JPWO2023090317A1 - - Google Patents

Info

Publication number
JPWO2023090317A1
JPWO2023090317A1 JP2023561599A JP2023561599A JPWO2023090317A1 JP WO2023090317 A1 JPWO2023090317 A1 JP WO2023090317A1 JP 2023561599 A JP2023561599 A JP 2023561599A JP 2023561599 A JP2023561599 A JP 2023561599A JP WO2023090317 A1 JPWO2023090317 A1 JP WO2023090317A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023561599A
Other languages
Japanese (ja)
Other versions
JPWO2023090317A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023090317A1 publication Critical patent/JPWO2023090317A1/ja
Publication of JPWO2023090317A5 publication Critical patent/JPWO2023090317A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
JP2023561599A 2021-11-19 2022-11-15 Pending JPWO2023090317A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021188312 2021-11-19
PCT/JP2022/042374 WO2023090317A1 (ja) 2021-11-19 2022-11-15 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2023090317A1 true JPWO2023090317A1 (https=) 2023-05-25
JPWO2023090317A5 JPWO2023090317A5 (https=) 2025-02-10

Family

ID=86397022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023561599A Pending JPWO2023090317A1 (https=) 2021-11-19 2022-11-15

Country Status (6)

Country Link
EP (1) EP4435030A4 (https=)
JP (1) JPWO2023090317A1 (https=)
KR (1) KR20240101857A (https=)
CN (1) CN118176231A (https=)
TW (1) TW202330702A (https=)
WO (1) WO2023090317A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008032704A1 (fr) * 2006-09-12 2008-03-20 Somar Corporation Composition de résine époxy à un composant et moteur ou générateur électrique utilisant celle-ci
JP2012247518A (ja) * 2011-05-26 2012-12-13 Sumitomo Metal Mining Co Ltd 黒色耐熱遮光フィルム、および、それを用いた絞り、シャッター羽根、光量調整モジュール用絞り羽根並びに遮光テープ
WO2013080732A1 (ja) * 2011-11-29 2013-06-06 ナミックス株式会社 一液型エポキシ樹脂組成物
JP2016021033A (ja) * 2014-07-16 2016-02-04 ナミックス株式会社 カメラモジュール用接着剤
CN111675818A (zh) * 2020-06-17 2020-09-18 中山明成光电科技有限公司 一种光学仪器用遮光复合膜及其制备方法
WO2022210261A1 (ja) * 2021-03-30 2022-10-06 ナミックス株式会社 硬化性樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673163B2 (ja) 1986-07-22 1994-09-14 日本ビクター株式会社 映像信号記録装置
JP3934199B2 (ja) 1997-03-31 2007-06-20 ソマール株式会社 反射防止効果をもつカメラ
AU2003275620A1 (en) 2002-10-25 2004-05-13 Asahi Kasei Chemicals Corporation Capsule type hardener and composition
JP3837134B2 (ja) 2004-01-26 2006-10-25 富士化成工業株式会社 一成分系加熱硬化性エポキシド組成物
KR100804293B1 (ko) 2004-03-31 2008-02-18 아사히 가세이 케미칼즈 가부시키가이샤 에폭시 수지용 경화제 및 에폭시 수지 조성물
JP4965715B1 (ja) 2011-02-03 2012-07-04 ナミックス株式会社 エポキシ樹脂組成物およびそれを用いた半導体封止材
JP6071612B2 (ja) 2013-02-14 2017-02-01 ナミックス株式会社 液状樹脂組成物、フリップチップ実装体およびその製造方法
JP7005170B2 (ja) 2016-05-19 2022-01-21 明和化成株式会社 エポキシ樹脂組成物
JP6724264B2 (ja) 2018-03-27 2020-07-15 明和化成株式会社 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物
JP6861975B1 (ja) 2020-05-27 2021-04-21 弘和産業株式会社 テンドンの頭部定着構造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008032704A1 (fr) * 2006-09-12 2008-03-20 Somar Corporation Composition de résine époxy à un composant et moteur ou générateur électrique utilisant celle-ci
JP2012247518A (ja) * 2011-05-26 2012-12-13 Sumitomo Metal Mining Co Ltd 黒色耐熱遮光フィルム、および、それを用いた絞り、シャッター羽根、光量調整モジュール用絞り羽根並びに遮光テープ
WO2013080732A1 (ja) * 2011-11-29 2013-06-06 ナミックス株式会社 一液型エポキシ樹脂組成物
JP2016021033A (ja) * 2014-07-16 2016-02-04 ナミックス株式会社 カメラモジュール用接着剤
CN111675818A (zh) * 2020-06-17 2020-09-18 中山明成光电科技有限公司 一种光学仪器用遮光复合膜及其制备方法
WO2022210261A1 (ja) * 2021-03-30 2022-10-06 ナミックス株式会社 硬化性樹脂組成物

Also Published As

Publication number Publication date
KR20240101857A (ko) 2024-07-02
TW202330702A (zh) 2023-08-01
WO2023090317A1 (ja) 2023-05-25
EP4435030A1 (en) 2024-09-25
EP4435030A4 (en) 2025-11-05
CN118176231A (zh) 2024-06-11

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