JPWO2023233877A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023233877A5
JPWO2023233877A5 JP2024524244A JP2024524244A JPWO2023233877A5 JP WO2023233877 A5 JPWO2023233877 A5 JP WO2023233877A5 JP 2024524244 A JP2024524244 A JP 2024524244A JP 2024524244 A JP2024524244 A JP 2024524244A JP WO2023233877 A5 JPWO2023233877 A5 JP WO2023233877A5
Authority
JP
Japan
Prior art keywords
layer
film
film according
metal
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024524244A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023233877A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/016329 external-priority patent/WO2023233877A1/ja
Publication of JPWO2023233877A1 publication Critical patent/JPWO2023233877A1/ja
Publication of JPWO2023233877A5 publication Critical patent/JPWO2023233877A5/ja
Pending legal-status Critical Current

Links

JP2024524244A 2022-05-30 2023-04-25 Pending JPWO2023233877A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022087675 2022-05-30
PCT/JP2023/016329 WO2023233877A1 (ja) 2022-05-30 2023-04-25 フィルム、積層体、配線基板、積層配線基板、及び積層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023233877A1 JPWO2023233877A1 (https=) 2023-12-07
JPWO2023233877A5 true JPWO2023233877A5 (https=) 2025-02-07

Family

ID=89026291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024524244A Pending JPWO2023233877A1 (https=) 2022-05-30 2023-04-25

Country Status (3)

Country Link
US (1) US20250074041A1 (https=)
JP (1) JPWO2023233877A1 (https=)
WO (1) WO2023233877A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6539404B1 (ja) * 2018-12-13 2019-07-03 日本メクトロン株式会社 金属層付基板
CN113767149B (zh) * 2019-04-26 2025-02-11 株式会社钟化 低介电树脂组合物、成形品、薄膜、层叠薄膜、以及挠性印刷电路板
JP7518647B2 (ja) * 2020-03-31 2024-07-18 日鉄ケミカル＆マテリアル株式会社 樹脂組成物、その製造方法、樹脂フィルム及び金属張積層板
JP7509560B2 (ja) * 2020-03-31 2024-07-02 日鉄ケミカル＆マテリアル株式会社 樹脂フィルム、金属張積層板及び回路基板
JP2022184736A (ja) * 2021-05-31 2022-12-13 富士フイルム株式会社 配線基板及び配線基板の製造方法
WO2023191011A1 (ja) * 2022-03-31 2023-10-05 富士フイルム株式会社 フィルム、及び、積層体
WO2023233878A1 (ja) * 2022-05-31 2023-12-07 富士フイルム株式会社 フィルム及び積層体

Similar Documents

Publication Publication Date Title
CN101069459B (zh) 多层印刷线路基板及其制造方法
TWI325745B (en) Circuit board structure and fabrication method thereof
CN1239863A (zh) 低热膨胀电路板和多层电路板
CN101112140A (zh) 多层印刷线路基板及其制造方法
US6866739B2 (en) Film with metal foil
JP2019036607A (ja) 回路付きガラス基板含有多層配線板及びその製造方法
CN103140020B (zh) 挠性印刷电路板的覆盖膜、挠性印刷电路板结构及其制法
CN110366330A (zh) 基于高频frcc与高频双面板的fpc多层板及工艺
JPWO2023233877A5 (https=)
KR20220029342A (ko) 복합기판 및 그 제조방법
WO2024060694A1 (zh) 一种芯片封装结构及其制备方法
CN103188868B (zh) 电路板结构
CN113382545A (zh) 一种将abf增层膜片和铜箔压合到内层基板的方法
CN207916233U (zh) 用于软性印刷电路板的压合离型膜
US20250218795A1 (en) Method for manufacturing package substrate
CN220307488U (zh) 具有超薄铜箔层的铜箔基板
CN119815680B (zh) 一种制备无芯封装基板的承载板及其制备方法和应用
CN120376432B (zh) 一种嵌入式多芯片互连桥及其制备方法和应用
TWI873508B (zh) 電子封裝件及其封裝基板與製法
CN223507858U (zh) 一种刚性好的复合手机壳覆膜
TWI236324B (en) Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure
CN112040654B (zh) 柔性基材及其生产方法
TWI727627B (zh) 埋容電路板及其製作方法
CN116079348A (zh) 一种高分子复合铜箔制备方法
CN201341273Y (zh) 一种功能性树脂与金属箔复合物的多层印制线路板