JPWO2023181609A5 - - Google Patents

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Publication number
JPWO2023181609A5
JPWO2023181609A5 JP2024509790A JP2024509790A JPWO2023181609A5 JP WO2023181609 A5 JPWO2023181609 A5 JP WO2023181609A5 JP 2024509790 A JP2024509790 A JP 2024509790A JP 2024509790 A JP2024509790 A JP 2024509790A JP WO2023181609 A5 JPWO2023181609 A5 JP WO2023181609A5
Authority
JP
Japan
Prior art keywords
temporary fixing
composition according
viscosity
component
mpa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024509790A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023181609A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/001548 external-priority patent/WO2023181609A1/ja
Publication of JPWO2023181609A1 publication Critical patent/JPWO2023181609A1/ja
Priority to JP2024118783A priority Critical patent/JP2024133414A/ja
Publication of JPWO2023181609A5 publication Critical patent/JPWO2023181609A5/ja
Priority to JP2025037632A priority patent/JP2025078847A/ja
Pending legal-status Critical Current

Links

JP2024509790A 2022-03-24 2023-01-19 Pending JPWO2023181609A1 (https=)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024118783A JP2024133414A (ja) 2022-03-24 2024-07-24 仮固定用組成物
JP2025037632A JP2025078847A (ja) 2022-03-24 2025-03-10 仮固定用組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022048917 2022-03-24
PCT/JP2023/001548 WO2023181609A1 (ja) 2022-03-24 2023-01-19 仮固定用組成物

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2024118783A Division JP2024133414A (ja) 2022-03-24 2024-07-24 仮固定用組成物
JP2025037632A Division JP2025078847A (ja) 2022-03-24 2025-03-10 仮固定用組成物

Publications (2)

Publication Number Publication Date
JPWO2023181609A1 JPWO2023181609A1 (https=) 2023-09-28
JPWO2023181609A5 true JPWO2023181609A5 (https=) 2024-10-08

Family

ID=88101001

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2024509790A Pending JPWO2023181609A1 (https=) 2022-03-24 2023-01-19
JP2024118783A Pending JP2024133414A (ja) 2022-03-24 2024-07-24 仮固定用組成物
JP2025037632A Pending JP2025078847A (ja) 2022-03-24 2025-03-10 仮固定用組成物

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024118783A Pending JP2024133414A (ja) 2022-03-24 2024-07-24 仮固定用組成物
JP2025037632A Pending JP2025078847A (ja) 2022-03-24 2025-03-10 仮固定用組成物

Country Status (7)

Country Link
US (1) US20250215289A1 (https=)
EP (1) EP4502093A4 (https=)
JP (3) JPWO2023181609A1 (https=)
KR (1) KR20240135848A (https=)
CN (1) CN118786193A (https=)
TW (1) TW202344643A (https=)
WO (1) WO2023181609A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4565804B2 (ja) 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
US8366873B2 (en) 2010-04-15 2013-02-05 Suss Microtec Lithography, Gmbh Debonding equipment and methods for debonding temporary bonded wafers
TW201250873A (en) * 2011-05-11 2012-12-16 Hitachi Chemical Co Ltd Manufacturing method of semiconductor apparatus, manufacturing method of semiconductor wafer with semiconductor device, manufacturing method of semiconductor wafer with adhesive layer and manufacturing method of semiconductor wafer laminate
JP6377956B2 (ja) 2013-05-24 2018-08-22 タツモ株式会社 剥離装置
JP6156443B2 (ja) * 2014-08-13 2017-07-05 Jsr株式会社 積層体および基材の処理方法
JP6742139B2 (ja) * 2015-04-22 2020-08-19 デンカ株式会社 組成物
CN113056533B (zh) * 2018-11-14 2022-10-11 电化株式会社 组合物
WO2021235406A1 (ja) * 2020-05-21 2021-11-25 デンカ株式会社 組成物
WO2022230874A1 (ja) * 2021-04-26 2022-11-03 デンカ株式会社 組成物

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