JPWO2023106087A5 - - Google Patents

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Publication number
JPWO2023106087A5
JPWO2023106087A5 JP2023566212A JP2023566212A JPWO2023106087A5 JP WO2023106087 A5 JPWO2023106087 A5 JP WO2023106087A5 JP 2023566212 A JP2023566212 A JP 2023566212A JP 2023566212 A JP2023566212 A JP 2023566212A JP WO2023106087 A5 JPWO2023106087 A5 JP WO2023106087A5
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JP
Japan
Prior art keywords
semiconductor device
silicon carbide
layer
region
electric field
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Application number
JP2023566212A
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English (en)
Japanese (ja)
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JP7795215B2 (ja
JPWO2023106087A1 (https=
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Priority claimed from PCT/JP2022/043169 external-priority patent/WO2023106087A1/ja
Publication of JPWO2023106087A1 publication Critical patent/JPWO2023106087A1/ja
Publication of JPWO2023106087A5 publication Critical patent/JPWO2023106087A5/ja
Application granted granted Critical
Publication of JP7795215B2 publication Critical patent/JP7795215B2/ja
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JP2023566212A 2021-12-09 2022-11-22 半導体装置 Active JP7795215B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021199975 2021-12-09
JP2021199975 2021-12-09
PCT/JP2022/043169 WO2023106087A1 (ja) 2021-12-09 2022-11-22 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023106087A1 JPWO2023106087A1 (https=) 2023-06-15
JPWO2023106087A5 true JPWO2023106087A5 (https=) 2024-08-19
JP7795215B2 JP7795215B2 (ja) 2026-01-07

Family

ID=86730322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566212A Active JP7795215B2 (ja) 2021-12-09 2022-11-22 半導体装置

Country Status (6)

Country Link
US (1) US20240332281A1 (https=)
JP (1) JP7795215B2 (https=)
CN (1) CN118369771A (https=)
DE (1) DE112022005863T5 (https=)
TW (1) TW202412116A (https=)
WO (1) WO2023106087A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121531774B (zh) * 2026-01-15 2026-04-28 杭州谱析光晶半导体科技有限公司 一种碳化硅-氮化镓异构集成高压功率器件结构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007226475A (ja) 2006-02-22 2007-09-06 Fuji Electric Retail Systems Co Ltd 硬貨識別装置、硬貨識別方法および硬貨識別プログラム
JP5126733B2 (ja) 2006-09-29 2013-01-23 独立行政法人産業技術総合研究所 電界効果トランジスタ及びその製造方法
JP5319084B2 (ja) 2007-06-19 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置
JP5470705B2 (ja) 2007-12-28 2014-04-16 サンケン電気株式会社 半導体装置及びその製造方法
JP2010010262A (ja) 2008-06-25 2010-01-14 Panasonic Electric Works Co Ltd 半導体装置
JP5524462B2 (ja) 2008-08-06 2014-06-18 シャープ株式会社 半導体装置
DE102009018054B4 (de) 2009-04-21 2018-11-29 Infineon Technologies Austria Ag Lateraler HEMT und Verfahren zur Herstellung eines lateralen HEMT
JP2014036115A (ja) 2012-08-08 2014-02-24 Renesas Electronics Corp 半導体装置
JP6905395B2 (ja) 2017-06-16 2021-07-21 株式会社東芝 半導体装置

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