JPWO2023136253A1 - - Google Patents

Info

Publication number
JPWO2023136253A1
JPWO2023136253A1 JP2023574042A JP2023574042A JPWO2023136253A1 JP WO2023136253 A1 JPWO2023136253 A1 JP WO2023136253A1 JP 2023574042 A JP2023574042 A JP 2023574042A JP 2023574042 A JP2023574042 A JP 2023574042A JP WO2023136253 A1 JPWO2023136253 A1 JP WO2023136253A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023574042A
Other languages
Japanese (ja)
Other versions
JPWO2023136253A5 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023136253A1 publication Critical patent/JPWO2023136253A1/ja
Publication of JPWO2023136253A5 publication Critical patent/JPWO2023136253A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
JP2023574042A 2022-01-13 2023-01-11 Pending JPWO2023136253A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022003660 2022-01-13
PCT/JP2023/000390 WO2023136253A1 (ja) 2022-01-13 2023-01-11 回路基板の製造方法及びそれに用いる樹脂シート

Publications (2)

Publication Number Publication Date
JPWO2023136253A1 true JPWO2023136253A1 (enExample) 2023-07-20
JPWO2023136253A5 JPWO2023136253A5 (enExample) 2025-05-21

Family

ID=87279096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023574042A Pending JPWO2023136253A1 (enExample) 2022-01-13 2023-01-11

Country Status (6)

Country Link
US (1) US20240371823A1 (enExample)
JP (1) JPWO2023136253A1 (enExample)
KR (1) KR20240136339A (enExample)
CN (1) CN118648099A (enExample)
TW (1) TW202343693A (enExample)
WO (1) WO2023136253A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM632394U (zh) * 2022-06-15 2022-09-21 晶化科技股份有限公司 扇出型電子封裝結構

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221417A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
JP2004221418A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
WO2009113216A1 (ja) * 2008-03-10 2009-09-17 古河電気工業株式会社 電子部品加工用粘着テープ
JP2013128060A (ja) * 2011-12-19 2013-06-27 Nitto Denko Corp 半導体装置の製造方法
US20150031215A1 (en) * 2013-07-29 2015-01-29 3M Innovative Properties Company Apparatus, hybrid laminated body, method and materials for temporary substrate support
JP2015065321A (ja) * 2013-09-25 2015-04-09 日東電工株式会社 半導体装置の製造方法
WO2016063916A1 (ja) * 2014-10-23 2016-04-28 リンテック株式会社 表面保護用シート
JP2018012748A (ja) * 2016-07-19 2018-01-25 日立化成株式会社 半導体再配線層形成用樹脂フィルム、半導体再配線層形成用複合フィルム、それらを用いた半導体装置及び半導体装置の製造方法
JP2018184595A (ja) * 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物
WO2019021672A1 (ja) * 2017-07-26 2019-01-31 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層基板
WO2019026266A1 (ja) * 2017-08-04 2019-02-07 リンテック株式会社 半導体装置の製造方法
JP2019033124A (ja) * 2017-08-04 2019-02-28 リンテック株式会社 半導体装置の製造方法、及び接着積層体
WO2019073763A1 (ja) * 2017-10-10 2019-04-18 味の素株式会社 硬化体及びその製造方法、樹脂シート及び樹脂組成物
JP2019183070A (ja) * 2018-04-16 2019-10-24 味の素株式会社 樹脂組成物
JP2020117671A (ja) * 2019-01-28 2020-08-06 株式会社ダイセル 硬化性フイルム
JP2021027279A (ja) * 2019-08-08 2021-02-22 新光電気工業株式会社 配線基板の製造方法及び積層構造
US20210233852A1 (en) * 2020-01-29 2021-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Package and Method
JP2021187923A (ja) * 2020-05-28 2021-12-13 味の素株式会社 樹脂組成物
JP2022056522A (ja) * 2020-09-30 2022-04-11 フジコピアン株式会社 ウェーハ加工用積層体、それを用いた薄型ウェーハの製造方法及び薄型ウェーハ個片化の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6271105B1 (ja) 2016-03-31 2018-01-31 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置
JP7067140B2 (ja) * 2017-03-29 2022-05-16 味の素株式会社 樹脂組成物

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221417A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
JP2004221418A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
WO2009113216A1 (ja) * 2008-03-10 2009-09-17 古河電気工業株式会社 電子部品加工用粘着テープ
JP2013128060A (ja) * 2011-12-19 2013-06-27 Nitto Denko Corp 半導体装置の製造方法
US20150031215A1 (en) * 2013-07-29 2015-01-29 3M Innovative Properties Company Apparatus, hybrid laminated body, method and materials for temporary substrate support
JP2015065321A (ja) * 2013-09-25 2015-04-09 日東電工株式会社 半導体装置の製造方法
WO2016063916A1 (ja) * 2014-10-23 2016-04-28 リンテック株式会社 表面保護用シート
JP2018012748A (ja) * 2016-07-19 2018-01-25 日立化成株式会社 半導体再配線層形成用樹脂フィルム、半導体再配線層形成用複合フィルム、それらを用いた半導体装置及び半導体装置の製造方法
JP2018184595A (ja) * 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物
WO2019021672A1 (ja) * 2017-07-26 2019-01-31 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層基板
WO2019026266A1 (ja) * 2017-08-04 2019-02-07 リンテック株式会社 半導体装置の製造方法
JP2019033124A (ja) * 2017-08-04 2019-02-28 リンテック株式会社 半導体装置の製造方法、及び接着積層体
WO2019073763A1 (ja) * 2017-10-10 2019-04-18 味の素株式会社 硬化体及びその製造方法、樹脂シート及び樹脂組成物
JP2019183070A (ja) * 2018-04-16 2019-10-24 味の素株式会社 樹脂組成物
JP2020117671A (ja) * 2019-01-28 2020-08-06 株式会社ダイセル 硬化性フイルム
JP2021027279A (ja) * 2019-08-08 2021-02-22 新光電気工業株式会社 配線基板の製造方法及び積層構造
US20210233852A1 (en) * 2020-01-29 2021-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Package and Method
JP2021187923A (ja) * 2020-05-28 2021-12-13 味の素株式会社 樹脂組成物
JP2022056522A (ja) * 2020-09-30 2022-04-11 フジコピアン株式会社 ウェーハ加工用積層体、それを用いた薄型ウェーハの製造方法及び薄型ウェーハ個片化の製造方法

Also Published As

Publication number Publication date
TW202343693A (zh) 2023-11-01
CN118648099A (zh) 2024-09-13
US20240371823A1 (en) 2024-11-07
WO2023136253A1 (ja) 2023-07-20
KR20240136339A (ko) 2024-09-13

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