JPWO2023119601A5 - - Google Patents

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Publication number
JPWO2023119601A5
JPWO2023119601A5 JP2022539446A JP2022539446A JPWO2023119601A5 JP WO2023119601 A5 JPWO2023119601 A5 JP WO2023119601A5 JP 2022539446 A JP2022539446 A JP 2022539446A JP 2022539446 A JP2022539446 A JP 2022539446A JP WO2023119601 A5 JPWO2023119601 A5 JP WO2023119601A5
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JP
Japan
Prior art keywords
flow path
base
high frequency
heating element
frequency electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022539446A
Other languages
English (en)
Japanese (ja)
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JP7391294B2 (ja
JPWO2023119601A1 (https=
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Publication date
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Priority claimed from PCT/JP2021/048052 external-priority patent/WO2023119601A1/ja
Publication of JPWO2023119601A1 publication Critical patent/JPWO2023119601A1/ja
Publication of JPWO2023119601A5 publication Critical patent/JPWO2023119601A5/ja
Application granted granted Critical
Publication of JP7391294B2 publication Critical patent/JP7391294B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022539446A 2021-12-23 2021-12-23 ヒータ Active JP7391294B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/048052 WO2023119601A1 (ja) 2021-12-23 2021-12-23 ヒータ

Publications (3)

Publication Number Publication Date
JPWO2023119601A1 JPWO2023119601A1 (https=) 2023-06-29
JPWO2023119601A5 true JPWO2023119601A5 (https=) 2023-11-21
JP7391294B2 JP7391294B2 (ja) 2023-12-05

Family

ID=86901805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022539446A Active JP7391294B2 (ja) 2021-12-23 2021-12-23 ヒータ

Country Status (4)

Country Link
US (1) US20250116003A1 (https=)
JP (1) JP7391294B2 (https=)
KR (1) KR102810046B1 (https=)
WO (1) WO2023119601A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880262B2 (ja) * 1990-06-29 1999-04-05 キヤノン株式会社 ウエハ保持装置
JP4386606B2 (ja) * 2001-11-08 2009-12-16 日本碍子株式会社 支持装置の製造方法
US20090031955A1 (en) 2007-07-30 2009-02-05 Applied Materials, Inc. Vacuum chucking heater of axisymmetrical and uniform thermal profile
KR102523850B1 (ko) * 2016-07-11 2023-04-21 주식회사 미코세라믹스 척 구조물 및 척 구조물을 갖는 칩 분리 장치
JP6903525B2 (ja) 2017-04-19 2021-07-14 日本特殊陶業株式会社 セラミックス部材
US11049755B2 (en) * 2018-09-14 2021-06-29 Applied Materials, Inc. Semiconductor substrate supports with embedded RF shield
JP7248465B2 (ja) * 2019-03-19 2023-03-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のスピンチャック
JP7629701B2 (ja) * 2020-09-28 2025-02-14 日本特殊陶業株式会社 保持装置

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