KR102918834B1 - 구리-구리 적층체의 분리 방법 및 구리-구리 적층체 - Google Patents
구리-구리 적층체의 분리 방법 및 구리-구리 적층체Info
- Publication number
- KR102918834B1 KR102918834B1 KR1020237038023A KR20237038023A KR102918834B1 KR 102918834 B1 KR102918834 B1 KR 102918834B1 KR 1020237038023 A KR1020237038023 A KR 1020237038023A KR 20237038023 A KR20237038023 A KR 20237038023A KR 102918834 B1 KR102918834 B1 KR 102918834B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- cross
- conductor film
- laminate
- separating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/70—Chemical treatment, e.g. pH adjustment or oxidation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0002—Preliminary treatment
- C22B15/0004—Preliminary treatment without modification of the copper constituent
- C22B15/0006—Preliminary treatment without modification of the copper constituent by dry processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B2101/00—Type of solid waste
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B2101/00—Type of solid waste
- B09B2101/15—Electronic waste
- B09B2101/17—Printed circuit boards [PCB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021115527 | 2021-07-13 | ||
| JPJP-P-2021-115527 | 2021-07-13 | ||
| PCT/JP2022/027099 WO2023286711A1 (ja) | 2021-07-13 | 2022-07-08 | 銅-銅積層体の分離方法及び銅-銅積層体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230165328A KR20230165328A (ko) | 2023-12-05 |
| KR102918834B1 true KR102918834B1 (ko) | 2026-01-27 |
Family
ID=84919416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237038023A Active KR102918834B1 (ko) | 2021-07-13 | 2022-07-08 | 구리-구리 적층체의 분리 방법 및 구리-구리 적층체 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4371678A4 (https=) |
| JP (1) | JP7597418B2 (https=) |
| KR (1) | KR102918834B1 (https=) |
| WO (1) | WO2023286711A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015051542A (ja) | 2013-09-05 | 2015-03-19 | 独立行政法人物質・材料研究機構 | 接合方法、及び接合装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0885830A (ja) * | 1994-09-16 | 1996-04-02 | Kobe Steel Ltd | 銅または銅合金表面のめっき剥離法 |
| CN100447264C (zh) * | 2007-04-13 | 2008-12-31 | 浙江理工大学 | 一种从镀金废料中回收黄金的方法 |
| JP2016134497A (ja) * | 2015-01-19 | 2016-07-25 | 凸版印刷株式会社 | 配線基板積層体及びこれを用いた半導体装置の製造方法 |
| JP7018223B2 (ja) | 2018-05-18 | 2022-02-10 | 国立研究開発法人物質・材料研究機構 | 積層体の製造方法、積層体、及び、暖房便座装置 |
-
2022
- 2022-07-08 WO PCT/JP2022/027099 patent/WO2023286711A1/ja not_active Ceased
- 2022-07-08 JP JP2023534776A patent/JP7597418B2/ja active Active
- 2022-07-08 KR KR1020237038023A patent/KR102918834B1/ko active Active
- 2022-07-08 EP EP22842055.0A patent/EP4371678A4/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015051542A (ja) | 2013-09-05 | 2015-03-19 | 独立行政法人物質・材料研究機構 | 接合方法、及び接合装置 |
Non-Patent Citations (3)
| Title |
|---|
| A, Akitsu Shigetou et al. "VUV-Assisted Low Temperature Bonding For Organic/Inorganic Hybrid Integration at Atmospheric Pressure". 2013 3rd IEEE CPMT Symposium Japan. |
| Akitsu Shigetou et al. "Hybrid Bonding of Organic/Inorganic Substrates in Ambient Air for Eco-Friendly 3D Integration of Microelectronics". 2012 Electronics Goes Green 2012+. |
| Akitsu Shigetou et al. "Modified Diffusion Bonding of Chemical Mechanical Polishing Cu at 150 ℃ at Ambient Prssure". Applied Physics Express. |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023286711A1 (ja) | 2023-01-19 |
| JP7597418B2 (ja) | 2024-12-10 |
| KR20230165328A (ko) | 2023-12-05 |
| JPWO2023286711A1 (https=) | 2023-01-19 |
| EP4371678A4 (en) | 2025-08-06 |
| EP4371678A1 (en) | 2024-05-22 |
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