JPWO2023181548A1 - - Google Patents
Info
- Publication number
- JPWO2023181548A1 JPWO2023181548A1 JP2024509764A JP2024509764A JPWO2023181548A1 JP WO2023181548 A1 JPWO2023181548 A1 JP WO2023181548A1 JP 2024509764 A JP2024509764 A JP 2024509764A JP 2024509764 A JP2024509764 A JP 2024509764A JP WO2023181548 A1 JPWO2023181548 A1 JP WO2023181548A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0612—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022049106 | 2022-03-24 | ||
| PCT/JP2022/047207 WO2023181548A1 (ja) | 2022-03-24 | 2022-12-21 | 会合性ガスを半導体製造装置に供給する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181548A1 true JPWO2023181548A1 (https=) | 2023-09-28 |
| JPWO2023181548A5 JPWO2023181548A5 (https=) | 2024-12-06 |
Family
ID=88100869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509764A Pending JPWO2023181548A1 (https=) | 2022-03-24 | 2022-12-21 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250246448A1 (https=) |
| JP (1) | JPWO2023181548A1 (https=) |
| KR (1) | KR20240168321A (https=) |
| CN (1) | CN118946954A (https=) |
| TW (1) | TW202401541A (https=) |
| WO (1) | WO2023181548A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4195819B2 (ja) | 2003-01-17 | 2008-12-17 | 忠弘 大見 | 弗化水素ガスの流量制御方法及びこれに用いる弗化水素ガス用流量制御装置 |
| JP4364740B2 (ja) * | 2004-07-20 | 2009-11-18 | 国立大学法人東北大学 | クラスター化する流体の流量制御方法及びこれに用いるクラスター化する流体用の流量制御装置 |
| JP4810355B2 (ja) * | 2006-08-24 | 2011-11-09 | 富士通セミコンダクター株式会社 | 処理ガス供給方法、基板処理方法、半導体装置の製造方法、処理ガス供給装置、基板処理装置、および記録媒体 |
| US20100037959A1 (en) * | 2006-11-13 | 2010-02-18 | Takayuki Kamaishi | Method for supplying process gas, system for supplying process gas, and system for processing object to be processed |
| JP4974000B2 (ja) * | 2007-10-01 | 2012-07-11 | 日立金属株式会社 | 質量流量制御装置及び実ガスの質量流量制御方法 |
| JP2020141038A (ja) * | 2019-02-28 | 2020-09-03 | 東京エレクトロン株式会社 | ガス供給方法およびガス供給システム |
-
2022
- 2022-12-21 CN CN202280093980.7A patent/CN118946954A/zh active Pending
- 2022-12-21 JP JP2024509764A patent/JPWO2023181548A1/ja active Pending
- 2022-12-21 US US18/848,571 patent/US20250246448A1/en active Pending
- 2022-12-21 KR KR1020247031152A patent/KR20240168321A/ko active Pending
- 2022-12-21 WO PCT/JP2022/047207 patent/WO2023181548A1/ja not_active Ceased
- 2022-12-27 TW TW111150094A patent/TW202401541A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240168321A (ko) | 2024-11-29 |
| WO2023181548A1 (ja) | 2023-09-28 |
| US20250246448A1 (en) | 2025-07-31 |
| TW202401541A (zh) | 2024-01-01 |
| CN118946954A (zh) | 2024-11-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240906 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241001 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241126 |
|
| AA64 | Notification of invalidation of claim of internal priority (with term) |
Free format text: JAPANESE INTERMEDIATE CODE: A241764 Effective date: 20241126 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251128 |