JPWO2023181548A5 - - Google Patents
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- Publication number
- JPWO2023181548A5 JPWO2023181548A5 JP2024509764A JP2024509764A JPWO2023181548A5 JP WO2023181548 A5 JPWO2023181548 A5 JP WO2023181548A5 JP 2024509764 A JP2024509764 A JP 2024509764A JP 2024509764 A JP2024509764 A JP 2024509764A JP WO2023181548 A5 JPWO2023181548 A5 JP WO2023181548A5
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- gas
- temperature
- hydrogen fluoride
- flow rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007789 gas Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 4
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000010494 dissociation reaction Methods 0.000 description 3
- 230000005593 dissociations Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022049106 | 2022-03-24 | ||
| PCT/JP2022/047207 WO2023181548A1 (ja) | 2022-03-24 | 2022-12-21 | 会合性ガスを半導体製造装置に供給する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181548A1 JPWO2023181548A1 (https=) | 2023-09-28 |
| JPWO2023181548A5 true JPWO2023181548A5 (https=) | 2024-12-06 |
Family
ID=88100869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509764A Pending JPWO2023181548A1 (https=) | 2022-03-24 | 2022-12-21 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250246448A1 (https=) |
| JP (1) | JPWO2023181548A1 (https=) |
| KR (1) | KR20240168321A (https=) |
| CN (1) | CN118946954A (https=) |
| TW (1) | TW202401541A (https=) |
| WO (1) | WO2023181548A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4195819B2 (ja) | 2003-01-17 | 2008-12-17 | 忠弘 大見 | 弗化水素ガスの流量制御方法及びこれに用いる弗化水素ガス用流量制御装置 |
| JP4364740B2 (ja) * | 2004-07-20 | 2009-11-18 | 国立大学法人東北大学 | クラスター化する流体の流量制御方法及びこれに用いるクラスター化する流体用の流量制御装置 |
| JP4810355B2 (ja) * | 2006-08-24 | 2011-11-09 | 富士通セミコンダクター株式会社 | 処理ガス供給方法、基板処理方法、半導体装置の製造方法、処理ガス供給装置、基板処理装置、および記録媒体 |
| US20100037959A1 (en) * | 2006-11-13 | 2010-02-18 | Takayuki Kamaishi | Method for supplying process gas, system for supplying process gas, and system for processing object to be processed |
| JP4974000B2 (ja) * | 2007-10-01 | 2012-07-11 | 日立金属株式会社 | 質量流量制御装置及び実ガスの質量流量制御方法 |
| JP2020141038A (ja) * | 2019-02-28 | 2020-09-03 | 東京エレクトロン株式会社 | ガス供給方法およびガス供給システム |
-
2022
- 2022-12-21 CN CN202280093980.7A patent/CN118946954A/zh active Pending
- 2022-12-21 JP JP2024509764A patent/JPWO2023181548A1/ja active Pending
- 2022-12-21 US US18/848,571 patent/US20250246448A1/en active Pending
- 2022-12-21 KR KR1020247031152A patent/KR20240168321A/ko active Pending
- 2022-12-21 WO PCT/JP2022/047207 patent/WO2023181548A1/ja not_active Ceased
- 2022-12-27 TW TW111150094A patent/TW202401541A/zh unknown
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