JPWO2023276982A5 - - Google Patents
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- Publication number
- JPWO2023276982A5 JPWO2023276982A5 JP2023531962A JP2023531962A JPWO2023276982A5 JP WO2023276982 A5 JPWO2023276982 A5 JP WO2023276982A5 JP 2023531962 A JP2023531962 A JP 2023531962A JP 2023531962 A JP2023531962 A JP 2023531962A JP WO2023276982 A5 JPWO2023276982 A5 JP WO2023276982A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- platinum
- containing layer
- thin wire
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 120
- 229910052751 metal Inorganic materials 0.000 claims description 83
- 239000002184 metal Substances 0.000 claims description 83
- 229910052697 platinum Inorganic materials 0.000 claims description 60
- 239000000758 substrate Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 26
- 238000009833 condensation Methods 0.000 claims description 22
- 230000005494 condensation Effects 0.000 claims description 22
- 238000001514 detection method Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 10
- 238000001459 lithography Methods 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 238000007664 blowing Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021108423 | 2021-06-30 | ||
| JP2021108423 | 2021-06-30 | ||
| PCT/JP2022/025639 WO2023276982A1 (ja) | 2021-06-30 | 2022-06-28 | 液滴センサー、結露検出装置およびそれらの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023276982A1 JPWO2023276982A1 (https=) | 2023-01-05 |
| JPWO2023276982A5 true JPWO2023276982A5 (https=) | 2024-02-20 |
| JP7623738B2 JP7623738B2 (ja) | 2025-01-29 |
Family
ID=84689910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023531962A Active JP7623738B2 (ja) | 2021-06-30 | 2022-06-28 | 液滴センサー、結露検出装置およびそれらの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240295515A1 (https=) |
| EP (1) | EP4365583A4 (https=) |
| JP (1) | JP7623738B2 (https=) |
| WO (1) | WO2023276982A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7624042B1 (ja) | 2023-09-08 | 2025-01-29 | 藤倉コンポジット株式会社 | センサ及び複数のセンサを同時に製造する製造方法 |
| WO2025063276A1 (ja) * | 2023-09-22 | 2025-03-27 | 国立研究開発法人物質・材料研究機構 | 酢酸ガス濃度測定装置、その使用方法、および酢酸ガス濃度の測定方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009002802A (ja) * | 2007-06-21 | 2009-01-08 | Denso Corp | 被水センサおよび結露センサ |
| KR101019576B1 (ko) | 2008-11-14 | 2011-03-08 | 포항공과대학교 산학협력단 | 산화 알루미늄 다공층을 갖는 습도 센서 및 이의 제조 방법 |
| WO2016013544A1 (ja) | 2014-07-23 | 2016-01-28 | 国立研究開発法人物質・材料研究機構 | 高速応答・高感度乾湿応答センサー |
| EP3208610B1 (en) | 2016-02-18 | 2021-05-12 | ams AG | Sensor arrangement and method for generating measurement signals |
-
2022
- 2022-06-28 US US18/573,066 patent/US20240295515A1/en active Pending
- 2022-06-28 WO PCT/JP2022/025639 patent/WO2023276982A1/ja not_active Ceased
- 2022-06-28 EP EP22833129.4A patent/EP4365583A4/en active Pending
- 2022-06-28 JP JP2023531962A patent/JP7623738B2/ja active Active
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