliminary treatment
    • C22B15/0004—Preliminary treatment without modification of the copper constituent
    • C22B15/0006—Preliminary treatment without modification of the copper constituent by dry processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B2101/00—Type of solid waste
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B2101/00—Type of solid waste
    • B09B2101/15—Electronic waste
    • B09B2101/17—Printed circuit boards [PCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
JP2023534776A 2021-07-13 2022-07-08 銅－銅積層体の分離方法及び銅－銅積層体 Active JP7597418B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021115527 2021-07-13
JP2021115527 2021-07-13
PCT/JP2022/027099 WO2023286711A1 (ja) 2021-07-13 2022-07-08 銅－銅積層体の分離方法及び銅－銅積層体

Publications (3)

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JPWO2023286711A1 JPWO2023286711A1 (https=) 2023-01-19
JPWO2023286711A5 JPWO2023286711A5 (https=) 2023-12-06
JP7597418B2 true JP7597418B2 (ja) 2024-12-10

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JP2023534776A Active JP7597418B2 (ja) 2021-07-13 2022-07-08 銅－銅積層体の分離方法及び銅－銅積層体

Country Status (4)

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EP (1) EP4371678A4 (https=)
JP (1) JP7597418B2 (https=)
KR (1) KR102918834B1 (https=)
WO (1) WO2023286711A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101092663A (zh) 2007-04-13 2007-12-26 浙江理工大学 一种从镀金废料中回收黄金的方法
WO2016116980A1 (ja) 2015-01-19 2016-07-28 凸版印刷株式会社 配線基板積層体及びこれを用いた半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0885830A (ja) * 1994-09-16 1996-04-02 Kobe Steel Ltd 銅または銅合金表面のめっき剥離法
JP6251935B2 (ja) * 2013-09-05 2017-12-27 国立研究開発法人物質・材料研究機構 接合方法
JP7018223B2 (ja) 2018-05-18 2022-02-10 国立研究開発法人物質・材料研究機構 積層体の製造方法、積層体、及び、暖房便座装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101092663A (zh) 2007-04-13 2007-12-26 浙江理工大学 一种从镀金废料中回收黄金的方法
WO2016116980A1 (ja) 2015-01-19 2016-07-28 凸版印刷株式会社 配線基板積層体及びこれを用いた半導体装置の製造方法

Also Published As

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WO2023286711A1 (ja) 2023-01-19
KR20230165328A (ko) 2023-12-05
KR102918834B1 (ko) 2026-01-27
JPWO2023286711A1 (https=) 2023-01-19
EP4371678A4 (en) 2025-08-06
EP4371678A1 (en) 2024-05-22

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