KR20240101857A - 경화성 수지 조성물 - Google Patents

경화성 수지 조성물 Download PDF

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Publication number
KR20240101857A
KR20240101857A KR1020247019883A KR20247019883A KR20240101857A KR 20240101857 A KR20240101857 A KR 20240101857A KR 1020247019883 A KR1020247019883 A KR 1020247019883A KR 20247019883 A KR20247019883 A KR 20247019883A KR 20240101857 A KR20240101857 A KR 20240101857A
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KR
South Korea
Prior art keywords
curable resin
resin composition
filler
curing agent
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247019883A
Other languages
English (en)
Korean (ko)
Inventor
리에코 나가타
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20240101857A publication Critical patent/KR20240101857A/ko
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
KR1020247019883A 2021-11-19 2022-11-15 경화성 수지 조성물 Pending KR20240101857A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021188312 2021-11-19
JPJP-P-2021-188312 2021-11-19
PCT/JP2022/042374 WO2023090317A1 (ja) 2021-11-19 2022-11-15 硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
KR20240101857A true KR20240101857A (ko) 2024-07-02

Family

ID=86397022

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247019883A Pending KR20240101857A (ko) 2021-11-19 2022-11-15 경화성 수지 조성물

Country Status (6)

Country Link
EP (1) EP4435030A4 (https=)
JP (1) JPWO2023090317A1 (https=)
KR (1) KR20240101857A (https=)
CN (1) CN118176231A (https=)
TW (1) TW202330702A (https=)
WO (1) WO2023090317A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275964A (ja) 1997-03-31 1998-10-13 Somar Corp フレキシブルプリント基板及びそれを利用したカメラ
JP2012158730A (ja) 2011-02-03 2012-08-23 Namics Corp エポキシ樹脂組成物およびそれを用いた半導体封止材
JP2014156519A (ja) 2013-02-14 2014-08-28 Namics Corp 液状樹脂組成物、フリップチップ実装体およびその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673163B2 (ja) 1986-07-22 1994-09-14 日本ビクター株式会社 映像信号記録装置
AU2003275620A1 (en) 2002-10-25 2004-05-13 Asahi Kasei Chemicals Corporation Capsule type hardener and composition
JP3837134B2 (ja) 2004-01-26 2006-10-25 富士化成工業株式会社 一成分系加熱硬化性エポキシド組成物
KR100804293B1 (ko) 2004-03-31 2008-02-18 아사히 가세이 케미칼즈 가부시키가이샤 에폭시 수지용 경화제 및 에폭시 수지 조성물
CN103539923B (zh) * 2006-09-12 2016-09-07 索马龙株式会社 单组分环氧树脂组合物及使用该组合物的电动机或发电机
JP2012247518A (ja) * 2011-05-26 2012-12-13 Sumitomo Metal Mining Co Ltd 黒色耐熱遮光フィルム、および、それを用いた絞り、シャッター羽根、光量調整モジュール用絞り羽根並びに遮光テープ
WO2013080732A1 (ja) * 2011-11-29 2013-06-06 ナミックス株式会社 一液型エポキシ樹脂組成物
JP6371148B2 (ja) * 2014-07-16 2018-08-08 ナミックス株式会社 カメラモジュール用接着剤
JP7005170B2 (ja) 2016-05-19 2022-01-21 明和化成株式会社 エポキシ樹脂組成物
JP6724264B2 (ja) 2018-03-27 2020-07-15 明和化成株式会社 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物
JP6861975B1 (ja) 2020-05-27 2021-04-21 弘和産業株式会社 テンドンの頭部定着構造
CN111675818A (zh) * 2020-06-17 2020-09-18 中山明成光电科技有限公司 一种光学仪器用遮光复合膜及其制备方法
WO2022210261A1 (ja) * 2021-03-30 2022-10-06 ナミックス株式会社 硬化性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275964A (ja) 1997-03-31 1998-10-13 Somar Corp フレキシブルプリント基板及びそれを利用したカメラ
JP2012158730A (ja) 2011-02-03 2012-08-23 Namics Corp エポキシ樹脂組成物およびそれを用いた半導体封止材
JP2014156519A (ja) 2013-02-14 2014-08-28 Namics Corp 液状樹脂組成物、フリップチップ実装体およびその製造方法

Also Published As

Publication number Publication date
JPWO2023090317A1 (https=) 2023-05-25
TW202330702A (zh) 2023-08-01
WO2023090317A1 (ja) 2023-05-25
EP4435030A1 (en) 2024-09-25
EP4435030A4 (en) 2025-11-05
CN118176231A (zh) 2024-06-11

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PA0105 International application

Patent event date: 20240614

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250528

Comment text: Request for Examination of Application