JPWO2023180859A5 - - Google Patents

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Publication number
JPWO2023180859A5
JPWO2023180859A5 JP2024508823A JP2024508823A JPWO2023180859A5 JP WO2023180859 A5 JPWO2023180859 A5 JP WO2023180859A5 JP 2024508823 A JP2024508823 A JP 2024508823A JP 2024508823 A JP2024508823 A JP 2024508823A JP WO2023180859 A5 JPWO2023180859 A5 JP WO2023180859A5
Authority
JP
Japan
Prior art keywords
conductor
insulator
semiconductor device
memory cell
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024508823A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023180859A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2023/052379 external-priority patent/WO2023180859A1/ja
Publication of JPWO2023180859A1 publication Critical patent/JPWO2023180859A1/ja
Publication of JPWO2023180859A5 publication Critical patent/JPWO2023180859A5/ja
Pending legal-status Critical Current

Links

JP2024508823A 2022-03-25 2023-03-13 Pending JPWO2023180859A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022050551 2022-03-25
JP2022050549 2022-03-25
PCT/IB2023/052379 WO2023180859A1 (ja) 2022-03-25 2023-03-13 半導体装置及び半導体装置の作製方法

Publications (2)

Publication Number Publication Date
JPWO2023180859A1 JPWO2023180859A1 (https=) 2023-09-28
JPWO2023180859A5 true JPWO2023180859A5 (https=) 2026-03-19

Family

ID=88100246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024508823A Pending JPWO2023180859A1 (https=) 2022-03-25 2023-03-13

Country Status (5)

Country Link
US (1) US20250212387A1 (https=)
JP (1) JPWO2023180859A1 (https=)
KR (1) KR20240163678A (https=)
TW (1) TW202347622A (https=)
WO (1) WO2023180859A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI889314B (zh) * 2024-04-26 2025-07-01 鴻海精密工業股份有限公司 記憶體裝置與其製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110402497B (zh) * 2017-03-29 2024-08-06 株式会社半导体能源研究所 半导体装置、半导体装置的制造方法
KR20240063206A (ko) * 2017-09-06 2024-05-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2020183277A1 (ja) * 2019-03-12 2020-09-17 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
US20220271167A1 (en) * 2019-07-18 2022-08-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Method For Manufacturing Semiconductor Device
TW202129877A (zh) * 2019-08-30 2021-08-01 日商半導體能源研究所股份有限公司 半導體裝置
CN114424339A (zh) 2019-09-20 2022-04-29 株式会社半导体能源研究所 半导体装置及半导体装置的制造方法

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