JPWO2023181609A5 - - Google Patents
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- Publication number
- JPWO2023181609A5 JPWO2023181609A5 JP2024509790A JP2024509790A JPWO2023181609A5 JP WO2023181609 A5 JPWO2023181609 A5 JP WO2023181609A5 JP 2024509790 A JP2024509790 A JP 2024509790A JP 2024509790 A JP2024509790 A JP 2024509790A JP WO2023181609 A5 JPWO2023181609 A5 JP WO2023181609A5
- Authority
- JP
- Japan
- Prior art keywords
- temporary fixing
- composition according
- viscosity
- component
- mpa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024118783A JP2024133414A (ja) | 2022-03-24 | 2024-07-24 | 仮固定用組成物 |
| JP2025037632A JP2025078847A (ja) | 2022-03-24 | 2025-03-10 | 仮固定用組成物 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022048917 | 2022-03-24 | ||
| PCT/JP2023/001548 WO2023181609A1 (ja) | 2022-03-24 | 2023-01-19 | 仮固定用組成物 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024118783A Division JP2024133414A (ja) | 2022-03-24 | 2024-07-24 | 仮固定用組成物 |
| JP2025037632A Division JP2025078847A (ja) | 2022-03-24 | 2025-03-10 | 仮固定用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181609A1 JPWO2023181609A1 (cg-RX-API-DMAC7.html) | 2023-09-28 |
| JPWO2023181609A5 true JPWO2023181609A5 (cg-RX-API-DMAC7.html) | 2024-10-08 |
Family
ID=88101001
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509790A Pending JPWO2023181609A1 (cg-RX-API-DMAC7.html) | 2022-03-24 | 2023-01-19 | |
| JP2024118783A Pending JP2024133414A (ja) | 2022-03-24 | 2024-07-24 | 仮固定用組成物 |
| JP2025037632A Pending JP2025078847A (ja) | 2022-03-24 | 2025-03-10 | 仮固定用組成物 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024118783A Pending JP2024133414A (ja) | 2022-03-24 | 2024-07-24 | 仮固定用組成物 |
| JP2025037632A Pending JP2025078847A (ja) | 2022-03-24 | 2025-03-10 | 仮固定用組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250215289A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4502093A4 (cg-RX-API-DMAC7.html) |
| JP (3) | JPWO2023181609A1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20240135848A (cg-RX-API-DMAC7.html) |
| CN (1) | CN118786193A (cg-RX-API-DMAC7.html) |
| TW (1) | TW202344643A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023181609A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4565804B2 (ja) | 2002-06-03 | 2010-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
| US8366873B2 (en) | 2010-04-15 | 2013-02-05 | Suss Microtec Lithography, Gmbh | Debonding equipment and methods for debonding temporary bonded wafers |
| TW201250873A (en) * | 2011-05-11 | 2012-12-16 | Hitachi Chemical Co Ltd | Manufacturing method of semiconductor apparatus, manufacturing method of semiconductor wafer with semiconductor device, manufacturing method of semiconductor wafer with adhesive layer and manufacturing method of semiconductor wafer laminate |
| JP6377956B2 (ja) | 2013-05-24 | 2018-08-22 | タツモ株式会社 | 剥離装置 |
| JP6156443B2 (ja) * | 2014-08-13 | 2017-07-05 | Jsr株式会社 | 積層体および基材の処理方法 |
| JP6742139B2 (ja) * | 2015-04-22 | 2020-08-19 | デンカ株式会社 | 組成物 |
| JP7470047B2 (ja) * | 2018-11-14 | 2024-04-17 | デンカ株式会社 | 組成物 |
| US12480025B2 (en) * | 2020-05-21 | 2025-11-25 | Denka Company Limited | Composition |
| CN117242146A (zh) * | 2021-04-26 | 2023-12-15 | 电化株式会社 | 组合物 |
-
2023
- 2023-01-19 WO PCT/JP2023/001548 patent/WO2023181609A1/ja not_active Ceased
- 2023-01-19 US US18/850,035 patent/US20250215289A1/en active Pending
- 2023-01-19 EP EP23774210.1A patent/EP4502093A4/en active Pending
- 2023-01-19 JP JP2024509790A patent/JPWO2023181609A1/ja active Pending
- 2023-01-19 CN CN202380024634.8A patent/CN118786193A/zh active Pending
- 2023-01-19 KR KR1020247028091A patent/KR20240135848A/ko active Pending
- 2023-02-20 TW TW112106047A patent/TW202344643A/zh unknown
-
2024
- 2024-07-24 JP JP2024118783A patent/JP2024133414A/ja active Pending
-
2025
- 2025-03-10 JP JP2025037632A patent/JP2025078847A/ja active Pending